Abstract: A two-phase immersion-type heat dissipation structure having fins for facilitating bubble generation is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, and a plurality of fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other, the non-fin surface is configured to be in contact with a heat source immersed in a two-phase coolant, and the fin surface is connected with the plurality of fins. More than half of the fins are functional fins, and at least one side surface of each of the functional fins and the fin surface have an included angle therebetween that is from 80 degrees to 100 degrees. A center line average roughness (Ra) of the side surface is less than 3 ?m, and a ten-point average roughness (Rz) of the side surface is not less than 12 ?m.

Abstract: A two-phase immersion-cooling heat-dissipation composite structure is provided. The heat-dissipation composite structure includes a heat dissipation base, a plurality of high-thermal-conductivity fins, and at least one high-porosity solid structure. The heat dissipation base has a first surface and a second surface that face away from each other. The second surface of the heat dissipation base is in contact with a heating element immersed in a two-phase coolant. The first surface of the heat dissipation base is connected to the high-thermal-conductivity fins. The at least one high-porosity solid structure is located at the first surface of the heat dissipation base, and is connected and alternately arranged between side walls of two adjacent ones of the high-thermal-conductivity fins. Each of the high-porosity solid structure includes a plurality of closed holes and a plurality of open holes.

Abstract: A two-phase immersion-type heat dissipation structure having acute-angle notched structures is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, and a plurality of fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other, the non-fin surface is configured to be in contact with a heat source immersed in a two-phase coolant, and the fin surface is connected with the fins. More than half of the fins are functional fins, and at least one side surface of each of the functional fins has first and second surfaces defined thereon and connected to each other. An angle between the first surface and the fin surface is from 80 degrees to 100 degrees, and an angle between the second surface and the fin surface is less than 75 degrees.

Abstract: A two-phase immersion-type heat dissipation structure is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate and a plurality of non-vertical fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other. The non-fin surface is configured to be in contact with a heating element immersed in a two-phase coolant. The fin surface is connected with the non-vertical fins, a cross-sectional contour of one of the non-vertical fins has a top end point and a bottom end point connected with the fin surface, and the top and bottom end points are opposite to each other. A length of a cross-sectional contour line defined from the top end point to the bottom end point is greater than a perpendicular line length of a perpendicular line defined from the top end point to the fin surface.

Abstract: A two-phase immersion-type heat dissipation structure having skived fin with high porosity is provided. The two-phase immersion-type heat dissipation structure having skived fin with high porosity includes a porous heat dissipation structure having a total porosity that is equal to or greater than 5%. The porous heat dissipation structure includes a porous substrate and a plurality of porous and skived fins. The porous substrate has a first surface and a second surface that face away from each other. The second surface of the porous substrate is configured to be in contact with a heating element that is immersed in a two-phase coolant. The plurality of porous and skived fins are integrally formed on the first surface of the porous substrate by skiving. A first porosity of the plurality of porous and skived fins is greater than a second porosity of the porous substrate.

Abstract: A two-phase immersion-type heat dissipation structure having a porous structure is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, a plurality of fins, and a reinforcement frame. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other, the non-fin surface is configured to be in contact with a heat source immersed in a two-phase coolant, and the fins are integrally formed on the fin surface. A porous structure is covered onto at least one portion of the fin surface and at least one portion of the plurality of fins, and has a porosity of from 10% to 50% and a thickness that is from 0.1 mm to 1 mm. The reinforcement frame is bonded to the heat dissipation substrate and surrounds another one portion of the plurality of fins.

Abstract: A heat dissipation structure having a heat pipe is provided. The heat dissipation structure includes a heat dissipation base, a plurality of fins, at least one heat pipe, and at least a first heat dissipation contact material and a second heat dissipation contact material that are different from one another. The heat dissipation base has a first and a second heat dissipation surface opposite to each other. The second heat dissipation surface is connected to the fins. At least one recessed trough is concavely formed on the first heat dissipation surface. The at least one heat pipe is located in the at least one recessed trough. The first and the second heat dissipation contact material are filled in the at least one recessed trough. A melting point of the second heat dissipation contact material is smaller than a melting point of the first heat dissipation contact material.

