Patents by Inventor Chun Pong Lee

Chun Pong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10329660
    Abstract: The present invention provides a transparent conductive thin film which is flexible for suiting substantially all kinds of electronic and optoelectronic devices or display panel. The present conductive thin film includes at least one transparent substrate, a deformable layer and a conductive network pattern having a high aspect ratio such that at least one surface of the conductive network being exposed out of the deformable layer or the transparent substrate for contacting with an external structure while a large proportion thereof stays firmly integrated into the substrate. The present invention also relates to methods of fabricating a transparent conductive thin film including the structural features of the transparent conductive thin film of the present invention. Various optimizations of the present methods are also provided in the present invention for facilitating large area thin film fabrication and large scale production.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: June 25, 2019
    Assignees: MIND TECHNOLOGY DEVELOPMENT LIMITED, NEW ASIA GROUP HOLDINGS LIMITED
    Inventors: Chung Pui Chan, Lai Fan Lai, Wing Hong Choi, Bin Zhang, Kwok Keung Paul Ho, Chien Chung, Chun Pong Lee
  • Publication number: 20180291498
    Abstract: The present invention provides a transparent conductive thin film which is flexible for suiting substantially all kinds of electronic and optoelectronic devices or display panel. The present conductive thin film includes at least one transparent substrate, a deformable layer and a conductive network pattern having a high aspect ratio such that at least one surface of the conductive network being exposed out of the deformable layer or the transparent substrate for contacting with an external structure while a large proportion thereof stays firmly integrated into the substrate. The present invention also relates to methods of fabricating a transparent conductive thin film including the structural features of the transparent conductive thin film of the present invention. Various optimizations of the present methods are also provided in the present invention for facilitating large area thin film fabrication and large scale production.
    Type: Application
    Filed: July 12, 2017
    Publication date: October 11, 2018
    Inventors: Chung Pui Chan, Lai Fan Lai, Wing Hong Choi, Bin Zhang, Kwok Keung Paul Ho, Chien Chung, Chun Pong Lee