Patents by Inventor Chun-Te Chang
Chun-Te Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11935894Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.Type: GrantFiled: November 4, 2022Date of Patent: March 19, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Fong-yuan Chang, Chun-Chen Chen, Po-Hsiang Huang, Lee-Chung Lu, Chung-Te Lin, Jerry Chang Jui Kao, Sheng-Hsiung Chen, Chin-Chou Liu
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Publication number: 20240077616Abstract: A time-of-flight sensor includes a substrate, a single photon avalanche detection chip, a vertical cavity surface-emitting laser, a first narrowband pass filter glass, and a second narrowband pass filter glass and a resin shell. The single photon avalanche detection chip is attached on the substrate, and the vertical cavity surface-emitting laser is also attached on the substrate. The first narrowband pass filter glass is arranged above the single photon avalanche detection chip, and the second narrowband pass filter glass is arranged above the vertical cavity surface-emitting laser. The resin shell covers the first narrowband pass filter glass and the second narrowband pass filter glass, and an upper surface of the first narrowband pass filter glass and an upper surface of the second narrowband pass filter glass are coplanar with an upper surface of the resin shell.Type: ApplicationFiled: November 13, 2022Publication date: March 7, 2024Inventors: Chun-Te CHANG, Chung Wu LIU
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Patent number: 11594065Abstract: An optical image recognition device and a method for fabricating the same are disclosed. The device includes a flexible printed circuit board, an image sensor, a glue, an optical collimator, a supporting ring, a sealant, and an optical filter. The top of the flexible printed circuit board is provided with a recess, the image sensor is located in the recess, the sidewalls of the image sensor and the recess are separated from each other, and the image sensor is coupled to the flexible printed circuit board through conductive wires. The glue adheres to the flexible printed circuit board and the image sensor and covers the conductive wires. The optical collimator is disposed on the image sensor. The supporting ring, disposed on the flexible printed circuit board, surrounds the glue and the optical collimator. The optical filter, disposed on the sealant, shields the optical collimator and the image sensor.Type: GrantFiled: March 8, 2022Date of Patent: February 28, 2023Assignees: Interface Technology (Chengdu) Co., Ltd., Interface Optoelectronics (Shenzhen) Co., Ltd., General Interface Solution LimitedInventors: Chun Te Chang, Chung Wu Liu, Ming Chiang Yu, Chia Yuan Wu
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Publication number: 20220198821Abstract: An optical image recognition device and a method for fabricating the same are disclosed. The device includes a flexible printed circuit board, an image sensor, a glue, an optical collimator, a supporting ring, a sealant, and an optical filter. The top of the flexible printed circuit board is provided with a recess, the image sensor is located in the recess, the sidewalls of the image sensor and the recess are separated from each other, and the image sensor is coupled to the flexible printed circuit board through conductive wires. The glue adheres to the flexible printed circuit board and the image sensor and covers the conductive wires. The optical collimator is disposed on the image sensor. The supporting ring, disposed on the flexible printed circuit board, surrounds the glue and the optical collimator. The optical filter, disposed on the sealant, shields the optical collimator and the image sensor.Type: ApplicationFiled: March 8, 2022Publication date: June 23, 2022Inventors: CHUN TE CHANG, CHUNG WU LIU, MING CHIANG YU, CHIA YUAN WU
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Patent number: 11308728Abstract: An optical image recognition device and a method for fabricating the same are disclosed. The device includes a flexible printed circuit board, an image sensor, a glue, an optical collimator, a supporting ring, a sealant, and an optical filter. The top of the flexible printed circuit board is provided with a recess, the image sensor is located in the recess, the sidewalls of the image sensor and the recess are separated from each other, and the image sensor is coupled to the flexible printed circuit board through conductive wires. The glue adheres to the flexible printed circuit board and the image sensor and covers the conductive wires. The optical collimator is disposed on the image sensor. The supporting ring, disposed on the flexible printed circuit board, surrounds the glue and the optical collimator. The optical filter, disposed on the sealant, shields the optical collimator and the image sensor.Type: GrantFiled: February 14, 2020Date of Patent: April 19, 2022Assignees: Interface Technology (Chengdu) Co., Ltd., Interface Optoelectronics (Shenzhen) Co., Ltd., General Interface Solution LimitedInventors: Chun-Te Chang, Chung-Wu Liu, Ming Chang Yu, Chia Yuan Wu
