Abstract: A fabricating method for a light emitting diode, includes: providing a bonding substrate; providing an epitaxial structure having an epitaxial substrate and an epitaxial layer, in which the epitaxial layer has a first surface and a second surface opposite to each other, and the epitaxial substrate and the epitaxial layer are combined at the first surface; forming at least one gas discharge channel in the periphery of each single die structure on the epitaxial layer; applying an adhesive on the second surface of the epitaxial layer and the bonding substrate; vaporizing volatile organic gases in the adhesive, and bonding the epitaxial structure and the bonding substrate; removing the epitaxial substrate to expose the first surface of the epitaxial layer; forming electrodes on the exposed first surface of the epitaxial layer; and forming a plurality of light emitting diode dies through cutting along the periphery of each single die structure.

Abstract: A metal-organic chemical vapor deposition (MOCVD) apparatus is described. The MOCVD apparatus includes a reaction chamber, a rotation stand, a wafer susceptor, a heater and a shower head. The reaction chamber includes an opening. The rotation stand is disposed within the reaction chamber. The wafer susceptor is disposed on the rotation stand, and the wafer susceptor rotates by rotating of the rotation stand. The wafer susceptor includes a plurality of wafer pockets of at least two different diameters disposed on a surface of the wafer susceptor and the wafer pockets are suitable to correspondingly carry a plurality of wafers. The heater is disposed under the wafer susceptor and within the rotation stand. The shower head covers the opening of the reaction chamber and applies a gaseous precursor toward the surface of the wafer susceptor.

Abstract: A metal-organic chemical vapor deposition (MOCVD) apparatus is described. The MOCVD apparatus includes a reaction chamber, a rotation stand, a wafer susceptor, a heater and a shower head. The reaction chamber includes an opening. The rotation stand is disposed within the reaction chamber. The wafer susceptor is disposed on the rotation stand, and the wafer susceptor can rotate by the driving of the rotation stand. The wafer susceptor includes a plurality of polygon-shaped wafer pockets disposed on a surface of the wafer susceptor, and the polygon-shaped wafer pockets are suitable to correspondingly accommodate a plurality of wafers. The heater is disposed under the wafer susceptor and within the rotation stand. The shower head covers the opening of the reaction chamber and introduces a gaseous precursor toward the surface of the wafer susceptor.

Abstract: An adaptive power converter controller coupled to a load and a power converter circuit is provided. The adaptive power converter controller has an adaptive voltage sensing unit and a converting control circuit. The adaptive voltage sensing unit is coupled to the load and output a voltage sensing signal according to a load current and a load voltage from the load. The converting control circuit is utilized for receiving the voltage sensing signal and comparing the voltage level of the voltage sensing signal with a current sensing signal, which is corresponding solely to the load current, so as to decide whether the power converter circuit is controlled according to the voltage sensing signal or the current sensing signal.

Abstract: A power control circuit with wire compensation is provided. The power control circuit is applied in a power converter, which has an output coupled to a load through a power wire. The power control circuit has an adaptive sensing circuit and a controller. The adaptive sensing circuit is utilized for detecting an output voltage of the power converter and a current on the power wire and generating a feedback signal according to the output voltage and the current on the power wire. The controller is utilized for adjusting a level of the output voltage according to the feedback signal.

Abstract: An adaptive power converter controller coupled to a load and a power converter circuit is provided. The adaptive power converter controller has an adaptive voltage sensing unit and a converting control circuit. The adaptive voltage sensing unit is coupled to the load and output a voltage sensing signal according to a load current and a load voltage from the load. The converting control circuit is utilized for receiving the voltage sensing signal and comparing the voltage level of the voltage sensing signal with a current sensing signal, which is corresponding solely to the load current, so as to decide whether the power converter circuit is controlled according to the voltage sensing signal or the current sensing signal.

Abstract: An adaptive power converter controller coupled to a load and a power converter circuit is provided. The adaptive power converter controller has an adaptive voltage sensing unit and a converting control circuit. The adaptive voltage sensing unit is coupled to the load and output a voltage sensing signal according to a load current and a load voltage from the load. The converting control circuit is utilized for receiving the voltage sensing signal and comparing the voltage level of the voltage sensing signal with a current sensing signal, which is corresponding solely to the load current, so as to decide whether the power converter circuit is controlled according to the voltage sensing signal or the current sensing signal.