Patents by Inventor Chun-Ting CHU

Chun-Ting CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure and method form air cavity packaging
    Patent number: 8749002
    Abstract: A structure and method for air cavity packaging, the structure comprises a carrier having plural die pads and leads, plural dies, plural wires, plural walls, and a lid. The dies are mounted on the die pads. The wires electrically connect the dies to the leads. The plural walls are disposed on the carrier and form plural cavities in a way that each cavity contains at least one die pad and plural leads, and each wall is provided with at least one air vent for exhausting air to the outside. The lid is attached on the plural walls via an adhesive agent to seal the plural air cavities, so that the plural connected air cavity packages are formed.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: June 10, 2014
    Assignee: Win Semiconductors Corp.
    Inventors: Zi-Hong Fu, Sung-Mao Yang, Chun-Ting Chu, Wen-Ching Hsu
  • STRUCTURE AND METHOD FOR AIR CAVITY PACKAGING
    Publication number: 20140103518
    Abstract: A structure and method for air cavity packaging, the structure comprises a carrier having plural die pads and leads, plural dies, plural wires, plural walls, and a lid. The dies are mounted on the die pads. The wires electrically connect the dies to the leads. The plural walls are disposed on the carrier and form plural cavities in a way that each cavity contains at least one die pad and plural leads, and each wall is provided with at least one air vent for exhausting air to the outside. The lid is attached on the plural walls via an adhesive agent to seal the plural air cavities, so that the plural connected air cavity packages are formed.
    Type: Application
    Filed: February 6, 2013
    Publication date: April 17, 2014
    Applicant: WIN Semiconductors Corp.
    Inventors: Zi-Hong FU, Sung-Mao YANG, Chun-Ting CHU, Wen-Ching HSU