Patents by Inventor CHUN-TENG KO
CHUN-TENG KO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240120244Abstract: This invention provides a carrier or submount for high power devices packaging and a method for forming the carrier or submount. The carrier comprises a thermal conductive ceramic substrate, a patterned adhesion layer on the substrate, a heat dissipation layer on the patterned adhesion layer, a conformal cover layer enclosing the heat dissipation layer and the adhesion layer, a lateral heat dissipation layer on the substrate and between the cover layer on the first region and the cover layer on the second region, a diffusion barrier layer on the conformal cover layer, and an eutectic bonding layer on the diffusion barrier layer. The substrate includes a first region for bonding high power device, a second region for wire-bonding, and a third region for heat sink. The first region and second region are on a first surface of the substrate, and the third region is one the second surface, opposite to the first surface, of the substrate.Type: ApplicationFiled: November 16, 2023Publication date: April 11, 2024Inventors: Tzu Chien HUNG, Chun-Teng Ko, Bomin Tu, Zhengyu Lee
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Publication number: 20240112979Abstract: This invention provides a carrier or submount for high power devices packaging and a method for forming the carrier or submount. The carrier comprises a thermal conductive ceramic substrate, a patterned adhesion layer on the substrate, a heat dissipation layer on the patterned adhesion layer, a conformal cover layer enclosing the heat dissipation layer and the adhesion layer, a diffusion barrier layer on the conformal cover layer, and an eutectic bonding layer on the diffusion barrier layer. The substrate includes a first region for bonding high power device, a second region for wire-bonding, and a third region for heat sink. The first region and second region are on a first surface of the substrate, and the third region is one the second surface, opposite to the first surface, of the substrate.Type: ApplicationFiled: November 16, 2023Publication date: April 4, 2024Inventors: Tzu Chien HUNG, CHUN-TENG KO, Bornin TU, Zhengyu LEE
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Publication number: 20240107658Abstract: This invention provides a carrier or submount for high power devices packaging and a method for forming the carrier or submount. The carrier comprises a thermal conductive ceramic substrate, a patterned adhesion layer on the substrate, a heat dissipation layer on the patterned adhesion layer, a conformal cover layer enclosing the heat dissipation layer and the adhesion layer, a diffusion barrier layer on the conformal cover layer, an eutectic bonding layer on the diffusion barrier layer, and a dissipation ceramic substrate with an L-shape bonding conductor, wherein one end of the L-shape bonding conductor bonds to the power device and the other end bonds to the conformal cover layer at the second region. The substrate includes a first region for bonding high power device, a second region for wire-bonding, and a third region for heat sink. The first region and second region are on a first surface of the substrate, and the third region is one the second surface, opposite to the first surface, of the substrate.Type: ApplicationFiled: November 16, 2023Publication date: March 28, 2024Inventors: Tzu Chien HUNG, Chun-Teng KO, Bomin TU, Zhengyu LEE
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Publication number: 20240087979Abstract: This invention provides a carrier or submount for high power devices packaging and a method for forming the carrier or submount. The carrier comprises a thermal conductive ceramic substrate with at least one recess region, a patterned adhesion layer on the substrate, a heat dissipation layer on the patterned adhesion layer, a conformal cover layer enclosing the heat dissipation layer and the adhesion layer, a diffusion barrier layer on the conformal cover layer, and an eutectic bonding layer on the diffusion barrier layer. The substrate includes a first region for bonding high power device, a second region for wire-bonding, and a third region for heat sink. The first region and second region are on a first surface of the substrate, and the third region is one the second surface, opposite to the first surface, of the substrate.Type: ApplicationFiled: November 16, 2023Publication date: March 14, 2024Inventors: Tzu Chien Hung, Chun-Teng Ko, Bomin Tu, Zhengyu Lee
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Patent number: 11705480Abstract: An optoelectronic device comprises an epitaxial stack, comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a trench exposing a portion of the first semiconductor layer; a first insulating layer formed on a side wall of the trench to electrically insulate from the active layer and the second semiconductor layer; a first electrode formed on the trench; a second electrode formed on the second semiconductor layer; a supporting device covering the epitaxial stack; an optical layer covering the first electrode and the second electrode, comprising a plurality of openings corresponding to positions of the first electrodes and the second electrodes; a fifth electrode electrically connected with the first electrode; and a sixth electrode electrically connected with the second electrode, wherein the fifth electrode and the sixth electrode each comprises a side comprising a length longer that of an edge of the epitaxial stack.Type: GrantFiled: April 29, 2022Date of Patent: July 18, 2023Assignee: EPISTAR CORPORATIONInventors: Chao Hsing Chen, Jia Kuen Wang, Chien Fu Shen, Chun Teng Ko
