Patents by Inventor Chun-Wei Liu
Chun-Wei Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145691Abstract: The present invention is related to a novel positive electrode active material for lithium-ion battery. The positive electrode active material is expressed by the following formula: Li1.2NixMn0.8-x-yZnyO2, wherein x and y satisfy 0<x?0.8 and 0<y?0.1. In addition, the present invention provides a method of manufacturing the positive electrode active material. The present invention further provides a lithium-ion battery which uses said positive electrode active material.Type: ApplicationFiled: March 14, 2023Publication date: May 2, 2024Inventors: CHUAN-PU LIU, YIN-WEI CHENG, SHIH-AN WANG, BO-LIANG PENG, CHUN-HUNG CHEN, JUN-HAN HUANG, YI-CHANG LI
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Publication number: 20240126002Abstract: A backlight module includes a light source, a first prism sheet disposed on the light source, and a light type adjustment sheet disposed on a side of the first prism sheet away from the light source and including a base and multiple light type adjustment structures. The multiple light type adjustment structures are disposed on the first surface of the base. Each light type adjustment structure has a first structure surface and a second structure surface connected to each other. The first structure surface of each light type adjustment structure and the first surface of the base form a first base angle therebetween, and the second structure surface of each light type adjustment structure and the first surface of the base form a second base angle therebetween. The angle of the first base angle is different from the angle of the second base angle.Type: ApplicationFiled: October 2, 2023Publication date: April 18, 2024Applicant: Coretronic CorporationInventors: Chih-Jen Tsang, Chung-Wei Huang, Shih-Yen Cheng, Jung-Wei Chang, Han-Yuan Liu, Chun-Wei Lee
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Publication number: 20240123479Abstract: A recycling apparatus for a solar cell module includes a platform for supporting and positioning the solar cell module, and at least one milling device disposed on the platform and having a milling member configured to contact a back plate of the solar cell module, and a casing defining a chip-receiving space and having an air inlet and a suction port communicating with the chip-receiving space. A drive device is connected to the at least one milling device for driving the at least one milling device to move around and mill the solar cell module through the milling member.Type: ApplicationFiled: October 28, 2021Publication date: April 18, 2024Applicant: NATIONAL UNIVERSITY OF TAINANInventors: Yao-Hsien FU, Hsueh-Pin TAI, Chia-Tsung HUNG, Cheng-Chen LIU, Chun-Chih HU, How-Wei KE
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Publication number: 20240118135Abstract: An information handling system includes a display panel having an active area that generates visual images and an inactive area disposed outside the active area. The inactive area having an alignment mark that is invisible to a naked eye.Type: ApplicationFiled: October 7, 2022Publication date: April 11, 2024Inventors: Hong-Ji Huang, Yu-Chen Liu, Kuo-Wei Tseng, Chun-Wei Huang, Chi-Fong Lee
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Patent number: 11955329Abstract: A method of forming a semiconductor device includes forming a first conductive feature on a bottom surface of an opening through a dielectric layer. The forming the first conductive feature leaves seeds on sidewalls of the opening. A treatment process is performed on the seeds to form treated seeds. The treated seeds are removed with a cleaning process. The cleaning process may include a rinse with deionized water. A second conductive feature is formed to fill the opening.Type: GrantFiled: April 28, 2023Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Cheng-Wei Chang, Min-Hsiu Hung, Chun-I Tsai, Ken-Yu Chang, Yi-Ying Liu
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Publication number: 20240096781Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.Type: ApplicationFiled: March 20, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
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Publication number: 20240096867Abstract: A semiconductor structure is provided and includes a first gate structure, a second gate structure, and at least one local interconnect that extend continuously across a non-active region from a first active region to a second active region. The semiconductor structure further includes a first separation spacer disposed on the first gate structure and first vias on the first gate structure. The first vias are arranged on opposite sides of the first separation spacer are isolated from each other and apart from the first separation spacer by different distances.Type: ApplicationFiled: December 1, 2023Publication date: March 21, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Charles Chew-Yuen YOUNG, Chih-Liang CHEN, Chih-Ming LAI, Jiann-Tyng TZENG, Shun-Li CHEN, Kam-Tou SIO, Shih-Wei PENG, Chun-Kuang CHEN, Ru-Gun LIU