Abstract: An immersion-type heat dissipation structure having high density heat dissipation fins is provided, which includes a heat dissipation substrate and the plurality of sheet-like heat dissipation fins. A thickness of the heat dissipation substrate is from 2 mm to 6 mm, and a bottom surface of the heat dissipation substrate contacts a heating element immersed in a two-phase coolant. The sheet-like heat dissipation fins are integrally formed on an upper surface of the heat dissipation substrate and arranged in high density. A length, a width, and a height of at least one of the sheet-like heat dissipation fins are from 60 mm to 120 mm, from 0.1 mm to 0.5 mm, and from 3 mm to 10 mm, respectively. Further, a distance between at least two of the sheet-like heat dissipation fins that are arranged in parallel to each other is from 0.1 mm to 0.5 mm.

Abstract: A two-phase immersion-type heat dissipation structure having high density heat dissipation fins is provided. The two-phase immersion-type heat dissipation structure having high density heat dissipation fins includes a heat dissipation substrate, a plurality of sheet-like heat dissipation fins, and a reinforcement structure. A bottom surface of the heat dissipation substrate is in contact with a heating element immersed in a two-phase coolant. The plurality of sheet-like heat dissipation fins are integrally formed on an upper surface of the heat dissipation substrate and arranged in high density. An angle between at least one of the sheet-like heat dissipation fins and the upper surface of the heat dissipation substrate is from 60° to 120°. At least one of the sheet-like heat dissipation fins has a length from 50 mm to 120 mm, a width from 0.1 mm to 0.35 mm, and a height from 2 mm to 8 mm.

Abstract: A display device electrically connectable to an external operation device and a host is provided. The display device includes an imaging unit, a display controller, an image receiving port, a command output port and at least one computing device. The image receiving port obtains image data from the host and transmit to the display controller. The display controller controls the imaging unit to display the image data. The at least one computing device has a host operation mode and a display operation mode. The computing device receives a control command from the external operation device, sends the control command to the host through the command output port in the host operation mode, and sends the control command to the display controller to adjust the display setting in the display operation mode.

Abstract: An alarm system is applied for a computer to warn an owner of an electronic device via a terminal when the electronic device is detached from the computer. The alarm system includes a memory unit and a main controller connected the memory unit. The main unit controller includes a recording unit, a determining unit, and an information obtaining transmitting unit. The recording unit is used to log the electronic device detachably connected to the computer. The determining unit is used to determine whether the electronic device detachably connected to the computer is detached from the computer. The information obtaining transmitting unit is used to read the alarm information from the memory unit when the electronic device is detached from the computer, and transmit the alarm information to the owner' terminal.

Abstract: The present invention is an electronic device having a first device and a second device for reducing power consumption of a computer motherboard. When the computer motherboard is at an S4 or S5 state of an ACPI, the electronic device makes the computer motherboard enter like G3 mechanical off state of the ACPI. The second device determines that when the S4 or S5 state happens makes the first device to cut off a portion of electric components, for example the SIO chip and Southbridge chip, consuming stand-by power, and only supply the stand-by power to the electronic device itself. After the user pressed the power button, the second device will control the first device to connect the stand-by power to the computer motherboard.

Abstract: A computer motherboard has a newly added DS3W mode, which is capable of reducing power consumption of the computer motherboard in Suspend. With a power-saving control device and a power switch device that are newly added to the computer motherboard, power supply to a main memory, the power-saving control device, and the power switch device is maintained continuously, while all the other elements of the computer motherboard may be powered off, but the computer motherboard still has the capability of waking up and resuming from a conventional sleep S3 state, so as to save more power. When a user presses a power button, the power-saving control device and the power switch device resume power supply to the elements that are previously powered off.