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Publication number: 20210124894Abstract: An optical image recognition device and a method for fabricating the same are disclosed. The device includes a flexible printed circuit board, an image sensor, a glue, an optical collimator, a supporting ring, a sealant, and an optical filter. The top of the flexible printed circuit board is provided with a recess, the image sensor is located in the recess, the sidewalls of the image sensor and the recess are separated from each other, and the image sensor is coupled to the flexible printed circuit board through conductive wires. The glue adheres to the flexible printed circuit board and the image sensor and covers the conductive wires. The optical collimator is disposed on the image sensor. The supporting ring, disposed on the flexible printed circuit board, surrounds the glue and the optical collimator. The optical filter, disposed on the sealant, shields the optical collimator and the image sensor.Type: ApplicationFiled: February 14, 2020Publication date: April 29, 2021Inventors: CHUN-TE CHANG, CHUNG-WU LIU, MING CHANG YU, CHIA YUAN WU
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Patent number: 10803278Abstract: Panel structure includes a substrate, a piezoelectric material layer and a thin film transistor. The piezoelectric material layer is disposed under the substrate, in which the piezoelectric material layer is configured to generate human recognizable sound waves by vibrating at a human audible frequency in a first time interval, and the piezoelectric material layer is configured to generate ultrasonic waves by vibrating at an ultrasonic frequency in a second time interval. The piezoelectric material layer is used for recognizing human fingerprints when it vibrates at the ultrasonic frequency. The thin film transistor is positioned under and electrically connected to the piezoelectric material layer.Type: GrantFiled: August 2, 2018Date of Patent: October 13, 2020Assignee: RECO TECHNOLOGY (CHENGDU) CO., LTD.Inventors: Yu-Pi Kuo, Chung-Wu Liu, Chun-Te Chang, Sin-Cheng Lin, Wan-Heng Lin, Shih-Chieh Huang
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Patent number: 10788912Abstract: A touch display module utilizing touch recognition by ultrasound includes display unit on substrate, barrier layer on other side of the substrate, and an ultrasound fingerprint sensing unit on the barrier layer. An acoustic impedance of the display unit, the barrier layer, and the ultrasonic fingerprint sensing unit are not all the same, and the differences in impedances enable recognition of touches by analysis of reflected ultrasound. The disclosure also provides an electronic device using the touch display module.Type: GrantFiled: December 11, 2018Date of Patent: September 29, 2020Assignee: Reco Technology (Chengdu) Co., Ltd.Inventors: Yu-Pi Kuo, Sin-Cheng Lin, Chung-Wu Liu, Chun-Te Chang, Wan-Heng Lin
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Publication number: 20200050307Abstract: A touch display module utilizing touch recognition by ultrasound includes display unit on substrate, barrier layer on other side of the substrate, and an ultrasound fingerprint sensing unit on the barrier layer. An acoustic impedance of the display unit, the barrier layer, and the ultrasonic fingerprint sensing unit are not all the same, and the differences in impedances enable recognition of touches by analysis of reflected ultrasound. The disclosure also provides an electronic device using the touch display module.Type: ApplicationFiled: December 11, 2018Publication date: February 13, 2020Inventors: YU-PI KUO, SIN-CHENG LIN, CHUNG-WU LIU, CHUN-TE CHANG, WAN-HENG LIN
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Publication number: 20190370519Abstract: Panel structure includes a substrate, a piezoelectric material layer and a thin film transistor. The piezoelectric material layer is disposed under the substrate, in which the piezoelectric material layer is configured to generate human recognizable sound waves by vibrating at a human audible frequency in a first time interval, and the piezoelectric material layer is configured to generate ultrasonic waves by vibrating at an ultrasonic frequency in a second time interval. The piezoelectric material layer is used for recognizing human fingerprints when it vibrates at the ultrasonic frequency. The thin film transistor is positioned under and electrically connected to the piezoelectric material layer.Type: ApplicationFiled: August 2, 2018Publication date: December 5, 2019Inventors: Yu-Pi KUO, Chung-Wu LIU, Chun-Te CHANG, Sin-Cheng LIN, Wan-Heng LIN, Shih-Chieh HUANG
