Patents by Inventor Chun Wei MIN

Chun Wei MIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10097218
    Abstract: A radio frequency circuit is described, which comprises a first power amplifier comprising a first output, a second power amplifier comprising a second output, a third power amplifier comprising a third output, and a fourth power amplifier comprising a fourth output. The first power amplifier, the second power amplifier, the third power amplifier and the fourth power amplifier are configured to perform an amplification based on a radio communication signal to produce a first amplifier output signal, a second amplifier output signal, a third amplifier output signal, and a fourth amplifier output signal. Furthermore, the present application also relates to a transmitter comprising such a radio frequency amplifier circuit.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: October 9, 2018
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Teijo Henrikki Lehtinen, Chun Wei Min, Bruno Biscontini, Mattias Gustafsson
  • Publication number: 20170353198
    Abstract: A radio frequency circuit is described, which comprises a first power amplifier comprising a first output, a second power amplifier comprising a second output, a third power amplifier comprising a third output, and a fourth power amplifier comprising a fourth output. The first power amplifier, the second power amplifier, the third power amplifier and the fourth power amplifier are configured to perform an amplification based on a radio communication signal to produce a first amplifier output signal, a second amplifier output signal, a third amplifier output signal, and a fourth amplifier output signal. Furthermore, the present application also relates to a transmitter comprising such a radio frequency amplifier circuit.
    Type: Application
    Filed: August 22, 2017
    Publication date: December 7, 2017
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Teijo Henrikki LEHTINEN, Chun Wei MIN, Bruno BISCONTINI, Mattias GUSTAFSSON