Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: An enhancement mode high electron mobility transistor (HEMT) includes a group III-V semiconductor body, a group III-V barrier layer and a gate structure. The group III-V barrier layer is disposed on the group III-V semiconductor body, and the gate structure is a stacked structure disposed on the group III-V barrier layer. The gate structure includes a gate dielectric and a group III-V gate layer disposed on the gate dielectric, and the thickness of the gate dielectric is between 15 nm to 25 nm.

Abstract: An optical fiber transmission device includes a substrate, a photonic integrated circuit, and an optical fiber assembly. The photonic integrated circuit is disposed on an area of the substrate. The substrate has a protruding structure at an interface with an edge of the photonic integrated circuit. The optical fiber assembly includes an optical fiber and a ferrule that sleeves the optical fiber. The protruding structure of the substrate is configured to abut against the ferrule to limit the position of the optical fiber assembly in a vertical direction of the substrate, such that the protruding structure is a stopper for the optical fiber assembly in the vertical direction.

Abstract: An optical fiber network device includes a fiber and a photonic integrated circuit. Fiber receives a first optical signal and transmits a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Photonic integrated circuit includes a laser chip, a photodetector, a wavelength division multiplexing coupler, a first optical modulation element and a second optical modulation element. Laser chip is disposed on photonic integrated circuit, and is configured to generate first optical signal. Photodetector detects second optical signal. Wavelength division multiplexing coupler is configured to couple first optical signal to fiber, and receives second optical signal. First optical modulation element is coupled to wavelength division multiplexing coupler and laser chip, and is configured to modulate first optical signal.

Abstract: A method for fabricating nonenzymatic glucose sensor, which comprises steps of: (a) providing a bottom substrate; (b) preparing a graphene layer on the bottom substrate; (c) depositing plural amount of zinc oxide (ZnO) seed crystals on the graphene layer; (d) growing the ZnO seed crystals into columnar nanorods with hydrothermal method; (e) coating a thin film of cuprous oxide (Cu2O) on the surface of the ZnO nanorods by electrochemistry-based electrodeposition; and (f) grafting single-walled carbon nanotubes (SWCNTs) on surface of the Cu2O thin film, by using Nafion fixative composited with SWCNTs. The structure of the above sensor, therefore, comprises a bottom substrate and other components orderly assembled on it, including, from inside to outside, a graphene layer, plural amount of ZnO nanorods, a Cu2O thin film, plural amount of SWCNTs, and the Nafion fixative. Accordingly, the sensor has advantages of low cost, rapid response, and easy for preservation.

Abstract: A power pedal is provided, including: a shaft, including a first end configured to be assembled to a bicycle crank, a second end and a connection section connected between the first end and the second end, the connection section including a strain sensing module; a pedal body, connected to the second end; a power sensor, including a processing module and a shell member, the processing module being disposed on an outer circumferential wall of the connection section, the processing module including a processing unit and a wireless transmission unit electrically connected to each other, the processing unit being electrically connected to the strain sensing module, the shell member being disposed on the connection section and encompassing the processing module, the shell member including a receiving room, the receiving room being configured to receive a battery which is replaceable and electrically connected to the processing unit.

Abstract: A power pedal is provided, including: a shaft, including a first end configured to be assembled to a bicycle crank, a second end and a connection section connected between the first end and the second end, the connection section including a strain sensing module; a pedal body, connected to the second end; a power sensor, including a processing module and a shell member, the processing module being disposed on an outer circumferential wall of the connection section, the processing module including a processing unit and a wireless transmission unit electrically connected to each other, the processing unit being electrically connected to the strain sensing module, the shell member being disposed on the connection section and encompassing the processing module, the shell member including a receiving room, the receiving room being configured to receive a battery which is replaceable and electrically connected to the processing unit.

Abstract: An anti-slip structure is provided, configured to be protrudingly disposed on a pedal. The anti-slip structure includes two connecting members connected with each other along an axial direction. One of the two connecting members includes an engaging concave portion, and the other of the two connecting members includes an engaging convex portion engaged with the engaging concave portion. A pedal including at least one of the anti-slip structure as described above is further provided, and the pedal further includes a pedal body. The pedal body has at least one through hole, and each said anti-slip structure is disposed through one of the at least one through hole.

Abstract: This invention describes monoclonal antibodies that suppress thyrotropin receptor constitutive activity and methods of using the antibodies to treat thyroid related diseases; particularly hyperthyroidism and thyroid cancer.

Abstract: This invention describes monoclonal antibodies that suppress thyrotropin receptor constitutive activity and methods of using the antibodies to treat thyroid related diseases; particularly hyperthyroidism and thyroid cancer