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Publication number: 20220262849Abstract: An optoelectronic device comprises an epitaxial stack, comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a trench exposing a portion of the first semiconductor layer; a first insulating layer formed on a side wall of the trench to electrically insulate from the active layer and the second semiconductor layer; a first electrode formed on the trench; a second electrode formed on the second semiconductor layer; a supporting device covering the epitaxial stack; an optical layer covering the first electrode and the second electrode, comprising a plurality of openings corresponding to positions of the first electrodes and the second electrodes; a fifth electrode electrically connected with the first electrode; and a sixth electrode electrically connected with the second electrode, wherein the fifth electrode and the sixth electrode each comprises a side comprising a length longer that of an edge of the epitaxial stack.Type: ApplicationFiled: April 29, 2022Publication date: August 18, 2022Inventors: Chao Hsing CHEN, Jia Kuen WANG, Chien Fu SHEN, Chun Teng KO
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Patent number: 11355550Abstract: An optoelectronic device comprises a substrate; a first and a second optoelectronic units formed on the substrate; a plurality of third optoelectronic units formed on the substrate, electrically connected to the first optoelectronic unit and the second optoelectronic unit; a plurality of first electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; a plurality of second electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; an optical layer surrounding the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units in a top view of the optoelectronic device; a third electrode formed on the first optoelectronic unit and one of the plurality of third optoelectronic units; and a fourth electrode formed on the second optoelectronic unit and another one of the plurality of third optoelectronicType: GrantFiled: October 7, 2020Date of Patent: June 7, 2022Assignee: EPISTAR CORPORATIONInventors: Chao Hsing Chen, Jia Kuen Wang, Chien Fu Shen, Chun Teng Ko
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Publication number: 20210020690Abstract: An optoelectronic device comprises a substrate; a first and a second optoelectronic units formed on the substrate; a plurality of third optoelectronic units formed on the substrate, electrically connected to the first optoelectronic unit and the second optoelectronic unit; a plurality of first electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; a plurality of second electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; an optical layer surrounding the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units in a top view of the optoelectronic device; a third electrode formed on the first optoelectronic unit and one of the plurality of third optoelectronic units; and a fourth electrode formed on the second optoelectronic unit and another one of the plurality of third optoelectronicType: ApplicationFiled: October 7, 2020Publication date: January 21, 2021Inventors: Chao Hsing CHEN, Jia Kuen WANG, Chien Fu SHEN, Chun Teng KO
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Patent number: 10825860Abstract: An optoelectronic device comprises a substrate; a first optoelectronic unit formed on the substrate; a second optoelectronic unit formed on the substrate; a plurality of third optoelectronic units formed on the substrate, electrically connected to the first optoelectronic unit and the second optoelectronic unit; a plurality of first electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; a plurality of second electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; an optical layer surrounding the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units in a top view of the optoelectronic device; a third electrode formed on the first optoelectronic unit and one of the plurality of third optoelectronic units; and a fourth electrode formed on the second optoelectronic unit and another oneType: GrantFiled: November 22, 2019Date of Patent: November 3, 2020Assignee: EPISTAR CORPORATIONInventors: Chao Hsing Chen, Jia Kuen Wang, Chien Fu Shen, Chun Teng Ko
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Publication number: 20200119086Abstract: An optoelectronic device comprises a substrate; a first optoelectronic unit formed on the substrate; a second optoelectronic unit formed on the substrate; a plurality of third optoelectronic units formed on the substrate, electrically connected to the first optoelectronic unit and the second optoelectronic unit; a plurality of first electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; a plurality of second electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; an optical layer surrounding the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units in a top view of the optoelectronic device; a third electrode formed on the first optoelectronic unit and one of the plurality of third optoelectronic units; and a fourth electrode formed on the second optoelectronic unit and another oneType: ApplicationFiled: November 22, 2019Publication date: April 16, 2020Inventors: Chao Hsing CHEN, Jia Kuen WANG, Chien Fu SHEN, Chun Teng KO
