Patents by Inventor Chun-Ting Liao

Chun-Ting Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220366161
    Abstract: A device detecting system is provided. The device detecting system includes a bar code scanner, a plurality of device accommodating spaces, a screen, and a server. The server obtains bar code information via the bar code scanner and opens one of the device accommodating spaces based on the bar code information to accommodate an electronic device. The server performs a test procedure on the electronic device to generate a test result, and displays the test result and operation information corresponding to the test result on the screen.
    Type: Application
    Filed: May 5, 2022
    Publication date: November 17, 2022
    Inventors: Chien-Chih CHANG, Pei-Yin CHEN, Wei-Han LIN, Bo-Rong CHU, Yen-Ting LIU, Yu-Shen MAI, Kuan-Yu HSIAO, Chia-Hsien LIN, Pei-Yu LIAO, Chun-Yen LAI, Sheng-Yi CHEN
  • Publication number: 20220325962
    Abstract: A multi-loop cycling heat dissipation module including a first tank, a first pipe, a second tank, and a second pipe is provided. The first pipe is connected to the first tank to form a first loop, a first working fluid fills the first loop to transfer heat via phase transformation, and a first high-temperature section and a first low-temperature section are formed on the first pipe. The second pipe is connected to the second tank to form a second loop, a second working fluid fills the second loop to transfer heat via phase transformation, and a second high-temperature section and a second low-temperature section are formed on the second pipe. The first high-temperature section is in thermal contact with the second low-temperature section, and the first low-temperature section is in thermal contact with the second high-temperature section.
    Type: Application
    Filed: April 1, 2022
    Publication date: October 13, 2022
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Tsung-Ting Chen, Chi-Tai Ho, Kuan-Lin Chen, Jau-Han Ke
  • Patent number: 11468863
    Abstract: A gate driving circuit includes a bootstrapping circuit, a pre-charge circuit, and an output control circuit. The bootstrapping circuit is composed of a bootstrapping capacitor and a transistor. A first terminal of the bootstrapping capacitor has a first voltage during a first duration. The pre-charge circuit is connected to the first terminal of the bootstrapping capacitor. The pre-charge circuit boosts the first terminal of the bootstrapping capacitor from the first voltage to a second voltage during a second duration. The bootstrapping circuit boosts the first terminal of the bootstrapping capacitor from the second voltage to a third voltage during a third duration. The output control circuit is connected to the first terminal of the bootstrapping capacitor. The output control circuit boosts the first terminal of the bootstrapping capacitor from the third voltage to a fourth voltage during a fourth duration.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: October 11, 2022
    Assignees: Interface Technology (ChengDu) Co., Ltd., Interface Optoelectronics (ShenZhen) Co., Ltd., Interface Optoelectronics (Wuxi) Co., Ltd., General Interface Solution Limited
    Inventors: Po-Lun Chen, Chun-Ta Chen, Chih-Lin Liao, Fu-Cheng Wei, Po-Tsun Liu, Guang-Ting Zheng, Ping-Hung Hsieh
  • Publication number: 20220299418
    Abstract: A gas detection system for gynecological disease detection and a detection method using the same are provided. The gas detection system is configured to detect an analyte from a female vagina and includes: a main body, a sleeve, a detection module, a pump, and a control module. The main body includes a body portion and a head portion having an intake channel. The body portion includes a detection chamber and an exhaust channel. The detection module includes at least one sensor configured to detect at least one target of the analyte and produce at least one detection signal. The pump is communicated with the detection chamber and the exhaust channel. The control module includes a processing unit and a first communication unit. The processing unit receives the at least one detection signal and controls the first communication unit to send the at least one detection signal.
    Type: Application
    Filed: April 20, 2021
    Publication date: September 22, 2022
    Inventors: Chia-Nan Liao, Chia-Pin Huang, Tzu-Ting Weng, Yu-Hsuan Liao, Chun-Hsien Tsai, Ting-Chuan Lee, Chun-Jung Tsai
  • Patent number: 11446807
    Abstract: A support mechanism includes a fixed body, a rotating unit, a moving unit and a driving unit. The rotating unit is rotationally mounted to the fixed body. The moving unit, disposed at the fixed body, includes a ball screw spline shaft, a ball screw nut and a ball spline nut. The ball screw nut and the ball spline nut are both rotatably disposed at the ball screw spline shaft moved together with the rotating unit. The driving unit, disposed at the fixed body, includes a first driving member and a second driving member to rotate the ball screw nut and the ball spline nut, respectively. With different rotation pairs of the ball screw nut and the ball spline nut to the ball screw spline shaft, the ball screw spline shaft is driven to move, and the ball screw spline shaft is further to move the rotating unit.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: September 20, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Bo-Jyun Jhang, Wei-Juh Lin, Wei-Tse Lin, Pei-Yin Chen, Chien-Chih Liao, Chun-Ting Chen
  • FAN
    Publication number: 20220290684
    Abstract: A fan adapted for being disposed in an electronic device is provided. The fan includes a hub and a plurality of metal blades respectively extending from the hub. Each of the metal blades has a root portion connected to the hub and an end portion away from the hub, and a mass of the end portion is greater than a mass of the root portion, such that the metal blade is elongated while the fan is rotated.