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Patent number: 9898643Abstract: The present disclosure provides a fingerprint identification device including a substrate, a contact layer, a processing unit, and a plurality of sensor electrodes. The substrate includes a first sub-substrate, a second sub-substrate, and an adhesive layer. The adhesive layer is between the first sub-substrate and the second sub-substrate. A plurality of first sub-holes is defined in the first sub-substrate. A plurality of second sub-holes is defined in the second sub-substrate. A plurality of third sub-holes is defined in the adhesive layer. One of the first sub-holes communicates a corresponding one of the third sub-holes and a corresponding one of the second sub-holes to define a corresponding hole. An end of each of the sensor electrodes is coupled to the processing unit. The other end of each of the sensor electrodes passes through one of the holes, extends to the contact layer, and is covered by the contact layer.Type: GrantFiled: December 7, 2015Date of Patent: February 20, 2018Assignees: INTERFACE OPTOELECTRONIC (SHENZHEN) CO., LTD., GENERAL INTERFACE SOLUTION LIMITEDInventors: Chun-Te Chang, Yu-Pi Kuo, Chung-Wu Liu, Chia-Chun Tai, Wei-Chung Chuang, Yen-Heng Huang
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Patent number: 9892304Abstract: A fingerprint identification device includes a fingerprint identification controller and a fingerprint identification sensor. The fingerprint identification sensor includes a substrate having a top surface, a bottom surface opposite to the top surface, and a side surface coupled between the top surface and the bottom surface. Sensor electrodes are arranged on the top surface, electrical leads couple the sensor electrodes and the fingerprint identification controller. The coupling leads extend from the top surface along the side surface to the bottom surface.Type: GrantFiled: October 22, 2015Date of Patent: February 13, 2018Assignees: INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD., GENERAL INTERFACE SOLUTION LIMITEDInventors: Chun-Te Chang, Chia-Chun Tai, Wei-Chung Chuang, Yen-Heng Huang
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Publication number: 20170129805Abstract: An enhanced blind cover and a method for fabricating the same is disclosed. Firstly, a cover having at least one blind hole is provided. Then, liquidized protection glue is formed on an inner sidewall and an inner bottom surface of the blind hole. Finally, the liquidized protection glue is solidified to form solidified protection glue.Type: ApplicationFiled: January 5, 2016Publication date: May 11, 2017Inventors: CHUNG-WU LIU, CHUN-TE CHANG
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Publication number: 20170062102Abstract: The present disclosure provides a method for manufacturing a blind hole of an insulating substrate for an electronic device. The method includes following steps. A patterned photoresist layer is formed over the insulating substrate. The patterned photoresist layer has an opening exposing a portion of the insulating substrate. A wet etching process is performed to remove the exposed insulating substrate to form a blind hole in the opening.Type: ApplicationFiled: December 17, 2015Publication date: March 2, 2017Inventors: Chun-Te CHANG, Yu-Pi KUO, Chung-Wu LIU, Wei-Chung CHUANG
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Publication number: 20160283776Abstract: A fingerprint identification device includes a fingerprint identification controller and a fingerprint identification sensor. The fingerprint identification sensor includes a substrate having a top surface, a bottom surface opposite to the top surface, and a side surface coupled between the top surface and the bottom surface. Sensor electrodes are arranged on the top surface, electrical leads couple the sensor electrodes and the fingerprint identification controller. The coupling leads extend from the top surface along the side surface to the bottom surface.Type: ApplicationFiled: October 22, 2015Publication date: September 29, 2016Inventors: CHUN-TE CHANG, CHIA-CHUN TAI, WEI-CHUNG CHUANG, YEN-HENG HUANG
