Patents by Inventor Chun Wei Lin

Chun Wei Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12270709
    Abstract: An infrared sensor uses an infrared lens with infrared filtering and focusing functions. Thus, an infrared filter can be omitted to reduce the costs and volume. In addition, a getter on the inside of a metal cover of the infrared sensor can be activated when the metal cover is soldered to the substrate of the infrared sensor. Therefore, the packaging process of the infrared sensor can be simplified.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: April 8, 2025
    Assignee: TXC CORPORATION
    Inventors: Tzong-Sheng Lee, Jen-Wei Luo, Chia-Hao Weng, Chun-Chi Lin, Ting-Chun Hsu, Hui-Jou Yu, Yi-Hung Lin, Sung-Hung Lin
  • Publication number: 20250110048
    Abstract: An optical sensor device for determining a hydration level information of an object includes a light-emitting element, a light-receiving element, and an analyzer. The light-emitting element is configured to emit a first light at a first wavelength and a second light at a second wavelength. The light-receiving element is configured to receive a first reflected light at the first wavelength and a second reflected light at the second wavelength from the object. The analyzer is configured to perform a hydration measurement to determine the hydration level information. The hydration level information is based on: a first reference signal strength at the first wavelength and a second reference signal strength at the second wavelength obtained from the light-receiving element when the object is not present; and a first signal strength of the first reflected light and a second signal strength of the second reflected light when the object is present.
    Type: Application
    Filed: September 16, 2024
    Publication date: April 3, 2025
    Inventors: Chih-Wei Yeh, Chun-Wei Lin
  • Publication number: 20250112363
    Abstract: An antenna structure includes a main ground element, an extension ground element, a feeding radiation element, a first radiation element, a second radiation element, a shorting radiation element, a third radiation element, and a dielectric substrate. The extension ground element is coupled to the main ground element. A notch region is defined by the main ground element and the extension ground element. The feeding radiation element has a feeding point. The first radiation element is coupled to the feeding radiation element. The second radiation element is coupled to the feeding radiation element. The second radiation element and the first radiation element substantially extend in opposite directions. The feeding radiation element is also coupled through the shorting radiation element to the extension ground element. The third radiation element is coupled to the main ground element.
    Type: Application
    Filed: November 2, 2023
    Publication date: April 3, 2025
    Inventors: Chun-I LIN, Bo-Wei LIN
  • Publication number: 20250098238
    Abstract: A semiconductor device includes a first fin-shaped structure and a second fin-shaped structure on a substrate, a bump between the first fin-shaped structure and the second fin-shaped structure, a first recess between the first fin-shaped structure and the bump, and a second recess between the second fin-shaped structure and the bump. Preferably, a top surface of the bump includes a curve concave upward, a width of the bump is greater than twice the width of the first fin-shaped structure, and a height of the bump is less than one fourth of the height of the first fin-shaped structure.
    Type: Application
    Filed: October 23, 2023
    Publication date: March 20, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Ting Chiang, Tien-Shan Hsu, Po-Chang Lin, Lung-En Kuo, Hao-Che Feng, Ping-Wei Huang
  • Patent number: 12249649
    Abstract: A semiconductor device includes a fin-shaped structure on the substrate, a shallow trench isolation (STI) around the fin-shaped structure, a single diffusion break (SDB) structure in the fin-shaped structure for dividing the fin-shaped structure into a first portion and a second portion; a first gate structure on the fin-shaped structure, a second gate structure on the STI, and a third gate structure on the SDB structure. Preferably, a width of the third gate structure is greater than a width of the second gate structure and each of the first gate structure, the second gate structure, and the third gate structure includes a U-shaped high-k dielectric layer, a U-shaped work function metal layer, and a low-resistance metal layer.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: March 11, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Han Wu, Hsin-Yu Chen, Chun-Hao Lin, Shou-Wei Hsieh, Chih-Ming Su, Yi-Ren Chen, Yuan-Ting Chuang
  • Publication number: 20250073451
    Abstract: An in vitro training method for training genioglossus muscle strength includes adhering an electrode patch of an in vitro training device to a bottom of a chin of a user during a non-sleep period. The electrode patch receives an electrical stimulation signal from an electrical stimulation module of the in vitro training device to stimulate the genioglossus muscle of the user through transdermal electrical stimulation. The electrode patch includes a body surface adhering face and an assembling face opposite to the body surface adhering face. The body surface adhering face is adhered to the bottom of the chin of the user to align with the genioglossus muscle. The electrical stimulation module is disposed on the assembling face and in electrical connection with the electrode patch. The electrical stimulation module sends an electrical stimulation signal to stimulate the genioglossus muscle through transdermal electrical stimulation.
