Abstract: The present invention provides a vertically stacked light-emitting diode (LED) structure, which comprises a substrate, a first light-emitting device, a first reflection layer, a second light-emitting device, a second reflection layer, and a third light-emitting device. The layers are stacked sequentially. The first light-emitting device, the second light-emitting device, and the third light-emitting device are connected electrically to the pads located on the edges of the substrate. In addition, the first reflection layer and the second reflection layer are used to reflect and filter the light from the first light-emitting device, the second light-emitting device, and the third light-emitting device. By using this structure, the area of the light-emitting diode structure can be further shrunk.

Abstract: A micro light emitting diode (LED) is provided. The micro LED includes a first light emitting unit and a second light emitting unit disposed on a top of the first light emitting unit. A first electrode of the first light emitting unit is inserted through a groove of the second light emitting unit and electrically connected with a substrate. A third light emitting unit is either shielded by the first light emitting unit or arranged at one side of the first light emitting unit. The first light emitting unit, the second light emitting unit, and the third light emitting unit are connected with a common connection point of the substrate by respective common electrodes. Thus an area of a light emitting surface of the micro LED is further reduced.

Abstract: A display panel includes a substrate and a plurality of pixel structures disposed on the substrate. Each of the pixel structures includes a first light-emitting element, a second light-emitting element, and a third light-emitting element. The first light-emitting element is disposed on the substrate and configured to generate a first colored light. A light output surface of the first light-emitting element includes a combined region. The second light-emitting element is disposed on a part of the combined region and configured to generate a second colored light. The third light-emitting element is disposed on the other part of the combined region and configured to generate a third colored light.

Abstract: A micro light-emitting diode (LED) display is provided. The micro LED display includes a panel, at least one first pixel, and a least one second pixel. The panel is provided with a first display area and a second display area. The first pixel is disposed on the first display area and including a first sub-pixel. The first pixel receives a first control signal. The second pixel which includes a plurality of second sub-pixels is arranged at the second display area and receiving a second control signal. Thereby the display with pixel variation is provided for lower power consumption and reduced manufacturing cost.

Abstract: The present invention provides a micro light-emitting diode (LED). A conductive layer is disposed on a substrate. A light-emitting assembly is disposed on the conductive layer. A first light-emitting semiconductor and a second light-emitting semiconductor of the light-emitting assembly are stacked vertically. A first conductive bump and a second conductive bump of a conductive bump set electrical conduct the first light-emitting semiconductor and the second light-emitting semiconductor. Thereby, the volume of the micro LED can be shrunk.

Abstract: The present invention provides a method of inkjet printing, which comprises the following steps: using a first inkjet printhead member of an inkjet device to print the first ink on a carrier and forming a first drop; after a first time, a second inkjet printhead member of the inkjet device printing the second ink on the carrier and forming a second drop, the first drop and the second drop overlapping and forming a mixing region; the second drop in the mixing region supersaturating the first drop and precipitating a nucleus in the mixing region; and the second drop continuing to mix with the first drop and extending the mixing region, and the nucleus continuing to precipitate in the mixing region and forming a crystal.

Abstract: The present invention provides a micro light-emitting diode panel structure, which comprises a substrate with two regions. A first region of the substrate includes a first light-emitting layer, a second light-emitting layer, and a third light-emitting layer stacked sequentially. The substrate, the first light-emitting layer, the second light-emitting layer, and the third light-emitting layer are connected electrically via fan-out circuit layers, respectively. When one or more of the light-emitting layers is damaged, one or more first alternate light-emitting layer is disposed in the second region correspondingly for repairing the micro light-emitting diode panel.

Abstract: The present invention provides a micro light-emitting diode structure, which comprises: a first light-emitting layer, a second light-emitting layer, a third light-emitting layer, a first dielectric layer, a second dielectric layer, and a third dielectric layer stacked on one another sequentially. The first light-emitting layer, the second light-emitting layer, and the third light-emitting layer are connected electrically by fan-out circuit layers, respectively. A first area of the first dielectric layer is greater than a second area of the second dielectric layer. The second area is greater than a third area of the third dielectric layer. A first refractive index of the first dielectric layer is smaller than a second refractive index of the second dielectric layer. The second refractive index is smaller than a third refractive index of the third dielectric layer. By using this structure, the light-emitting angle of a micro LED can be further shrunk.

