Patents by Inventor Chun See

Chun See has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070217393
    Abstract: A method of two-way communication between a web browser and a mobile telecommunication device including the steps of; accessing a web-site via a computer, sending a message to a mobile telecommunication device from the web-site, and at a message server capturing information uniquely identifying the computer, assigning an identification number to the information uniquely identifying the computer, storing the identification number and information uniquely identifying the computer in a database, and sending the message to the mobile telecommunication device with the identification number.
    Type: Application
    Filed: July 16, 2004
    Publication date: September 20, 2007
    Applicant: STARHUB LTD
    Inventors: Francis Lee, King Goh, Jiayi Wang, Chun See, Antonius Ng
  • Publication number: 20070152326
    Abstract: The present invention relates to an external stiffener featuring reinforcing bars and a polymer and a method to make the same. In an embodiment, the stiffener may be used to decrease warpage in the package substrate caused by high temperature processing. In an embodiment, the reinforced bars are disposed over the die attach side of the package substrate. In an embodiment, the polymer may encapsulate a semiconductor die coupled to a package substrate.
    Type: Application
    Filed: December 29, 2005
    Publication date: July 5, 2007
    Inventors: Chia Lim, Chun See, Tze Hin
  • Publication number: 20070134937
    Abstract: A method and apparatus for inhibiting the flow of a flowable adhesive material disposed adjacent to a substrate. A chip component is disposed adjacent to a substrate and a plurality of nanoparticles are disposed and cured adjacent to the substrate and proximate to the chip component. The nanoparticles possess surface properties that make them substantially immiscible with a flowable adhesive. The band of nanoparticles will inhibit the flow of a flowable adhesive material disposed between the chip and the nanoparticles, in a direction bounded by the plurality of nanoparticles, while adhesive flow in the direction of the component is promoted.
    Type: Application
    Filed: December 14, 2005
    Publication date: June 14, 2007
    Inventors: Chun See, Szu Lim