Patents by Inventor Chun Shing YIP

Chun Shing YIP has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for aligning probe pins with respect to positions of electronic devices
    Patent number: 10324126
    Abstract: A method for aligning probe pins with respect to positions of electronic devices comprises conducting contact stamping on a first electronic device with the probe pins to form first probe marks on lead pads of the first electronic device, capturing an image of the first electronic device, determining positions of the first probe marks on the first electronic device using the captured image, calculating an offset using the positions of the first probe marks, adjusting relative positions between a subsequent plurality of electronic devices and the probe pins using the offset, and contacting lead pads of the subsequent plurality of electronic devices with the probe pins for testing said electronic devices. The first probe marks are configured to have greater visibility as compared with second probe marks formed when contacting the lead pads of the subsequent plurality of electronic devices with the probe pins, so as to improve the accuracy of the offset calculated.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: June 18, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD.
    Inventors: Yu Sze Cheung, Hon Kam Ng, Chun Shing Yip
  • METHOD AND APPARATUS FOR ALIGNING PROBE PINS WITH RESPECT TO POSITIONS OF ELECTRONIC DEVICES
    Publication number: 20170356958
    Abstract: A method for aligning probe pins with respect to positions of electronic devices comprises conducting contact stamping on a first electronic device with the probe pins to form first probe marks on lead pads of the first electronic device, capturing an image of the first electronic device, determining positions of the first probe marks on the first electronic device using the captured image, calculating an offset using the positions of the first probe marks, adjusting relative positions between a subsequent plurality of electronic devices and the probe pins using the offset, and contacting lead pads of the subsequent plurality of electronic devices with the probe pins for testing said electronic devices. The first probe marks are configured to have greater visibility as compared with second probe marks formed when contacting the lead pads of the subsequent plurality of electronic devices with the probe pins, so as to improve the accuracy of the offset calculated.
    Type: Application
    Filed: June 10, 2016
    Publication date: December 14, 2017
    Inventors: Yu Sze CHEUNG, Hon Kam NG, Chun Shing YIP