Abstract: In a pressing apparatus, a holding frame has a rear wall interconnecting and cooperating with opposite lateral walls so as to confine a receiving space for receiving a semiconductor device therein, and a bottom wall disposed at a bottom side of the receiving space. A positioning device, which is used to clamp the semiconductor device against the bottom wall, includes a press block unit disposed in the receiving space such that the semiconductor device is disposed between the press block unit and the bottom wall, two coupling blocks connected to opposite end portions of the press block unit, respectively, and two positioning pieces extending through screw holes in the coupling blocks, respectively, and operable to engage the lateral walls for retaining the press block unit at a desired position on the holding frame.

Abstract: A pressing kit for substrate or lead frame of a semiconductor packaging. The kit comprises a box body and a press block, wherein the box body is a hollow metallic body having a U-shaped lead board at the two lateral sides thereof. The bottom face of the inner side of the U-shaped lead board is provided with a blocking block for the holding of a bottom board. The pressing block is an elongated block body of similar length to the inner side of the box body, and the top face is provided with four pillar holes. The circular slot on the top of the pillar hole is inserted with a screw bolt from the top thereof, and a compression spring is placed at the wider recess at the bottom section.