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Patent number: 10559717Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed therebetween, wherein the first semiconductor layer includes a surrounding exposed region not covered by the active layer, and the surrounding exposed region surrounds the active layer; a conductive layer formed on the second semiconductor layer, including a first conductive region extending toward and contacting the surrounding exposed region of the first semiconductor layer; an electrode layer formed on the first conductive region in the surrounding exposed region; an outside insulating layer covering a portion of the conductive layer and the electrode layer, and including a first opening exposing the other portion of the conductive layer; a bonding layer covering the outside insulating layer and electrically connecting to the other portion of the conductive layer through the first opening; and a conductive substrate, wType: GrantFiled: November 13, 2018Date of Patent: February 11, 2020Assignee: EPISTAR CORPORATIONInventors: Chun-Teng Ko, Chao-Hsing Chen, Jia-Kuen Wang, Yen-Liang Kuo, Chih-Hao Chen, Wei-Jung Chung, Chih-Ming Wang, Wei-Chih Peng, Schang-Jing Hon, Yu-Yao Lin
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Patent number: 10522588Abstract: An optoelectronic device comprises a substrate; a first optoelectronic unit formed on the substrate; a second optoelectronic unit formed on the substrate; a plurality of third optoelectronic units formed on the substrate, electrically connected to the first optoelectronic unit and the second optoelectronic unit; a plurality of first electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; a plurality of second electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; an optical layer surrounding the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units in a top view of the optoelectronic device; a third electrode formed on the first optoelectronic unit and one of the plurality of third optoelectronic units; and a fourth electrode formed on the second optoelectronic unit and another oneType: GrantFiled: July 10, 2018Date of Patent: December 31, 2019Assignee: EPISTAR CORPORATIONInventors: Chao Hsing Chen, Jia Kuen Wang, Chien Fu Shen, Chun Teng Ko
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Publication number: 20190103515Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed therebetween, wherein the first semiconductor layer includes a surrounding exposed region not covered by the active layer, and the surrounding exposed region surrounds the active layer; a conductive layer formed on the second semiconductor layer, including a first conductive region extending toward and contacting the surrounding exposed region of the first semiconductor layer; an electrode layer formed on the first conductive region in the surrounding exposed region; an outside insulating layer covering a portion of the conductive layer and the electrode layer, and including a first opening exposing the other portion of the conductive layer; a bonding layer covering the outside insulating layer and electrically connecting to the other portion of the conductive layer through the first opening; and a conductive substrate, wType: ApplicationFiled: November 13, 2018Publication date: April 4, 2019Inventors: Chun-Teng Ko, Chao-Hsing Chen, Jia-Kuen Wang, Yen-Liang Kuo, Chih-Hao Chen, Wei-Jung Chung, Chih-Ming Wang, Wei-Chih Peng, Schang-Jing Hon, Yu-Yao Lin
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Patent number: 10153398Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer and an active layer formed therebetween; a surrounding exposed region formed on peripheries of the semiconductor stack, exposing a surface of the first semiconductor layer; a conductive layer formed on the second semiconductor layer, including a first conductive region extending toward and contacting the surface of the first semiconductor layer in the surrounding exposed region; an electrode layer formed on the surrounding exposed region, surrounding the semiconductor stack, contacting the conductive layer and including an electrode pad not overlapping the semiconductor stack; an outside insulating layer covering a portion of the conductive layer and the electrode layer, including a first opening exposing the other portion of the conductive layer; a bonding layer covering the outside insulating layer and electrically connecting to the other portion of the conductive layer through the firsType: GrantFiled: November 1, 2017Date of Patent: December 11, 2018Assignee: EPISTAR CORPORATIONInventors: Chun-Teng Ko, Chao-Hsing Chen, Jia-Kuen Wang, Yen-Liang Kuo, Chih-Hao Chen, Wei-Jung Chung, Chih-Ming Wang, Wei-Chih Peng, Schang-Jing Hon, Yu-Yao Lin
