Patents by Inventor Chun-Tsai Ho

Chun-Tsai Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Camera module and assembling process thereof
    Patent number: 7581960
    Abstract: A camera module and an assembling process thereof are provided. The camera module includes a composite printed circuit board, an image sensing chip and an underfill. The composite printed circuit board includes a signal terminal to be connected with a conductive bump of the image sensing chip. The underfill is formed around a connecting region between the conductive bump and the signal terminal.
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: September 1, 2009
    Assignee: Primax Electronics Ltd.
    Inventor: Chun-Tsai Ho
  • CAMERA MODULE AND ASSEMBLING PROCESS THEREOF
    Publication number: 20080050943
    Abstract: A camera module and an assembling process thereof are provided. The camera module includes a composite printed circuit board, an image sensing chip and an underfill. The composite printed circuit board includes a signal terminal to be connected with a conductive bump of the image sensing chip. The underfill is formed around a connecting region between the conductive bump and the signal terminal.
    Type: Application
    Filed: November 27, 2006
    Publication date: February 28, 2008
    Applicant: Primax Electronics Ltd.
    Inventor: Chun-Tsai Ho