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Publication number: 20160224821Abstract: The present disclosure provides a fingerprint identification device including a substrate, a contact layer, a processing unit, and a plurality of sensor electrodes. The substrate includes a first sub-substrate, a second sub-substrate, and an adhesive layer. The adhesive layer is between the first sub-substrate and the second sub-substrate. A plurality of first sub-holes is defined in the first sub-substrate. A plurality of second sub-holes is defined in the second sub-substrate. A plurality of third sub-holes is defined in the adhesive layer. One of the first sub-holes communicates a corresponding one of the third sub-holes and a corresponding one of the second sub-holes to define a corresponding hole. An end of each of the sensor electrodes is coupled to the processing unit. The other end of each of the sensor electrodes passes through one of the holes, extends to the contact layer, and is covered by the contact layer.Type: ApplicationFiled: December 7, 2015Publication date: August 4, 2016Inventors: CHUN-TE CHANG, YU-PI KUO, CHUNG-WU LIU, CHIA-CHUN TAI, WEI-CHUNG CHUANG, YEN-HENG HUANG
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Publication number: 20150099382Abstract: A multiple-in-one interface connector includes a shielding casing, an insulation body received in the shielding casing, a micro card receiving zone formed on a surface of the insulation body and a micro USB connection zone, a card ejection bar movably arranged at one side of the insulation body, and a card ejector rotatably mounted to the insulation body and operatively coupled to the card ejection bar. The insulation body includes a micro card receiving port and a micro USB connection port respectively in the micro card receiving zone and the micro USB connection zone. A micro card and a micro USB male connector can be respectively inserted to the micro card receiving zone and the micro USB connection port. To eject the micro card, the card ejection bar is pushed to move the card ejector so as to eject the micro card out of the micro card receiving zone.Type: ApplicationFiled: October 7, 2013Publication date: April 9, 2015Applicant: KUANG YING COMPUTER EQUIPMENT CO., LTD.Inventors: CHUN-TE CHANG, HSUAN-HO CHUNG, YU-HUNG LIN, YI-HUNG YU
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Publication number: 20150091380Abstract: A power conversion device with multiple interfaces generally includes at least one multiple-in-one connector, at least one circuit board, and a power supply module. The multiple-in-one connector and the power supply module are electrically connected to the circuit board. The power supply module satisfies the standard of an electric main socket or an automobile socket. Further, the multiple-in-one connector can be of a multiple-in-one connector that has a single plugging port and includes a USB interface combined with a card type interface or a signal connector interface or alternatively simultaneously combined with a battery module, a storage module, and a wireless transmission module to achieve an advantage of having multiple interfaces.Type: ApplicationFiled: September 27, 2013Publication date: April 2, 2015Applicant: KUANG YING COMPUTER EQUIPMENT CO., LTD.Inventors: CHUN-TE CHANG, HSUAN-HO CHUNG, YU-HUNG LIN, YI-HUNG YU
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Publication number: 20150087185Abstract: An accessory connector generally includes a plurality of metal conductive terminals, which is arranged not to contact each other so as to form individual pins; a first insertion port, which is formed at one end of the accessory connector; and a second insertion port, which is formed at an opposite end of the accessory connector and is in electrical connection with the first insertion port. The first and second insertion ports can be respectively in a plug form or a socket form. When it is desired to make a conversion into a different type of insertion port, the conversion can be achieved through electrical connection of the first insertion port to the second insertion port via the metal conductive terminals so as to achieve the purpose of conversion of connector.Type: ApplicationFiled: September 24, 2013Publication date: March 26, 2015Applicant: KUANG YING COMPUTER EQUIPMENT CO., LTD.Inventors: CHUN-TE CHANG, HSUAN-HO CHUNG, YU-HUNG LIN, YI-HUNG YU
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Publication number: 20120013840Abstract: A display apparatus includes a display panel and a conductive adhesive. The display panel has a plurality of conductive lines and a dielectric layer covering the conductive lines. At least one of the conductive lines has an open defect. The dielectric layer has at least three repair vias, and locations of the repair vias correspond to the open defect. The conductive line having the open defect is exposed by at least parts of the repair vias. The conductive adhesive is disposed corresponding to a location of the open defect and electrically connected to the conductive line having the open defect through the repair vias. A repair method adapted to the display apparatus is also provided.Type: ApplicationFiled: November 10, 2010Publication date: January 19, 2012Applicant: AU OPTRONICS CORPORATIONInventors: Chun-Te Chang, Po-Fu Huang, Chih-Huang Chen