Abstract: A testing apparatus for integrated circuits (ICs) that includes a printed circuit board (PCB) incorporating a test circuit is provided. The testing apparatus includes an insulating support structure and multiple conductive pillars. The insulating support structure features several through-holes designed to accommodate the conductive pillars. The conductive pillars are partially embedded within the insulating support structure and extend through the through-holes to establish electrical connections for IC testing. These conductive pillars possess elasticity, enabling them to adapt to various sizes and shapes of ICs. The insulating support structure includes multiple grooves adjacent to the through-holes, wherein portions of the conductive pillars are embedded to enhance their secure attachment to the insulating support structure. The testing apparatus also includes an isolation layer located adjacent to the conductive pillars to prevent the pillars from contacting each other and causing short circuits.

Abstract: An electronic device includes a substrate, a first transistor and a second transistor. The first transistor is disposed on the substrate and has a first terminal electrically connected to a first voltage level, a second terminal and a control terminal. The second transistor is disposed on the substrate and has a first terminal electrically connected to the second terminal of the first transistor, a second terminal electrically connected to a second voltage level, and a control terminal electrically connected to the control terminal of the first transistor. Wherein a voltage value of the first voltage level is greater than a voltage value of the second voltage level.

Abstract: The disclosure provides an electronic device including a driver circuit and a driving method thereof. The driver circuit includes an electronic unit, a driver unit, and a detection and protection circuit. The driver unit is electrically connected to the electronic unit. The detection and protection circuit is electrically connected to the electronic unit through a first node, and is electrically connected to a gate terminal of the driver unit through a second node. When a voltage of the first node is pulled down, the detection and protection circuit controls the driver unit to be turned off. The detection and protection circuit of the driver circuit of the disclosure protects the electronic unit from excessive current.

Abstract: A test socket for integrated circuit (IC) testing is provided and comprises an insulating support structure and multiple conductive columns. The insulating support structure features multiple through-holes designed to accommodate the conductive columns. Parts of the conductive columns are embedded within the insulating support structure and extend through these through-holes to establish electrical connections for IC testing. The conductive columns are elastic, allowing them to accommodate variations caused by warpage of the IC packaging and the tolerances in BGA solder ball sizes. Additionally, the insulating support structure incorporates multiple grooves located next to the through-holes, where parts of the conductive columns are embedded, enhancing the fixation strength of the conductive columns to the insulating support structure.

Abstract: A memory control method, a memory storage device and a memory control circuit unit are disclosed. The method includes: detecting a state of the memory storage device; and adjusting an operation mode of the memory storage device according to the state of the memory storage device, wherein the operation mode includes a first operation mode and a second operation mode, and a first waiting time before the memory storage device entering a power saving mode in the first operation mode is longer than a second waiting time before the memory storage device entering the power saving mode in the second operation mode.

Abstract: A semiconductor device includes a substrate, a plurality of memory arrays and a plurality of capacitors. The substrate includes a plurality of memory array regions. Each memory array region includes a plurality of memory blocks and a plurality of dummy blocks. The dummy blocks are located along a boundary of the memory blocks. The plurality of memory arrays are disposed in the plurality of memory blocks. The plurality of capacitors are disposed in the plurality of dummy blocks along the boundary of the plurality of memory blocks. The plurality of memory arrays may include 3D NAND flash memories with high capacity and high performance.

Abstract: An electronic device including a first base, a first conductive layer, an insulating layer, a first electronic element, a second base, and a second electronic element is provided. The first conductive layer is disposed on the first base. The insulating layer is disposed on the first conductive layer and has a first hole, wherein the first hole exposes at least a portion of the first conductive layer. The first electronic element is disposed on the first base. The second base is disposed between the insulating layer and the first electronic element, and has a second hole. The second electronic element is electrically connected to the first conductive layer. The first electronic element is electrically connected to the first conductive layer via the second hole and the first hole, and in a cross-sectional view of the electronic device, the second hole is different from the first hole in width.

Abstract: A Chinese herbal medicine extract, a method for preparing the same, and a use of the same are disclosed. The Chinese herbal medicine extract includes an active ingredient, which contains any one of or any combination of agarwood, Chinese honeylocust fruit, Chinese honeylocust spine, cinnamon leaf, and camphor leaf. Medication based on the Chinese herbal medicine extract is useful in treating coronavirus-related symptoms or diseases.

Abstract: The present disclosure provides a semiconductor light-emitting device and a semiconductor light-emitting component. The semiconductor light-emitting device includes a substrate, a first semiconductor contact layer, a semiconductor light-emitting stack including an active layer, a first-conductivity-type contact structure, a second semiconductor contact layer, a second-conductivity-type contact structure and a first electrode pad. The first-conductivity-type contact structure is electrically connected to the first semiconductor contact layer. The second-conductivity-type contact structure is electrically connected to the second semiconductor contact layer. The first-conductivity-type contact structure has a first bottom surface and a first top surface, and the active layer has a second bottom surface and a second top surface.

Abstract: An electronic device including at least one light emitting chip, a circuit chip, and a base is provided. The base having a first surface, a second surface opposite to the first surface and at least one conductive via extending from the first surface to the second surface, the base is disposed between the at least one light emitting chip and the circuit chip, and the base is greater than one of the at least one light emitting chip in thickness. The circuit chip is electrically connected to the at least one light emitting chip through the at least one conductive via and configured to control the at least one light emitting chip.

