Patents by Inventor Chun-Syuan JHUAN

Chun-Syuan JHUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for processing substrate in semiconductor fabrication
    Patent number: 12090527
    Abstract: A method of processing a substrate in semiconductor fabrication is provided. The method includes supplying a mixture from a storage module to a chamber via an inlet conduit. The method further includes detecting the concentration of a substance in the mixture. The method also includes dispensing the mixture over a substrate disposed in the chamber. In addition, the method includes supplying a supply solution including the substance to the chamber via the inlet conduit and dispensing the supply solution over the substrate when the concentration of the substance in the mixture is less than a desired value. The supply solution is supplied to the inlet conduit at a first position that is at a portion of the inlet conduit extending in the chamber.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: September 17, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Chun-Syuan Jhuan, Ming-Jung Chen, Shao-Yen Ku, Tsai-Pao Su
  • METHOD AND SYSTEM FOR PROCESSING SUBSTRATE IN SEMICONDUCTOR FABRICATION
    Publication number: 20200316654
    Abstract: A method of processing a substrate in semiconductor fabrication is provided. The method includes supplying a mixture from a storage module to a chamber via an inlet conduit. The method further includes detecting the concentration of a substance in the mixture. The method also includes dispensing the mixture over a substrate disposed in the chamber. In addition, the method includes supplying a supply solution including the substance to the chamber via the inlet conduit and dispensing the supply solution over the substrate when the concentration of the substance in the mixture is less than a desired value. The supply solution is supplied to the inlet conduit at a first position that is at a portion of the inlet conduit extending in the chamber.
    Type: Application
    Filed: June 23, 2020
    Publication date: October 8, 2020
    Inventors: Chun-Syuan JHUAN, Ming-Jung CHEN, Shao-Yen KU, Tsai-Pao SU
  • Methods for processing substrate in semiconductor fabrication
    Patent number: 10780461
    Abstract: A method of processing a substrate in semiconductor fabrication is provided. The method includes supplying a mixture to a process module. The method further includes detecting the concentration of a substance in the mixture. The method also includes dispensing the mixture over a substrate in the process module. In addition, the method includes supplying a supply solution including the substance to the process module and dispensing the supply solution over the substrate if the concentration of the substance in the mixture is less than a desired value.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: September 22, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Chun-Syuan Jhuan, Ming-Jung Chen, Shao-Yen Ku, Tsai-Pao Su
  • METHOD AND SYSTEM FOR PROCESSING SUBSTRATE IN SEMICONDUCTOR FABRICATION
    Publication number: 20160336200
    Abstract: A method of processing a substrate in semiconductor fabrication is provided. The method includes supplying a mixture to a process module. The method further includes detecting the concentration of a substance in the mixture. The method also includes dispensing the mixture over a substrate in the process module. In addition, the method includes supplying a supply solution including the substance to the process module and dispensing the supply solution over the substrate if the concentration of the substance in the mixture is less than a desired value.
    Type: Application
    Filed: May 29, 2015
    Publication date: November 17, 2016
    Inventors: Chun-Syuan JHUAN, Ming-Jung CHEN, Shao-Yen KU, Tsai-Pao SU