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Patent number: 11929007Abstract: A display driving integrated circuit (IC) and a driving parameter adjustment method thereof are provided. The display driving IC includes a control circuit and a driving parameter determination circuit. The control circuit controls a current driving circuit and a scanning circuit according to a driving parameter, wherein the current driving circuit is suitable for driving multiple driving lines of a light emitting diode (LED) array, and the scanning circuit is suitable for driving multiple scanning lines of the LED array. The driving parameter determination circuit is coupled to the control circuit to provide the driving parameter. The driving parameter determination circuit dynamically adjusts the driving parameter for a target LED in the LED array according to a grayscale value of the target LED.Type: GrantFiled: August 11, 2022Date of Patent: March 12, 2024Assignee: Novatek Microelectronics Corp.Inventors: Chun-Wei Kang, Yi-Yang Tsai, Siao-Siang Liu, Shih-Hsuan Huang
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Patent number: 11924965Abstract: A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.Type: GrantFiled: April 25, 2022Date of Patent: March 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chun-Wei Chang, Jian-Hong Lin, Shu-Yuan Ku, Wei-Cheng Liu, Yinlung Lu, Jun He
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Patent number: 11782311Abstract: A backlight module includes a housing, a diffuser plate, an optical film, a holder and a light source. The housing has a groove. The groove is arranged along a periphery of the housing. The diffuser plate is disposed in the housing and has an edge located in the groove. The optical film is disposed on the diffuser plate and has a thru-hole. The holder is disposed in the groove of the housing and includes a holding portion and a hanging portion. The holding portion engages the edge of the diffuser plate. The hanging portion is connected to the holding portion and extends through the thru-hole of the optical film. The light source is disposed in the housing.Type: GrantFiled: March 22, 2022Date of Patent: October 10, 2023Assignee: AmTRAN Technology Co., Ltd.Inventors: Chun-Wei Liu, Chen-Han Huang, Chih-Kuei Wang
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Patent number: 11744449Abstract: An endoscopy system including an insertion tube segment, a handle segment, at least one heat source, a heat pipe and a heat-conductive material is provided. The insertion tube segment has first and second end portions opposite to each other and is inserted in the handle segment. An inside of the insertion tube segment and an inside of the handle segment commonly have a connecting space. The at least one heat source is disposed in the first end portion. The heat pipe is disposed in the connecting space and at least extends from a portion of the connecting space of the insertion tube segment to a portion of the connecting space of the handle segment. The heat-conductive material is disposed between the at least one heat source and the first end portion, and the heat-conductive material is thermally coupled to the at least one heat source and the heat pipe, respectively.Type: GrantFiled: November 5, 2020Date of Patent: September 5, 2023Assignee: ALTEK BIOTECHNOLOGY CORPORATIONInventors: Hsi-Hsin Loo, Chun-Wei Liu, Liang-Yi Li
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Patent number: 11652052Abstract: The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes a substrate, a copper layer, an organic composite protective layer, and a silver nanowire layer. The copper layer is disposed on the substrate. The nanowire-distribution-promotion layer is disposed between the copper layer and the silver nanowire layer.Type: GrantFiled: March 29, 2021Date of Patent: May 16, 2023Assignee: TPK Advanced Solutions Inc.Inventors: Xi-Zhao Wang, Yi-Min Jiang, Li-Wei Mu, Shan-Yu Wu, Chao-Hui Kuo, Can-Liang Zhao, Hong-Yan Lian, Chun-Wei Liu
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Publication number: 20220308398Abstract: A backlight module includes a housing, a diffuser plate, an optical film, a holder and a light source. The housing has a groove. The groove is arranged along a periphery of the housing. The diffuser plate is disposed in the housing and has an edge located in the groove. The optical film is disposed on the diffuser plate and has a thru-hole. The holder is disposed in the groove of the housing and includes a holding portion and a hanging portion. The holding portion engages the edge of the diffuser plate. The hanging portion is connected to the holding portion and extends through the thru-hole of the optical film. The light source is disposed in the housing.Type: ApplicationFiled: March 22, 2022Publication date: September 29, 2022Inventors: Chun-Wei LIU, Chen-Han HUANG, Chih-Kuei WANG
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Publication number: 20220308727Abstract: The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes a substrate, a copper layer, an organic composite protective layer, and a silver nanowire layer. The copper layer is disposed on the substrate. The nanowire-distribution-promotion layer is disposed between the copper layer and the silver nanowire layer.Type: ApplicationFiled: March 29, 2021Publication date: September 29, 2022Inventors: Xi-Zhao Wang, Yi-Min Jiang, Li-Wei Mu, Shan-Yu Wu, Chao-Hui Kuo, Can-Liang Zhao, Hong-Yan Lian, Chun-Wei Liu