    Type: Application
    Filed: March 8, 2022
    Publication date: September 15, 2022
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Han-Liang Huang, Sheng-Yan Chen, Tsung-Ting Chen
  • Publication number: 20220246522
    Abstract: The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a first vertical structure and a second vertical structure formed over the substrate, and a conductive rail structure between the first and second vertical structures. A top surface of the conductive rail structure can be substantially coplanar with top surfaces of the first and the second vertical structures.
    Type: Application
    Filed: April 18, 2022
    Publication date: August 4, 2022
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Bo Liao, Wei Ju LEE, Cheng-Ting CHUNG, Hou-Yu CHEN, Chun-Fu CHENG, Kuan-Lun CHENG
  • Publication number: 20220246106
    Abstract: A single-stage gate driving circuit with multiple outputs includes a first bootstrapping circuit, a first pre-charge circuit, a first output control circuit, a second bootstrapping circuit, a second pre-charge circuit, and a second output control circuit. During a first duration, the first pre-charge circuit precharges a first node to a first voltage. During a second duration, the first bootstrapping circuit boosts the first node from the first voltage to a second voltage, and the second pre-charge circuit precharges a second node to a fourth voltage. During a third duration, the first output control circuit boosts the first node from the second voltage to a third voltage, and the second bootstrapping circuit boosts the second node from the fourth voltage to a fifth voltage. During a fourth duration, the second output control circuit boosts the second node from the fifth voltage to a sixth voltage.
    Type: Application
    Filed: March 18, 2021
    Publication date: August 4, 2022
    Inventors: Po-Lun CHEN, Chun-Ta CHEN, Chih-Lin LIAO, Fu-Cheng WEI, Po-Tsun LIU, Guang-Ting ZHENG, Ting-Yu WEI
  • Publication number: 20220246107
    Abstract: A gate driving circuit includes a bootstrapping circuit, a pre-charge circuit, and an output control circuit. The bootstrapping circuit is composed of a bootstrapping capacitor and a transistor. A first terminal of the bootstrapping capacitor has a first voltage during a first duration. The pre-charge circuit is connected to the first terminal of the bootstrapping capacitor. The pre-charge circuit boosts the first terminal of the bootstrapping capacitor from the first voltage to a second voltage during a second duration. The bootstrapping circuit boosts the first terminal of the bootstrapping capacitor from the second voltage to a third voltage during a third duration. The output control circuit is connected to the first terminal of the bootstrapping capacitor. The output control circuit boosts the first terminal of the bootstrapping capacitor from the third voltage to a fourth voltage during a fourth duration.
    Type: Application
    Filed: March 12, 2021
    Publication date: August 4, 2022
    Inventors: Po-Lun CHEN, Chun-Ta CHEN, Chih-Lin LIAO, Fu-Cheng WEI, Po-Tsun LIU, Guang-Ting ZHENG, Ping-Hung HSIEH
  • Publication number: 20220229477
    Abstract: A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.
    Type: Application
    Filed: January 11, 2022
    Publication date: July 21, 2022
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Chun-Chieh Wang, Shu-Hao Kuo
  • Publication number: 20210265285
    Abstract: A device includes an outer seal ring, an integrated circuit, and an inner seal ring. The outer seal ring forms a first closed loop. The integrated circuit is surrounded by the outer seal ring. The inner seal ring is between the outer seal ring and the integrated circuit. The inner seal ring forms a second closed loop that defines an enclosed region external to the integrated circuit.
    Type: Application
    Filed: May 13, 2021
    Publication date: August 26, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Hui YANG, Chun-Ting LIAO, Yi-Te CHEN, Chen-Yuan CHEN, Ho-Chun LIOU
  • Patent number: 11011478
    Abstract: A semiconductor device includes an integrated circuit, an outer seal ring, and an inner seal ring. The outer seal ring forms a first closed loop surrounding the integrated circuit. The inner seal ring is between the outer seal ring and the integrated circuit. The inner seal ring has a first seal portion surrounding the integrated circuit and a second seal portion spaced apart from the first seal portion, a first connector interconnecting the first seal portion and the second seal portion, and a second connector spaced apart from the first connector and interconnecting the first seal portion and the second seal portion. The first seal portion, the second seal portion, the first connector, and the second connector form a second closed loop.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: May 18, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Hui Yang, Chun-Ting Liao, Yi-Te Chen, Chen-Yuan Chen, Ho-Chun Liou
  • Patent number: 10930599
    Abstract: A method of manufacturing a semiconductor device comprises forming an integrated circuit, surrounding the integrated circuit with an inner seal ring, and surrounding the inner seal ring with a closed-loop outer seal ring. The inner seal ring includes a plurality of metal layers in a stacked configuration, first and second seal portions separated from each other, and third and fourth seal portions spaced apart from the first and second seal portions and separated from each other.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: February 23, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Hui Yang, Chun-Ting Liao, Yi-Te Chen, Chen-Yuan Chen, Ho-Chun Liou
  • Patent number: 10714384
    Abstract: A semiconductor device includes an integrated circuit and a guard ring. The integrated circuit includes a first circuit and a second circuit separated from the first circuit. The guard ring is disposed around the first circuit and between the first circuit and the second circuit. The guard ring includes an outer ring, an inner ring, and two connectors. The outer ring is disposed around the first circuit and has a first gap. The inner ring is disposed between the outer ring and the first circuit and has a second gap. The two connectors connect the outer ring and the inner ring. The outer ring, the inner ring, and the two connectors form a closed loop.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: July 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Ming-Hui Yang, Chun-Ting Liao, Chen-Yuan Chen, Ho-Chun Liou, Yi-Te Chen
  • Publication number: 20190363007
    Abstract: A semiconductor device includes an integrated circuit and a guard ring. The integrated circuit includes a first circuit and a second circuit separated from the first circuit. The guard ring is disposed around the first circuit and between the first circuit and the second circuit. The guard ring includes an outer ring, an inner ring, and two connectors. The outer ring is disposed around the first circuit and has a first gap. The inner ring is disposed between the outer ring and the first circuit and has a second gap. The two connectors connect the outer ring and the inner ring. The outer ring, the inner ring, and the two connectors form a closed loop.