    Type: Application
    Filed: August 28, 2023
    Publication date: March 6, 2025
    Inventors: Bol-Wei Huang, Yu-Sheng Lin, Tung-Lin Tsai, Chun-Chieh Tseng
  • Publication number: 20250081632
    Abstract: A solar cell module includes a first substrate, a second substrate, at least one cell unit, a first packaging film, a second packaging film, a first protective layer, a second protective layer, and a plurality of support members. The first substrate and the second substrate are disposed opposite to each other. The cell unit is disposed between the first substrate and the second substrate. The first packaging film is disposed between the cell unit and the first substrate. The second packaging film is disposed between the cell unit and the second substrate. The first protective layer is disposed between the cell unit and the first packaging film. The second protective layer is disposed between the cell unit and the second packaging film. The support members are respectively disposed between the first packaging film and the second packaging film and surround at least two opposite sides of the cell unit.
    Type: Application
    Filed: August 29, 2024
    Publication date: March 6, 2025
    Applicant: Industrial Technology Research Institute
    Inventors: Hsin-Chung Wu, Chun-Wei Su, Tzu-Ting Lin, En-Yu Pan, Yu-Tsung Chiu, Chih-Lung Lin, Teng-Yu Wang, Chiou-Chu Lai, Ying-Jung Chiang
  • Patent number: 12242321
    Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: March 4, 2025
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Wen Che Chung, Hui Chuan Lo, Hao-Hsuan Lin, Chun Tsao, Jun-Fu Chen, Ming-Hung Yao, Jia-Wei Zhang, Kuan-Lun Chen, Ting-Chao Lin, Cheng-Yen Lin, Chunyen Lai
  • Publication number: 20250065110
    Abstract: An in vitro training method includes scanning a user's oral cavity to create a first oral cavity model. An articulator body is selected according to the first oral cavity model, and plural first customized electrode sheets are formed and assembled onto the articulator body to obtain an in vitro training device. The user bites the in vitro training device during a non-sleep period and uses the plural first customized electrode sheets to proceed with electrical stimulation on a top surface and two sides of a tongue of the user, thereby training a muscular endurance of infrahyoid muscles of the user for a training period. The user's oral cavity is scanned again to create a second oral cavity model. The first oral cavity model is compared with the second oral cavity model to timely renew the customized electrode sheets when the image over rate is lower than 80%.
    Type: Application
    Filed: August 24, 2023
    Publication date: February 27, 2025
    Inventors: BOL-WEI HUANG, YU-SHENG LIN, TUNG-LIN TSAI, CHUN-CHIEH TSENG
  • Publication number: 20250066899
    Abstract: A method includes: positioning a wafer on an electrostatic chuck of a physical vapor deposition apparatus, the wafer including an opening exposing a conductive feature; setting a temperature of the wafer to a room temperature; forming a tungsten thin film in the opening by the physical vapor deposition apparatus, the tungsten thin film including a bottom portion that is on an upper surface of the conductive feature exposed by the opening, a top portion that is on an upper surface of a dielectric layer through which the opening extends and a sidewall portion that is on a sidewall of the dielectric layer exposed by the opening; removing the top portion and the sidewall portion of the tungsten thin film from over the opening; and forming a tungsten plug in the opening on the bottom portion by selectively depositing tungsten by a chemical vapor deposition operation.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 27, 2025
    Inventors: Chun-Yen LIAO, I. LEE, Shu-Lan CHANG, Sheng-Hsuan LIN, Feng-Yu CHANG, Wei-Jung LIN, Chun-I TSAI, Chih-Chien CHI, Ming-Hsing TSAI, Pei Shan CHANG, Chih-Wei CHANG
  • Publication number: 20250072294
    Abstract: A method for fabricating semiconductor device includes the steps of forming a magnetic tunneling junction (MTJ) stack on a substrate, performing an etching process to remove the MTJ stack for forming a MTJ, performing a deposition process to form a polymer on a sidewall of the MTJ, and removing the polymer to form a rough surface on the sidewall of the MTJ. Preferably, the MTJ could include a pinned layer on the substrate, a barrier layer on the pinned layer, and a free layer on the barrier layer, in which the rough surface could appear on sidewall of the pinned layer, sidewall of the barrier layer, and/or sidewall of the free layer.
    Type: Application
    Filed: November 14, 2024
    Publication date: February 27, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Wei Liu, Jia-Feng Fang, Chun-Hsien Lin
  • Patent number: 12237395
    Abstract: A high electron mobility transistor (HEMT) includes a substrate, a channel layer, a barrier layer and a passivation layer. A contact structure is disposed on the passivation layer and extends through the passivation layer and the barrier layer to directly contact the channel layer. The contact structure includes a metal layer, and the metal layer includes a metal material doped with a first additive. A weight percentage of the first additive in the metal layer is between 0% and 2%.
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: February 25, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ko-Wei Lin, Chun-Chieh Chiu, Chun-Ling Lin, Shu Min Huang, Hsin-Fu Huang
  • Patent number: 12237329
    Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a first region and a second region; forming a first fin-shaped structure on the first region and a second fin-shaped structure on the second region; forming a patterned mask on the second region; and performing a process to enlarge the first fin-shaped structure so that the top surfaces of the first fin-shaped structure and the second fin-shaped structure are different.
