Abstract: A semiconductor includes a substrate. A gate structure is disposed on the substrate. A liner oxide contacts a side of the gate structure. A silicon oxide spacer contacts the liner oxide. An end of the silicon oxide spacer forms a kink profile. A silicon nitride spacer contacts the silicon oxide spacer and a tail of the silicon nitride spacer covers part of the kink profile. A stressor covers the silicon nitride spacer and the substrate.

Abstract: A semiconductor device includes a fin-shaped structure on the substrate, a shallow trench isolation (STI) around the fin-shaped structure, a single diffusion break (SDB) structure in the fin-shaped structure for dividing the fin-shaped structure into a first portion and a second portion; a first gate structure on the fin-shaped structure, a second gate structure on the STI, and a third gate structure on the SDB structure. Preferably, a width of the third gate structure is greater than a width of the second gate structure and each of the first gate structure, the second gate structure, and the third gate structure includes a U-shaped high-k dielectric layer, a U-shaped work function metal layer, and a low-resistance metal layer.

Abstract: A solar cell module includes a first substrate, a second substrate, at least one cell unit, a first packaging film, a second packaging film, a first protective layer, a second protective layer, and a plurality of support members. The first substrate and the second substrate are disposed opposite to each other. The cell unit is disposed between the first substrate and the second substrate. The first packaging film is disposed between the cell unit and the first substrate. The second packaging film is disposed between the cell unit and the second substrate. The first protective layer is disposed between the cell unit and the first packaging film. The second protective layer is disposed between the cell unit and the second packaging film. The support members are respectively disposed between the first packaging film and the second packaging film and surround at least two opposite sides of the cell unit.

Abstract: A semiconductor structure includes a first transistor having a first source/drain (S/D) feature and a first gate; a second transistor having a second S/D feature and a second gate; a multi-layer interconnection disposed over the first and the second transistors; a signal interconnection under the first and the second transistors; and a power rail under the signal interconnection and electrically isolated from the signal interconnection, wherein the signal interconnection electrically connects one of the first S/D feature and the first gate to one of the second S/D feature and the second gate.

Abstract: A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin layer disposed between the cell unit and the first substrate; a crosslinked polymer layer disposed between the cell unit and the first thermosetting resin layer; and a second thermosetting resin layer disposed between the cell unit and the second substrate. The crosslinked polymer layer includes a crosslinked polymer, and the crosslinked polymer has a crosslinking degree of from 35.4 to 67.4%.

Abstract: A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin layer disposed between the cell unit and the first substrate; a first protective layer disposed between the cell unit and the first thermosetting resin layer; and a second thermosetting resin layer disposed between the cell unit and the second substrate. The first protective layer includes a first polymer, wherein the cross-linking degree of the first polymer is 0 to 42.3%.

Abstract: A modem chip, a communication device using the same and a method for dynamic controlling the same are provided. The method for dynamic controlling the modem chip includes the following steps. At least one traffic type factor or at least one channel condition factor is estimated. A cell-specific reference signal (CRS) reception mode is decided according to the traffic type factor or the channel condition factor. At least one hardware parameter is set according to the CRS reception mode to receive a plurality of cell-specific reference signals fully or partially.

Abstract: A method for dynamically controlling a radio frequency circuit, a modem chip and a communication device are provided. The method for dynamically controlling the radio frequency circuit includes the following steps. At least one operation information is obtained. The operation information includes a software information, a hardware information and a firmware information. A plurality of working modes of the radio frequency circuit are switched to fit the operation information.

Abstract: A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II) wherein A1 and A3 are independently tetravalent moiety; A2 is a divalent moiety; n?1; m?1; R1 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, or C6-12 aryl; and R2 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, C6-12 aryl, or a reactive functional group.

Abstract: A polyimide, a film composition, and film prepared from the same are provided. The polyimide is a product of a reactant (a) and a reactant (b). The reactant (a) consists of a first dianhydride and a second dianhydride. The first dianhydride has a structure represented by Formula (I) and the second dianhydride has a structure represented by Formula (II) wherein R1, R2 and Ar1 are as defined in specification. The reactant (b) includes a first diamine, wherein the first diamine is and R3, R4, R5, or R6 are as defined in specification.

Abstract: A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II) wherein A1 and A3 are independently tetravalent moiety; A2 is a divalent moiety; n?1; m?1; R1 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, or C6-12 aryl; and R2 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, C6-12 aryl, or a reactive functional group.

Abstract: In some embodiments, an input device includes a housing having a top surface, a touch sensor disposed on the top surface of the housing, and a processor disposed in the housing. The touch sensor can be configured to detect a contact by a hand on the top surface of the housing and generate touch data corresponding to the detected contact by the hand. The processor can be configured to control operation of the touch sensor and receive the touch data, determine an orientation of the hand with respect to the housing based on the touch data, and calibrate a detected movement of the input device based on the determined orientation of the hand with respect to the housing. An image sensor and/or one or more IMUs can be used to detect 2D and/or 3D movement of the input device.

Abstract: A material property rating method and a material property rating system are provided, which analyze the reliability of a target information of a target object provided by a target source through an analysis module, and then calculates the credibility of the target source based on the reliability of the target information through a credit rating module. Therefore, when the material property rating system is applied to a material information platform, the material property rating system can effectively avoid false information, and can save time and effort for the verification process, and can be trusted by consumers browsing the material information platform.

Abstract: A material recommendation system and a material recommendation method are provided, which use an analysis module to analyze at least one image to generate reference information, and then a recommendation module receives the reference information to provide target information corresponding to the reference information. By analyzing the image, target information including suitable materials can be quickly provided, thereby greatly accelerating the timeline of product development.

Abstract: In some embodiments, an input device includes a housing having a top surface, a touch sensor disposed on the top surface of the housing, and a processor disposed in the housing. The touch sensor can be configured to detect a contact by a hand on the top surface of the housing and generate touch data corresponding to the detected contact by the hand. The processor can be configured to control operation of the touch sensor and receive the touch data, determine an orientation of the hand with respect to the housing based on the touch data, and calibrate a detected movement of the input device based on the determined orientation of the hand with respect to the housing. An image sensor and/or one or more IMUs can be used to detect 2D and/or 3D movement of the input device.

Abstract: In some embodiments, an input device includes a housing having a top surface, a touch sensor disposed on the top surface of the housing, and a processor disposed in the housing. The touch sensor can be configured to detect a contact by a hand on the top surface of the housing and generate touch data corresponding to the detected contact by the hand. The processor can be configured to control operation of the touch sensor and receive the touch data, determine an orientation of the hand with respect to the housing based on the touch data, and calibrate a detected movement of the input device based on the determined orientation of the hand with respect to the housing. An image sensor and/or one or more IMUs can be used to detect 2D and/or 3D movement of the input device.