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Patent number: 11317531Abstract: A microelectronic device includes an accommodating housing, a circuit board, an electronic component, and a conducting wire. The accommodating housing has an accommodating space therein. The circuit board is disposed within the accommodating space, and has a first and a second end surface disposed opposite to each other. The first end surface includes a first conductive contact, and a lateral side of the circuit board includes a receiving hole being a half-open hole extending from the second end surface. A second conductive contact is disposed on the surface of the receiving hole and electrically connected to the first conductive contact via an internal power layer of the circuit board. The electronic component is disposed on the first end surface and electrically connected to the first conductive contact. One end of the conducting wire is disposed in the receiving hole and electrically connected to the second conductive contact.Type: GrantFiled: July 12, 2019Date of Patent: April 26, 2022Assignee: ALTEK BIOTECHNOLOGY CORPORATIONInventors: Hsi-Hsin Loo, Chun-Wei Liu, Chao-Yu Chou
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Publication number: 20210364778Abstract: An endoscope device includes an insertion portion. The insertion portion includes a distal end. The distal end includes a lens holder, a lens disposed in the lens holder, an image sensor corresponding to the lens and a flexible circuit board electrically connected to the image sensor and a circuit board holder. The flexible circuit board is jointly clamped by the circuit board holder and the lens holder.Type: ApplicationFiled: July 5, 2020Publication date: November 25, 2021Applicant: ALTEK BIOTECHNOLOGY CORPORATIONInventors: Hsi-Hsin Loo, Chun-Wei Liu, Liang-Yi Li
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Publication number: 20210298588Abstract: An endoscopy system including an insertion tube segment, a handle segment, at least one heat source, a heat pipe and a heat-conductive material is provided. The insertion tube segment has first and second end portions opposite to each other and is inserted in the handle segment. An inside of the insertion tube segment and an inside of the handle segment commonly have a connecting space. The at least one heat source is disposed in the first end portion. The heat pipe is disposed in the connecting space and at least extends from a portion of the connecting space of the insertion tube segment to a portion of the connecting space of the handle segment. The heat-conductive material is disposed between the at least one heat source and the first end portion, and the heat-conductive material is thermally coupled to the at least one heat source and the heat pipe, respectively.Type: ApplicationFiled: November 5, 2020Publication date: September 30, 2021Applicant: ALTEK BIOTECHNOLOGY CORPORATIONInventors: Hsi-Hsin Loo, Chun-Wei Liu, Liang-Yi Li
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Patent number: 10909421Abstract: The training method for the phase image generator includes the following steps. Firstly, in each iteration, a loss value is generated, including: (1). the phase image generator generates a plurality of generated phase images using a phase image generation mode; (2). the phase image determiner determines a degree of difference between the generated phase images and original phase images; (3). the loss value of the generated phase images is generated according to the degree of difference. Then, a selector selects a stable loss value from the loss values, and uses the phase image generation mode in the iteration corresponding to the stable loss value as a selected phase image generation mode of the phase image generator.Type: GrantFiled: December 18, 2018Date of Patent: February 2, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chun-Wei Liu, Luan-Ying Chen, Kao-Der Chang
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Publication number: 20200221598Abstract: A microelectronic device includes an accommodating housing, a circuit board, an electronic component, and a conducting wire. The accommodating housing has an accommodating space therein. The circuit board is disposed within the accommodating space, and has a first and a second end surface disposed opposite to each other. The first end surface includes a first conductive contact, and a lateral side of the circuit board includes a receiving hole being a half-open hole extending from the second end surface. A second conductive contact is disposed on the surface of the receiving hole and electrically connected to the first conductive contact via an internal power layer of the circuit board. The electronic component is disposed on the first end surface and electrically connected to the first conductive contact. One end of the conducting wire is disposed in the receiving hole and electrically connected to the second conductive contact.Type: ApplicationFiled: July 12, 2019Publication date: July 9, 2020Inventors: HSI-HSIN LOO, CHUN-WEI LIU, CHAO-YU CHOU
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Publication number: 20200193224Abstract: The training method for the phase image generator includes the following steps. Firstly, in each iteration, a loss value is generated, including: (1). the phase image generator generates a plurality of generated phase images using a phase image generation mode; (2). the phase image determiner determines a degree of difference between the generated phase images and original phase images; (3). the loss value of the generated phase images is generated according to the degree of difference. Then, a selector selects a stable loss value from the loss values, and uses the phase image generation mode in the iteration corresponding to the stable loss value as a selected phase image generation mode of the phase image generator.Type: ApplicationFiled: December 18, 2018Publication date: June 18, 2020Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chun-Wei LIU, Luan-Ying CHEN, Kao-Der CHANG