Abstract: The disclosure provides an electronic device including a support plate and a first panel. The support plate includes a first bridge member and a second bridge member. The first panel is disposed on the support plate and includes a substrate, a signal line, a third bridge member, and a fourth bridge member. The signal line is disposed on the substrate. The third bridge member penetrates through the substrate and is electrically connected to the signal line and the first bridge member. The fourth bridge member penetrates through the substrate and is electrically connected to the signal line and the second bridge member.

Abstract: An electronic device is provided. The electronic device includes a first substrate and a plurality of light-emitting elements disposed on the first substrate. The plurality of light-emitting elements include a contact pad; an intermediate substrate disposed on the contact pad; and a light-emitting unit disposed on the intermediate substrate. The electronic device further includes a second substrate and a first thin-film transistor array disposed on the second substrate for driving at least a portion of the plurality of light-emitting elements. The light-emitting unit is electrically connected to the contact pad through a via hole that penetrates the intermediate substrate.

Abstract: Provided is a polishing composition that allows carbon-added silicon oxide (SiOC) to be polished at a higher polishing speed than the polishing speed of silicon nitride (i.e., the selection ratio of SiOC/silicon nitride is high). A polishing composition containing spinous silica particles and a dispersing medium, in which the pH is less than 5.

Abstract: A random orbital sanding tool includes a power motor, a driving spindle connected to the power motor, an eccentric block connected to the driving spindle, a tool holder disposed on the eccentric block, and a sanding pad connected to the tool holder and indirectly driven by the power motor. The random orbital sanding tool includes a friction ring disposed on the tool holder, the friction ring contacts a surface of the eccentric block facing the sanding pad, the friction ring stops rotation of the tool holder and the sanding pad by a friction force exerting on the surface of the eccentric block when the power motor stops operation, the friction ring includes a base part protruding into a gap between the tool holder and the eccentric block, a sleeve part diverged and extended from the base part.

Abstract: An electronic device is provided. The electronic device includes a substrate, a material layer, a first metal layer, and a second metal layer. The material layer is disposed on the substrate, wherein a material of the material layer includes polysilicon, amorphous silicon, or indium gallium zinc oxide. The first metal layer is disposed on the material layer, wherein a first edge of the first metal layer includes a first curved portion. The second metal layer is disposed on the material layer, wherein a second edge of the second metal layer includes a second curved portion, and the second edge surrounds the first edge.

Abstract: An electronic circuit is provided. The electronic circuit includes an electronic element, a driving transistor, a first emitting transistor, and at least one capacitor. A first terminal of the driving transistor is coupled to a power voltage. The power voltage is used to drive the electronic element via the driving transistor. A first terminal of the first emitting transistor is coupled to a second terminal of the driving transistor. A second terminal of the first emitting transistor is coupled to the electronic element. A first terminal of the at least one capacitor is coupled to a gate terminal of the driving transistor. When the electronic element is driven, a second terminal of the at least one capacitor receives the power voltage.

Abstract: An electronic device including a plurality of light-emitting units, a driving circuit, and a controlling circuit is provided. The driving circuit is configured to drive at least one of the light-emitting units. The controlling circuit is configured to control the driving circuit. The plurality of light-emitting units, the driving circuit, and the controlling circuit are respectively disposed on different substrate.

Abstract: An overcurrent detection device of the present disclosure has two charge storage circuits, a control module and a counter circuit. The control module controls and provides charge paths of the two charge storage circuits, so that the two charge storage circuits are charged by a reference current and a sensed current respectively, wherein the sensed current is generated by an output current of a low-dropout regulator. The counter circuit obtains a voltage of the charge storage circuit charged by the sensed current, and counts accordingly. When the counting of the counter circuit reaches a specific value, the counter circuit outputs an overcurrent detection signal. When the output current is an overcurrent, the counter circuit first counts to the specific value before the charge storage circuit which is charged by the reference current is charged to a specific voltage.

Abstract: A low-dropout regulator with an automatic adjustment stability compensation circuit is provided. The low-dropout regulator includes an analog positive power supply; a compensation circuit; a PMOS; an error amplifier; a reference voltage; a load capacitance; a soft start circuit; a first resistor; and a second resistor. The drain of the PMOS is connected to one end of the first resistor and a node is formed at the connection to output voltage; the gate of the PMOS is connected to the output of the error amplifier and compensation circuit; the other end of the first resistor is connected in series with the second resistor, and the other end of the second resistor is grounded; the non-inverting input end of the error amplifier is connected to the reference voltage, and the inverting input end is connected to the one of the two resistors.

Abstract: A light-emitting device is provided. The light-emitting device includes a circuit substrate, an array substrate, a plurality of light-emitting units and a driver. The circuit substrate has a top surface. A top circuit is disposed on the top surface. The array substrate is disposed on the top surface of the circuit substrate and electrically connected to the top circuit. The light-emitting units are disposed on the array substrate. The light-emitting device further includes an electrical connection structure, a plurality of light extraction layers, a protective layer, a plurality of test pads, and a light absorption layer. The plurality of test pads are disposed on the array substrate, and the light absorption layer covers at least one of the test pads.