Patents by Inventor Chun-Wei Chiu

Chun-Wei Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10936524
    Abstract: A bus system is provided. The bus system includes a master device, a bus, and a plurality of slave devices electrically connected to the master device via the bus. Each slave device has an alert handshake pin. The alert handshake pins of the slave devices are electrically connected together via an alert-handshake control line. When a first slave device communicates with the master device through the bus, in a first phase of a plurality of phases in each assignment period, the first slave device sets the alert-handshake control line to a first voltage level via the alert handshake pin, wherein the first phase corresponds to the first slave device. In the phases other than the first phase in each assignment period, the alert-handshake control line is at a second voltage level. Each of the phases includes two clock cycles.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: March 2, 2021
    Assignee: NUVOTON TECHNOLOGY CORPORATION
    Inventors: Chih-Hung Huang, Chun-Wei Chiu, Hao-Yang Chang
  • Patent number: 10913188
    Abstract: The present invention provides an anti-shock pad, which includes: a board-shaped compound material structure, manufactured by mixing a composition and foam molding the composition, wherein the composition comprises: a main substrate, having a proportion of 50 wt % to 80 wt % of total weight of the composition, comprising: a vinyl acetate; and an ethylene-vinyl acetate; a secondary substrate, having a proportion of 10 wt % to 40 wt % of the total weight of the composition, comprising: a polyethylene; a styrene butadiene rubber; and a thermoplastic elastomer; and an additive, having a proportion of 1 wt % to 20 wt % of the total weight of the composition; wherein a density of the anti-shock pad is between 0.20 and 0.50, and a foaming ratio of the anti-shock pad is between 20 and 40. The present invention is also related to a method of manufacturing the anti-shock pad.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: February 9, 2021
    Assignee: National Chung-Shan Institute of Science and Technology
    Inventors: Chun-Wei Chiu, Teh-Long Lai, Shyh-Chi Wu
  • Patent number: 10901935
    Abstract: An integrated circuit (IC) is provided. The IC includes a specific pin, a pull-down circuit and a voltage detector coupled to the specific pin, and a controller. The pull-down circuit includes a pull-down resistor corresponding to a driving voltage level, and is configured to selectively couple the pull-down resistor to the specific pin according to a control signal. The voltage detector is configured to detect the specific pin to obtain a detected voltage value. The controller is configured to determine whether the detected voltage value is the same as the driving voltage level, so as to provide the control signal. When the detected voltage value is greater or less than the driving voltage level, the controller is configured to provide the control signal to the pull-down circuit, so that the pull-down resistor is electrically separated from the specific pin.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: January 26, 2021
    Assignee: Nuvoton Technology Corporation
    Inventors: Ming-Hung Wu, Chih-Hung Huang, Chun-Wei Chiu
  • Patent number: 10817452
    Abstract: A bus system is provided. The bus system includes a master device, an enhanced serial peripheral interface (eSPI) bus, a plurality of slave devices electrically connected to the master device via the eSPI bus, and a first resistor. Each slave device has an alert handshake pin. The alert handshake pins of the slave devices are electrically connected together via an alert handshake control line. The first resistor is coupled between the alert handshake control line and a power supply. Each slave device obtains the number of slave devices according to a first voltage of the alert handshake control line.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: October 27, 2020
    Assignee: NUVOTON TECHNOLOGY CORPORATION
    Inventors: Chih-Hung Huang, Chun-Wei Chiu, Hao-Yang Chang
  • Publication number: 20200192449
    Abstract: A bus system is provided. The bus system includes a master device and a plurality of slave devices electrically connected to the master device. Each slave device has an alert handshake pin. The alert handshake pins of the slave devices are electrically connected together via an alert handshake control line. When the alert handshake control line is at a first voltage level and a first slave device want to communicate with the master device, the first slave device controls the alert handshake control line to a second voltage level via the alert handshake pin, such that the slave devices enter a synchronization stage. Among phases of each assignment period, in a first phase corresponding to the first slave device, the first slave device controls the alert handshake control line to the second voltage level via the alert handshake pin.
