Patents by Inventor Chun-Teng Wang

Chun-Teng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PROTECTIVE FILM FOR BACK-GRINDING WAFER
    Publication number: 20220285199
    Abstract: A protective film for back-grinding wafers primarily includes a base layer and a multi-film structure. The multi-film structure at least includes two TPU films, wherein the one (HPTU film) having a higher Vicat softening temperatures and/or heat deflection temperature than the other (LPTU film) contacts the base layer. The protective film optionally includes an adhesive film on one side of the LTPU film. The multi-film structure may include one or more TPU films between the HPTU and the LPTU films.
    Type: Application
    Filed: May 19, 2021
    Publication date: September 8, 2022
    Inventors: Kuo-Hsien Wang, Chun-Teng Wang