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Publication number: 20180331154Abstract: An optoelectronic device comprises a substrate; a first optoelectronic unit formed on the substrate; a second optoelectronic unit formed on the substrate; a plurality of third optoelectronic units formed on the substrate, electrically connected to the first optoelectronic unit and the second optoelectronic unit; a plurality of first electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; a plurality of second electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; an optical layer surrounding the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units in a top view of the optoelectronic device; a third electrode formed on the first optoelectronic unit and one of the plurality of third optoelectronic units; and a fourth electrode formed on the second optoelectronic unit and another oneType: ApplicationFiled: July 10, 2018Publication date: November 15, 2018Inventors: Chao Hsing CHEN, Jia Kuen WANG, Chien Fu SHEN, Chun Teng KO
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Patent number: 10056429Abstract: An optoelectronic device includes a first optoelectronic unit; a second optoelectronic unit; a third optoelectronic unit formed between the first optoelectronic unit and the second optoelectronic unit; a first electrode formed on and electrically connected to the first optoelectronic unit; a second electrode formed on and electrically connected to the second optoelectronic unit; a first pad electrically insulated from the third optoelectronic unit wherein the first pad is formed on the third optoelectronic unit or disposed between the first electrode and the second electrode; and a plurality of conductor arrangement structures electrically connected to the first optoelectronic unit, the second optoelectronic unit, and the third optoelectronic unit.Type: GrantFiled: August 7, 2017Date of Patent: August 21, 2018Assignee: EPISTAR CORPORATIONInventors: Chao Hsing Chen, Jia Kuen Wang, Chien Fu Shen, Chun Teng Ko
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Publication number: 20180130924Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer and an active layer formed therebetween; a surrounding exposed region formed on peripheries of the semiconductor stack, exposing a surface of the first semiconductor layer; a conductive layer formed on the second semiconductor layer, including a first conductive region extending toward and contacting the surface of the first semiconductor layer in the surrounding exposed region; an electrode layer formed on the surrounding exposed region, surrounding the semiconductor stack, contacting the conductive layer and including an electrode pad not overlapping the semiconductor stack; an outside insulating layer covering a portion of the conductive layer and the electrode layer, including a first opening exposing the other portion of the conductive layer; a bonding layer covering the outside insulating layer and electrically connecting to the other portion of the conductive layer through the firsType: ApplicationFiled: November 1, 2017Publication date: May 10, 2018Inventors: Chun-Teng Ko, Chao-Hsing Chen, Jia-Kuen Wang, YEN-LIANG KUO, Chih-Hao Chen, Wei-Jung Chung, Chih-Ming Wang, Wei-Chih Peng, Schang-Jing Hon, YU-YAO LIN
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Publication number: 20180069155Abstract: A light-emitting device, comprises a semiconductor light emitting stack; and an electrode on the semiconductor light emitting stack, the electrode comprising an adhesion layer, comprising chromium (Cr) or rhodium (Rh); a mirror layer, formed on the adhesion layer and comprising silver (Ag) or aluminum (Al); a barrier layer, formed on the mirror layer and comprising a first pair of metal layers, wherein the first pair of metal layers comprises a first metal layer and a second metal layer different from the first metal layer; and a bonding layer, formed on the barrier layer and comprising gold (Au), wherein from a cross-sectional view, the barrier layer fully covers the mirror layer and the adhesion layer.Type: ApplicationFiled: November 13, 2017Publication date: March 8, 2018Inventors: Chun-Teng KO, De-Shan KUO, Chien-Kai CHUNG, Tsun-Kai KO
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Patent number: 9847460Abstract: A light-emitting device includes a semiconductor light emitting stack; an electrode on the semiconductor light emitting stack, the electrode including a mirror layer, an adhesion layer inserted between the mirror layer and the semiconductor light emitting stack, a bonding layer; and a plurality of pits between the bonding layer and the semiconductor light emitting stack, wherein one of the plurality of pits is not filled up by the adhesion layer.Type: GrantFiled: March 16, 2016Date of Patent: December 19, 2017Assignee: EPISTAR CORPORATIONInventors: Chun-Teng Ko, De-Shan Kuo, Chien-Kai Chung, Tsun-Kai Ko
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Publication number: 20170338278Abstract: An optoelectronic device includes a first optoelectronic unit; a second optoelectronic unit; a third optoelectronic unit formed between the first optoelectronic unit and the second optoelectronic unit; a first electrode formed on and electrically connected to the first optoelectronic unit; a second electrode formed on and electrically connected to the second optoelectronic unit; a first pad electrically insulated from the third optoelectronic unit wherein the first pad is formed on the third optoelectronic unit or disposed between the first electrode and the second electrode; and a plurality of conductor arrangement structures electrically connected to the first optoelectronic unit, the second optoelectronic unit, and the third optoelectronic unit.Type: ApplicationFiled: August 7, 2017Publication date: November 23, 2017Inventors: Chao Hsing CHEN, Jia Kuen WANG, Chien Fu SHEN, Chun Teng KO