Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes first semiconductor die, a second semiconductor die and a memory package. The first semiconductor die and the second semiconductor die are stacked on each other. The first semiconductor die includes a first interface and a third interface. The first interface overlaps and is electrically connected to the second interface arranged on the second semiconductor die. The third interface is arranged on a first edge of the first semiconductor die. The memory package is disposed beside the first semiconductor die, wherein the memory package is electrically connected to the first semiconductor die by the third interface.

Abstract: A wireless multi-channel audio system includes a receiving unit, a decoder, a sound channel mixing and processing unit, and a plurality of earphone speakers. The audio system is equipped with a wireless transmitter of low signal delay time and high transmission data rate to send an SPDIF audio signal to an earphone or headphone having multiple speakers in real time and implement the multi-channel surround effect.