Abstract: A computer system includes a north bridge chipset, a south bridge chipset, a memory, and a rapid startup apparatus. The rapid startup apparatus includes a DRAM module to install application programs or operation system programs, a battery, a control chip to control data reading and writing for the DRAM module, a PCI-E interface, and a switch circuit. The application programs or the operation system programs are loaded into the memory via the PCI-E interface, the south bridge chipset, and the north bridge chipset in series. The switch circuit processes voltage of the battery or the PCI-E interface and supply power to the DRAM module.

Abstract: An electronic device for reducing power consumption of a computer motherboard is disclosed. The electronic device enables the computer motherboard to compel interruption of power supply to a south bridge chip and a super input output (SIO) chip of the computer motherboard so as to save power while the computer motherboard is waiting for receipt of a Wake-on-LAN packet. A network chip of the computer motherboard sends a signal to the power-saving electronic device as soon as a Wake-on-LAN event occurs, such that a standby power is electrically connected to the south bridge chip and the SIO chip by the electronic device. The computer motherboard equipped with the electronic device is capable of executing Wake-on-LAN function while compelling interruption of power supply to the south bridge chip and the SIO chip in a power-saving state.

Abstract: An alarm system is applied for a computer to warn an owner of an electronic device via a terminal when the electronic device is detached from the computer. The alarm system includes a memory unit and a main controller connected the memory unit. The main unit controller includes a recording unit, a determining unit, and an information obtaining transmitting unit. The recording unit is used to log the electronic device detachably connected to the computer. The determining unit is used to determine whether the electronic device detachably connected to the computer is detached from the computer. The information obtaining transmitting unit is used to read the alarm information from the memory unit when the electronic device is detached from the computer, and transmit the alarm information to the owner’ terminal.

Abstract: The present invention discloses an electronic device for reducing power consumption during power off of computer motherboard. When the computer motherboard is at S5 soft off state of ACPI, it will make the computer motherboard enter like G3 mechanical off state of ACPI. The electronic device will cut off a portion of electric components consuming stand-by power on the computer motherboard, and only supply the stand-by power to the electronic device itself. Only after the user pressed the power button, the electronic device will connect the stand-by power to the computer motherboard.

Abstract: A method for testing an accuracy of a real time clock is provided. The method includes: applying parameters that comprise a predetermined repetition count on testing the RTC, a predetermined time period, and an acceptable error margin of the RTC; communicating with a local network time protocol (NTP) server for acquiring a system time of the local NTP server; applying a current time of the RTC according to the system time at the beginning of testing the accuracy of the RTC; acquiring the current system time of the local NTP server when the predetermined time period lapse; computing a time difference between the system time of the local NTP server and the current time of the RTC; and determining if the RTC is accurate or not by comparing the time difference and the acceptable error margin, and generating a testing result according to the determination.

Abstract: A PCI Express interface card includes at least two different sized PCI Express connecting interfaces (40), at least two PCI Express buses (50) corresponding to the at least two PCI Express connecting interfaces, a controlling module (10), a switching module (20), and an indicating module (30). The at least two PCI Express connecting interfaces are used to connect with at least two corresponding PCI Express slots on a motherboard (60) to be tested. The controlling module is connected to the at least two PCI Express connecting interfaces via the at least two corresponding PCI Express buses, and communicates with the at least two PCI Express connecting interfaces. The switching module switches the controlling module to corresponding modes according to which of the PCI Express slots is connected with a corresponding PCI Express connecting interface. The indicating module is electrically connected with the controlling module, and indicates whether a test is passed.

Abstract: A system for testing a NAS includes: a data storage device (3) connected with a NAS (6) for storing function test program and test data; a host computer (1) connected with the NAS being used to issue commands for the NAS to self-test itself via the function test program and test data; and at least one USB flash memory (4) connected with the NAS for testing the PCI ports of the NAS. A method for testing a NAS is also disclosed.