Patents by Inventor Chun Wah Jimmy Kwok

Chun Wah Jimmy Kwok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tin-Based Plating Film and Method for Forming the Same
    Publication number: 20080050611
    Abstract: The present invention provides a tin-based two-layered plating film exhibiting suppressed whisker growth comprising a lower layer of a tin plating film or tin alloy plating film comprising 5% by weight or less of at least one metal selected from the group consisting of cobalt, copper, bismuth, silver, and indium, and 95% by weight or more of tin, and an upper layer of a tin plating film or tin alloy plating film comprising 5% by weight or less of at least one metal selected from the group consisting of cobalt, copper, bismuth, silver and indium, and 95% by weight or more of tin. The tin-based plating film of the present invention is a lead-free tin plating film or tin alloy plating film, exhibits suppressed whisker growth over an extended period, and can further be formed relatively easily without complicated steps.
    Type: Application
    Filed: May 27, 2005
    Publication date: February 28, 2008
    Applicants: RAMBO CHEMICALS (H.K.) LTD., OKUNO CHEMICAL INDUSTRIES CO., LTD.
    Inventors: Chun Wah Jimmy Kwok, Yim Wah Rosaline Kwok, Yutaka Nakagishi