Patents by Inventor Chun Tang Wang

Chun Tang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PASSIVATION LAYER FOR A SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230197550
    Abstract: A semiconductor device includes an ultra-thick metal (UTM) structure. The semiconductor device includes a passivation layer including a first passivation oxide. The first passivation oxide includes an unbias film and a first bias film, where the unbias film is on portions of the UTM structure and on portions of a layer on which the UTM structure is formed, and the first bias film is on the unbias film. The passivation layer includes a second passivation oxide consisting of a second bias film, the second bias film being on the first bias film. The passivation layer includes a third passivation oxide consisting of a third bias film, the third bias film being on the second bias film.
    Type: Application
    Filed: February 24, 2023
    Publication date: June 22, 2023
    Inventors: Li Chun LIU, Chun Tang WANG, Chih Hung WANG, Ching Feng LEE, Yu-Lung YEH
  • Passivation layer for a semiconductor device and method for manufacturing the same
    Patent number: 11594459
    Abstract: A semiconductor device includes an ultra-thick metal (UTM) structure. The semiconductor device includes a passivation layer including a first passivation oxide. The first passivation oxide includes an unbias film and a first bias film, where the unbias film is on portions of the UTM structure and on portions of a layer on which the UTM structure is formed, and the first bias film is on the unbias film. The passivation layer includes a second passivation oxide consisting of a second bias film, the second bias film being on the first bias film. The passivation layer includes a third passivation oxide consisting of a third bias film, the third bias film being on the second bias film.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: February 28, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li Chun Liu, Chun Tang Wang, Chih Hung Wang, Ching Feng Lee, Yu-Lung Yeh