    Type: Application
    Filed: August 5, 2019
    Publication date: November 28, 2019
    Inventors: Ming-Hui YANG, Chun-Ting LIAO, Chen-Yuan CHEN, Ho-Chun LIOU, Yi-Te CHEN
  • Publication number: 20190348376
    Abstract: A semiconductor device includes an integrated circuit, an outer seal ring, and an inner seal ring. The outer seal ring forms a first closed loop surrounding the integrated circuit. The inner seal ring is between the outer seal ring and the integrated circuit. The inner seal ring has a first seal portion surrounding the integrated circuit and a second seal portion spaced apart from the first seal portion, a first connector interconnecting the first seal portion and the second seal portion, and a second connector spaced apart from the first connector and interconnecting the first seal portion and the second seal portion. The first seal portion, the second seal portion, the first connector, and the second connector form a second closed loop.
    Type: Application
    Filed: July 26, 2019
    Publication date: November 14, 2019
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Hui YANG, Chun-Ting LIAO, Yi-Te CHEN, Chen-Yuan CHEN, Ho-Chun LIOU
  • Patent number: 10373865
    Abstract: A semiconductor device includes an integrated circuit and a guard ring. The integrated circuit includes a first circuit and a second circuit separated from the first circuit. The guard ring is disposed around the first circuit and between the first circuit and the second circuit. The guard ring includes an outer ring, an inner ring, and two connectors. The outer ring is disposed around the first circuit and has a first gap. The inner ring is disposed between the outer ring and the first circuit and has a second gap. The two connectors connect the outer ring and the inner ring. The outer ring, the inner ring, and the two connectors form a closed loop.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: August 6, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Ming-Hui Yang, Chun-Ting Liao, Chen-Yuan Chen, Ho-Chun Liou, Yi-Te Chen
  • Patent number: 10366956
    Abstract: A semiconductor device includes an integrated circuit, at least one outer seal ring, and at least one inner seal ring. The outer seal ring surrounds the integrated circuit. The outer seal ring includes a plurality of metal layers in a stacked configuration, and the metal layers are closed loops. The inner seal ring is disposed between the outer seal ring and the integrated circuit and separated from the outer seal ring. The inner seal ring has at least one gap extending from a region encircled by the inner seal ring to a region outside the inner seal ring.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: July 30, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Hui Yang, Chun-Ting Liao, Yi-Te Chen, Chen-Yuan Chen, Ho-Chun Liou
  • Publication number: 20190096827
    Abstract: A method of manufacturing a semiconductor device comprises forming an integrated circuit, surrounding the integrated circuit with an inner seal ring, and surrounding the inner seal ring with a closed-loop outer seal ring. The inner seal ring includes a plurality of metal layers in a stacked configuration, first and second seal portions separated from each other, and third and fourth seal portions spaced apart from the first and second seal portions and separated from each other.
    Type: Application
    Filed: November 30, 2018
    Publication date: March 28, 2019
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Hui YANG, Chun-Ting LIAO, Yi-Te CHEN, Chen-Yuan CHEN, Ho-Chun LIOU
  • Publication number: 20170025367
    Abstract: A semiconductor device includes an integrated circuit and a guard ring. The integrated circuit includes a first circuit and a second circuit separated from the first circuit. The guard ring is disposed around the first circuit and between the first circuit and the second circuit. The guard ring includes an outer ring, an inner ring, and two connectors. The outer ring is disposed around the first circuit and has a first gap. The inner ring is disposed between the outer ring and the first circuit and has a second gap. The two connectors connect the outer ring and the inner ring. The outer ring, the inner ring, and the two connectors form a closed loop.
    Type: Application
    Filed: July 24, 2015
    Publication date: January 26, 2017
    Inventors: Ming-Hui YANG, Chun-Ting LIAO, Chen-Yuan CHEN, Ho-Chun LIOU, Yi-Te CHEN