    Type: Application
    Filed: December 13, 2019
    Publication date: June 18, 2020
    Inventors: Chih-Hung HUANG, Chun-Wei CHIU, Hao-Yang CHANG
  • Patent number: 10657088
    Abstract: An integrated circuit (IC) and a bus system are provided. The IC includes a first function module coupled to a first pin, a switch, a second function module coupled to a second pin, and a controller. The switch selectively couples the first pin to a pull-down resistor according to a control signal. When a specific condition is met, the controller turns on the switch to couple the first pin to a pull-down resistor, and detects a first input signal on the first pin, so as to determine whether there are slave devices coupled to a master device. When the controller determines that the IC is one of the slave devices or the single slave device connected to the master device, the controller turns off the switch to separate the first pin from the pull-down resistor, and assigns the second pin to the second function module.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: May 19, 2020
    Assignee: Nuvoton Technology Corporation
    Inventors: Chih-Hung Huang, Chih-Hung Huang, Chun-Wei Chiu
  • Publication number: 20200117634
    Abstract: An integrated circuit (IC) is provided. The IC includes a specific pin, a pull-down circuit and a voltage detector coupled to the specific pin, and a controller. The pull-down circuit includes a pull-down resistor corresponding to a driving voltage level, and is configured to selectively couple the pull-down resistor to the specific pin according to a control signal. The voltage detector is configured to detect the specific pin to obtain a detected voltage value. The controller is configured to determine whether the detected voltage value is the same as the driving voltage level, so as to provide the control signal. When the detected voltage value is greater or less than the driving voltage level, the controller is configured to provide the control signal to the pull-down circuit, so that the pull-down resistor is electrically separated from the specific pin.
    Type: Application
    Filed: October 4, 2019
    Publication date: April 16, 2020
    Inventors: Ming-Hung WU, Chih-Hung HUANG, Chun-Wei CHIU
  • Patent number: 10606778
    Abstract: A bus system is provided. The bus system includes a master device, a bus and a plurality of slave devices. The slave devices and the master device are electrically connected through the bus. The master device communicates with the slave devices by using a one-to-one communication mechanism. The slave devices communicate with the master device by using an arbitration mechanism in which one of the slave devices is selected to communicate with the master device.
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: March 31, 2020
    Assignee: Nuvoton Technology Corporation
    Inventors: Chun-Wei Chiu, Chia-Ching Lu, Shih-Feng Huang, Ming-Che Hung
  • Publication number: 20200065280
    Abstract: An integrated circuit (IC) and a bus system are provided. The IC includes a first function module coupled to a first pin, a switch, a second function module coupled to a second pin, and a controller. The switch selectively couples the first pin to a pull-down resistor according to a control signal. When a specific condition is met, the controller turns on the switch to couple the first pin to a pull-down resistor, and detects a first input signal on the first pin, so as to determine whether there are slave devices coupled to a master device. When the controller determines that the IC is one of the slave devices or the single slave device connected to the master device, the controller turns off the switch to separate the first pin from the pull-down resistor, and assigns the second pin to the second function module.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 27, 2020
    Inventors: Chih-Hung HUANG, Chih-Hung HUANG, Chun-Wei CHIU
  • Publication number: 20190361832
    Abstract: A bus system is provided. The bus system includes a master device, an enhanced serial peripheral interface (eSPI) bus, a plurality of slave devices electrically connected to the master device via the eSPI bus, and a first resistor. Each slave device has an alert handshake pin. The alert handshake pins of the slave devices are electrically connected together via an alert handshake control line. The first resistor is coupled between the alert handshake control line and a power supply. Each slave device obtains the number of slave devices according to a first voltage of the alert handshake control line.
    Type: Application
    Filed: April 30, 2019
    Publication date: November 28, 2019
    Inventors: Chih-Hung HUANG, Chun-Wei CHIU, Hao-Yang CHANG
  • Publication number: 20190361833
    Abstract: A bus system is provided. The bus system includes a master device, a bus, and a plurality of slave devices electrically connected to the master device via the bus. Each slave device has an alert handshake pin. The alert handshake pins of the slave devices are electrically connected together via an alert-handshake control line. When a first slave device communicates with the master device through the bus, in a first phase of a plurality of phases in each assignment period, the first slave device sets the alert-handshake control line to a first voltage level via the alert handshake pin, wherein the first phase corresponds to the first slave device. In the phases other than the first phase in each assignment period, the alert-handshake control line is at a second voltage level. Each of the phases includes two clock cycles.
    Type: Application
    Filed: April 30, 2019
    Publication date: November 28, 2019
    Inventors: Chih-Hung HUANG, Chun-Wei CHIU, Hao-Yang CHANG
  • Publication number: 20190308348
    Abstract: The present invention provides an anti-shock pad, which includes: a board-shaped compound material structure, manufactured by mixing a composition and foam molding the composition, wherein the composition comprises: a main substrate, having a proportion of 50 wt % to 80 wt % of total weight of the composition, comprising: a vinyl acetate; and an ethylene-vinyl acetate; a secondary substrate, having a proportion of 10 wt % to 40 wt % of the total weight of the composition, comprising: a polyethylene; a styrene butadiene rubber; and a thermoplastic elastomer; and an additive, having a proportion of 1 wt % to 20 wt % of the total weight of the composition; wherein a density of the anti-shock pad is between 0.20 and 0.50, and a foaming ratio of the anti-shock pad is between 20 and 40. The present invention is also related to a method of manufacturing the anti-shock pad.
