Abstract: The present invention discloses an active-hydrogen-containing phosphorus compound for cross-linking a resin and for imparting flame-retardancy to the cured resin, and in particular to a cured frame-retardant epoxy resin prepared by reacting the hardener with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group. The present invention also discloses an epoxy resin made from the active-hydrogen-containing phosphorus compound and epihalohydrin.

Abstract: The present invention discloses an active-hydrogen-containing phosphorus compound for cross-linking a resin and for imparting flame-retardancy to the cured resin, and in particular to a cured frame-retardant epoxy resin prepared by reacting the hardener with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group. The present invention also discloses an epoxy resin made from the active-hydrogen-containing phosphorus compound and epihalohydrin.

Abstract: The present invention discloses an active-hydrogen-containing curing agent having a phosphorus group, and a flame retardant cured epoxy resin which can be prepared via an addition reaction between the active hydrogen and the epoxide group of an epoxy resin. The cured flame retardant epoxy resin is environmentally friendly and is suitable for printed circuit board and semiconductor encapsulation applications.

Abstract: A method for imparting flame retardance to an epoxy resin comprises reacting an epoxy resin with a phosphorus-containing dihydric phenol or naphthol derived from the reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (i.e., DOPO) with a benzoquinone or naphthoquinone.

Abstract: A hardener for an epoxy resin comprises a phenolic, thiophenolic, aminophenyl, tris-phenolic, tris-thiophenolic, tris-aminophenyl, tetrakis-phenolic, tetrakis-thiophenolic, or tetrakis-aminophenyl compounds; or phenol-formaldehyde or phenol-formaldehyde/melamine-formaldehyde resins wherein the phenyl rings are substituted with at least one of the structures wherein R1 and R2 independently are H, C1-C18 alkyl, C6-C18 aryl, C6-C18 substituted aryl, C6-C18 aryl methylene, or C6-C18 substituted aryl methylene; X is O, S or NH and Ar is wherein R is C1-C4 alkyl and n=0-5.

Abstract: The present invention discloses an active-hydrogen-containing phosphorus compound for cross-linking a resin and for imparting flame-retardancy to the cured resin, and in particular to a cured frame-retardant epoxy resin prepared by reacting the hardener with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group. The present invention also discloses an epoxy resin made from the active-hydrogen-containing phosphorus compound and epihalohydrin.

Abstract: Flame-retardant advanced epoxy resins and cured epoxy resins which contain a rigid phosphorus group and thus provide better thermal and flame-retardant properties than the conventional epoxy resins prepared from tetrabromobisphenol A. The advanced epoxy resins are suitable for making a fiber-reinforced epoxy resin composite which is useful in the fabrication of printed circuit boards. The cured epoxy resins can be used in semiconductor encapsulation applications.

Abstract: A flame-retardant epoxy resin was prepared by reacting an active-hydrogen-containing phosphorus compound with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group, is suitable for printed circuit board and semiconductor encapsulation applications.

Abstract: Flame-retardant advanced epoxy resins and cured epoxy resins contain a rigid phosphorus group emanating from a dihydric phenol or naphthol which provides thermal and flame retardant properties. The advanced epoxy resins are suitable for making a fiber-reinforced epoxy resin composite which is useful in the fabrication of printed circuit boards. The cured epoxy resins can be used in semiconductor encapsulation applications.

Abstract: A flame-Retardant advanced epoxy resin was prepared by reacting an active-hydrogen-containing phosphorus compound with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group, which has a high glass transition temperature (Tg), high decomposition temperature and high elastic modulus and thus is suitable for printed circuit board and semiconductor encapsulation applications by curing with a curing agent.

Abstract: The invention relates to a process of producing polybutylene terephthalate by direct esterification and then melt polycondensation, characterized in that a specific catalyst composition is used, said catalyst composition comprising an organotitanium compound as primary catalyst in an amount of 0.01 to 1.0% by weight of terephthalic acid; and an alkaline metal salt of borate, pyroborate or metaborate as secondary catalyst in an amount of 0.001 to 1.0% by weight of terephthalic acid. By using said catalyt composition, amount of THF by-product generated can be reduced more than 30%, and the reaction rate of esterification can be increased over 20%.(FIG.

Abstract: The invention relates to a Bismaleimide-Triazine resin (BT resin ) and production method thereof and in particular, a series of novel BT resin prepared by reacting a novel bismaleimide with various aromatic cyanate esters. By combining said novel bismaleimide monomer with various proportions of cyanate esters having different structures, BT resins having various processing temperature conditions can be formulated, which, after polymerizing and crosslinking, can provide materials with various thermal stability, dielectric constants, and mechanical properties for various applications.

Abstract: A process for producing a polycarbonate including melt polycondensing an aromatic dihydroxy compound and a carbonic acid diester in the presence of a phosphonium borohydride catalyst(I), ##STR1## wherein R is a straight-chain or branched alkyl group, or ##STR2## wherein each of R.sub.1, R.sub.2, and R.sub.3, independently is a C.sub.1 .about.C.sub.4 alkyl group. A colorless, transparent polycarbonate having a high molecular weight is obtained by using the phosphonium borohydride compound (I) as a transesterification catalyst, which may be used alone or incorporated with boric acid or a hindered phenol antioxidant.

Abstract: A modified epoxy resin is prepared by mixing an isocyanate terminated urethane prepolymer with an epoxy resin in reactive conditions. The modified epoxy resin has a low internal stress when it is cured due to the flexible backbone of the urethane prepolymer incorporated therein, and has a high glass transition temperature due to a rigid oxazolidone structure formed via the epoxy ring opening with the isocyanate groups, and thus is useful as an electronic encapsulant.

Abstract: The present invention relates to a random copolyester containing naphthalene ring structure, in particular to a random copolyester containing a first repeating unit which is the same as that of polyalkylene naphthalate, such as polyethylene naphthalate (PEN) and polybutylene naphthalate (PBN), and a second repeating unit which is similar to the first repeating unit except that an aryl ether linkage is incorporated thereto. The present copolyester can be prepared from a dihydroxyethoxy compound and bis(hydroxyalkyl)naphthalate via a direct melt polycondensation in the presence of a metallic catalyst.