    Type: Grant
    Filed: December 1, 2023
    Date of Patent: February 25, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Hao Lin, Hsin-Yu Chen, Shou-Wei Hsieh
  • Patent number: 12237400
    Abstract: A method of forming a semiconductor device includes: forming a semiconductor structure having source/drain regions, a fin disposed between the source/drain regions, and a dummy gate disposed on the fin and surrounded by a spacer; removing the dummy gate to form a gate trench which is defined by a trench-defining wall; forming a gate dielectric layer on the trench-defining wall; forming a work function structure on the gate dielectric layer; forming a resist layer to fill the gate trench; removing a top portion of the resist layer; removing the work function structure exposed from the resist layer using a wet chemical etchant; removing the resist layer; and forming a conductive gate in the gate trench.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: February 25, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chieh-Wei Chen, Jian-Jou Lian, Tzu-Ang Chiang, Po-Yuan Wang, Yu-Shih Wang, Chun-Neng Lin, Ming-Hsi Yeh
  • Patent number: 12237218
    Abstract: A method of fabricating a contact structure includes the following steps. An opening is formed in a dielectric layer. A conductive material layer is formed within the opening and on the dielectric layer, wherein the conductive material layer includes a bottom section having a first thickness and a top section having a second thickness, the second thickness is greater than the first thickness. A first treatment is performed on the conductive material layer to form a first oxide layer on the bottom section and on the top section of the conductive material layer. A second treatment is performed to remove at least portions of the first oxide layer and at least portions of the conductive material layer, wherein after performing the second treatment, the bottom section and the top section of the conductive material layer have substantially equal thickness.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chang-Ting Chung, Shih-Wei Yeh, Kai-Chieh Yang, Yu-Ting Wen, Yu-Chen Ko, Ya-Yi Cheng, Min-Hsiu Hung, Chun-Hsien Huang, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai
  • Publication number: 20250063776
    Abstract: A semiconductor device includes a semiconductor substrate, an isolation structure, and a first electrically conductive structure. The semiconductor substrate has a planar device region and a fin device region. The semiconductor substrate includes a mesa structure disposed in the planar device region and fin-shaped structures disposed in the fin device region. The isolation structure is disposed on the semiconductor substrate and includes a first portion which is disposed on the planar device region and covers a sidewall of the mesa structure, and the isolation structure further includes a second portion which is disposed on the fin device region and located between the fin-shaped structures. The first electrically conductive structure is disposed on the planar device region. The first electrically conductive structure is partly disposed above the mesa structure in a vertical direction and partly disposed above the first portion of the isolation structure in the vertical direction.
    Type: Application
    Filed: September 27, 2023
    Publication date: February 20, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hsin-Yu Chen, Chun-Hao Lin, Yuan-Ting Chuang, Shou-Wei Hsieh
  • Publication number: 20250062202
    Abstract: A semiconductor die and methods of forming the same and a package structure are provided. The semiconductor die includes a semiconductor substrate, a plurality of conductive pads over the semiconductor substrate, a passivation layer over the semiconductor substrate and partially covering the plurality of conductive pads, an interconnecting line disposed on the passivation layer, and a plurality of connectors disposed on and electrically connected to the plurality of conductive pads. Each of the plurality of connectors includes a stacked structure of a first conductive pillar and a second conductive pillar disposed directly on the first conductive pillar, wherein a span of the second conductive pillar is smaller than a span of the first conductive pillar, and an orthogonal projection of the second conductive pillar falls within an orthogonal projection of the first conductive pillar, and the interconnecting line is located beside and spaced apart from the plurality of connectors.
    Type: Application
    Filed: August 17, 2023
    Publication date: February 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Yi Sung, Ta-Hsuan Lin, Hua-Wei Tseng, Mill-Jer Wang
  • Patent number: 12230595
    Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: February 18, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Da Cheng, Yung-Ching Chao, Chun Kai Tzeng, Cheng Jen Lin, Chin Wei Kang, Yu-Feng Chen, Mirng-Ji Lii
  • Patent number: D1062545
    Type: Grant
    Filed: May 7, 2023
    Date of Patent: February 18, 2025
    Assignees: Acer Incorporated, Acer Gadget Inc.
    Inventors: Yun Cheng, Ker-Wei Lin, Hao-Ming Chang, Chun-Ta Chen, Wei-Chen Lee, Chih-Yuan Chang
  • Patent number: D1063712
    Type: Grant
    Filed: May 7, 2023
    Date of Patent: February 25, 2025
    Assignees: Acer Incorporated, Acer Gadget Inc.
    Inventors: Yun Cheng, Ker-Wei Lin, Hao-Ming Chang, Chun-Ta Chen, Wei-Chen Lee, Chih-Yuan Chang