    Type: Application
    Filed: April 9, 2019
    Publication date: October 10, 2019
    Inventors: Chun-Wei Chiu, Teh-Long Lai, Shyh-Chi Wu
  • Publication number: 20170153997
    Abstract: A bus system is provided. The bus system includes a master device, a bus and a plurality of slave devices. The slave devices and the master device are electrically connected through the bus. The master device communicates with the slave devices by using a one-to-one communication mechanism. The slave devices communicate with the master device by using an arbitration mechanism in which one of the slave devices is selected to communicate with the master device.
    Type: Application
    Filed: May 5, 2016
    Publication date: June 1, 2017
    Inventors: Chun-Wei CHIU, Chia-Ching LU, Shih-Feng HUANG, Ming-Che HUNG
  • Patent number: 8443728
    Abstract: A fuze includes a shell, a plunger a firing pin unit, a spring, a receptacle, a plurality of detents, a detonation unit and a restraint unit. The plunger is movably provided in the shell. The firing pin unit is movably provided in the shell, in the vicinity of the plunger. The spring is compressed between the plunger and the firing pin unit. The receptacle is provided in the shell and movably connected to the firing pin unit. The detents are movably provided between the firing pin unit and the receptacle. The detonation unit is movably provided in the receptacle opposite to the detents. The restraint unit is provided in the shell and movably connected to the detonation unit.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: May 21, 2013
    Assignee: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
    Inventors: Li-Tin Chiang, Chun-Wei Chiu, Kuei-Ju Lee
  • Publication number: 20130074723
    Abstract: A fuze includes a shell, a plunger a firing pin unit, a spring, a receptacle, a plurality of detents, a detonation unit and a restraint unit. The plunger is movably provided in the shell. The firing pin unit is movably provided in the shell, in the vicinity of the plunger. The spring is compressed between the plunger and the firing pin unit. The receptacle is provided in the shell and movably connected to the firing pin unit. The detents are movably provided between the firing pin unit and the receptacle. The detonation unit is movably provided in the receptacle opposite to the detents. The restraint unit is provided in the shell and movably connected to the detonation unit.
    Type: Application
    Filed: September 23, 2011
    Publication date: March 28, 2013
    Applicant: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
    Inventors: Li-Tin Chiang, Chun-Wei Chiu, Kuei-Ju Lee
  • Publication number: 20130075961
    Abstract: Disclosed is an efficient and inexpensive method for making an effective shock-absorptive material from a micro- or nano-colloidal solution. The method includes the steps of providing a liquid mixture via mixing silicon dioxide grains, poly ethylene glycol and an additive evenly, providing a colloidal solution-based raw material via heating the liquid mixture to evaporating and removing the additive, providing a colloidal solution-based mixture via adding a cross-linking agent into the colloidal solution-based raw material, and molding the colloidal solution-based mixture into a shock-absorptive plastic material via filling the colloidal solution-based mixture in a mold and casting ultraviolet light onto the mold or heating the mold to heat and cure the colloidal solution-based mixture.
    Type: Application
    Filed: September 24, 2011
    Publication date: March 28, 2013
    Applicant: Chung-Shan Institute of Science and Technology, Amaments, Bureau, Ministry of National Defense
    Inventors: Chun-Ho Chen, Chun-Wei Chiu, Tsai-Chi Yeh
  • Publication number: 20130074375
    Abstract: A shoe apparatus includes a shoe, a power supply and a wireless transmitter. The shoe is to be worn by a user. The power supply is provided in the shoe for generation and storage of electricity. The power supply includes a battery, a first generator unit electrically connected to the battery and a second generator unit electrically connected to the battery. The wireless transmitter is provided in the shoe and electrically connected to the power supply for wireless communication of data with a remote device.
    Type: Application
    Filed: September 24, 2011
    Publication date: March 28, 2013
    Applicant: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
    Inventors: Chi-Ho Chang, Chun-Wei Chiu, Wen-Hao Pi, Hung-Wei Lin, Chung-Bo Tsai, Kuei-Ju Lee