Patents by Inventor Chun T. Wang

Chun T. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preparation process for coextrusion billets with multiple metallic cylindrical layers
    Patent number: 4995548
    Abstract: Coextrusion billets of two or more concentric metallic layers are treated by a hot isostatic pressing process and, then, may be succeeded by heating to an elevated temperature followed by quenching in order to form a diffused bondline between the contiguous touching metal layers, which after extruding and reducing into tubing, is relatively free of bondline defects.
    Type: Grant
    Filed: April 10, 1989
    Date of Patent: February 26, 1991
    Assignee: Teledyne Industries, Inc.
    Inventors: Chun T. Wang, Robert H. Scanlon
  • Process for coextrusion billets with multiple metallic cylindrical layers by hot isostatic pressing and product
    Patent number: 4977034
    Abstract: Coextrusion billets of two or more concentric metallic layers treated by a hot isostatic pressing (HIP) process in order to form a defect-free bondline between the contiguous touching metal layers. The HIP process can also be applied to extruded or further reduced tubes in order to heal bondline defects.
    Type: Grant
    Filed: November 7, 1989
    Date of Patent: December 11, 1990
    Assignee: Teledyne Industries, Inc.
    Inventor: Chun T. Wang