Abstract: An integrated circuit includes a photodetector. The photodetector includes one or more dielectric structures positioned in a trench in a semiconductor substrate. The photodetector includes a photosensitive material positioned in the trench and covering the one or more dielectric structures. A dielectric layer covers the photosensitive material. The photosensitive material has an index of refraction that is greater than the indices of refraction of the dielectric structures and the dielectric layer.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: A recycling apparatus for a solar cell module includes a platform for supporting and positioning the solar cell module, and at least one milling device disposed on the platform and having a milling member configured to contact a back plate of the solar cell module, and a casing defining a chip-receiving space and having an air inlet and a suction port communicating with the chip-receiving space. A drive device is connected to the at least one milling device for driving the at least one milling device to move around and mill the solar cell module through the milling member.

Abstract: A method of forming a semiconductor device includes forming a first conductive feature on a bottom surface of an opening through a dielectric layer. The forming the first conductive feature leaves seeds on sidewalls of the opening. A treatment process is performed on the seeds to form treated seeds. The treated seeds are removed with a cleaning process. The cleaning process may include a rinse with deionized water. A second conductive feature is formed to fill the opening.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: An integrated circuit includes a photodetector. The photodetector includes one or more dielectric structures positioned in a trench in a semiconductor substrate. The photodetector includes a photosensitive material positioned in the trench and covering the one or more dielectric structures. A dielectric layer covers the photosensitive material. The photosensitive material has an index of refraction that is greater than the indices of refraction of the dielectric structures and the dielectric layer.

Abstract: The present disclosure illustrates a rope tail positioning fastener including a fastener body. The fastener body includes a base and an elastic arm, and the base has an insertion channel inside, and the insertion channel is provided with two through holes at a side thereof and a hole at other side thereof, and a stop part is formed between the two through holes, and a side of the base adjacent to the hole is bent to form the elastic arm suspended relative to the base, so that two tail parts of the rope can be inserted into, through and out of the insertion channel via the through holes; next, the two tail parts of the rope can be sewn to form a seam part; and, after the seam part is completed, the user can pull the rope back to receive the two tail parts inside the insertion channel.

Abstract: The present disclosure illustrates a rope tail positioning fastener including a fastener body. The fastener body includes a base and an elastic arm, and the base has an insertion channel inside, and the insertion channel is provided with two through holes at a side thereof and a hole at other side thereof, and a stop part is formed between the two through holes, and a side of the base adjacent to the hole is bent to form the elastic arm suspended relative to the base, so that two tail parts of the rope can be inserted into, through and out of the insertion channel via the through holes; next, the two tail parts of the rope can be sewn to form a seam part; and, after the seam part is completed, the user can pull the rope back to receive the two tail parts inside the insertion channel.

Abstract: A display apparatus that is suitable for a video wall and an operation method thereof are provided. The display apparatus includes a display panel, a memory circuit and a video processing circuit. The memory circuit is used for storing extended display identification data (EDID), and resolution information of the EDID may affect a resolution of a video frame signal of a video source. The video processing circuit transmits the video frame signal to a video output connector. Based on a video wall configuration parameter, the video processing circuit captures part or all of pixel data in the video frame signal to obtain a captured frame, and displays the captured frame on the display panel. Based on the video wall configuration parameter, the video processing circuit can adaptively change the resolution information of the EDID stored in the memory circuit.