Abstract: The invention discloses an ejector device for ejecting a chip disposed on a thin film. The chip has a first length in a first direction and a first width in a second direction. The ejector device comprises a pin cover defining a contacting surface. A pin hole, disposed on the contacting surface, has a second length in the first direction and a second width in the second direction. The contacting surface is configured to come into contact with the thin film. When the first length is larger than the second length, the first width is not larger than the second width. When the first width is larger than the second width, the first length is not larger than the second length.

Abstract: Mobile financial transaction system and method are disclosed for use with mobile payment and secure financial service platform. With the method and system disclosed, users can perform mobile financial transactions with a handheld mobile device. First, a billing information is acquired through the Internet and/or image capturing, and then a microSD flash memory card embedded with security chip and containing a personal financial information and/or near field communication technology is used to communicate with nearby payment devices to acquire a payment information. The payment information is then transferred to a payment gateway to finish a financial transaction. In addition, a secure value added service platform provides follow-up financial services.

Abstract: A cutting method for wafer-level packaging capable of protecting the contact pad, in which several cavities and precutting lines are formed at the front surface of a cap wafer, and the depth of each precutting line is lesser than the thickness of the cap wafer, followed by the bonding of the cap wafer to the device wafer, which has several devices and several bonding pads disposed on the surface of the device wafer, followed by performing a wafer dicing process, along the precutting lines cutting through the cap wafer, and after removing a portion of the cap wafer that is not bonded to the device wafer, for exposing the bonding pads at the surface of the device wafer, and finally performing a dicing process for forming many packaged dies.

Abstract: A wafer having a plurality of through holes is provided, and a glass wafer is disposed on the wafer. A plate having a plurality of concave cavities is disposed on the glass wafer, wherein the concave cavities corresponding to the through holes of the wafer so that a part of the plate corresponding to the through holes is not in contact with the glass wafer. A voltage source is provided, and two electrodes thereof respectively have electrical connections to the wafer and the plate. The wafer and the glass wafer are bonded to each other by the anodic bonding method so that a plurality of optical device caps are formed.

Abstract: A cutting method for wafer-level packaging capable of protecting the contact pad, in which several cavities and precutting lines are formed at the front surface of a cap wafer, and the depth of each precutting line is lesser than the thickness of the cap wafer, followed by the bonding of the cap wafer to the device wafer, which has several devices and several bonding pads disposed on the surface of the device wafer, followed by performing a wafer dicing process, along the precutting lines cutting through the cap wafer, and after removing a portion of the cap wafer that is not bonded to the device wafer, for exposing the bonding pads at the surface of the device wafer, and finally performing a dicing process for forming many packaged dies.

Abstract: A wafer having a plurality of through holes is provided, and a glass wafer is disposed on the wafer. A plate having a plurality of concave cavities is disposed on the glass wafer, wherein the concave cavities corresponding to the through holes of the wafer so that a part of the plate corresponding to the through holes is not in contact with the glass wafer. A voltage source is provided, and two electrodes thereof respectively have electrical connections to the wafer and the plate. The wafer and the glass wafer are bonded to each other by the anodic bonding method so that a plurality of optical device caps are formed.

Abstract: A tunable optical add-drop multiplexer (OADM) based on an SOI (silicon-on-insulator) wafer is disclosed. The tunable OADM includes a multimode interference region, at least a grating formed on the multimode interference region, and at least two electrodes formed on two sides of the multimode interference region and having carriers induced thereinto, thereby a variation of an optical waveguide in the grating is controlled through controlling the carriers induced into the electrodes so as to further control different propagation of wavelength signals.

Abstract: A tunable optical add-drop multiplexer (OADM) based on an SOI (silicon-on-insulator) wafer is disclosed. The tunable OADM includes a multimode interference region, at least a grating formed on the multimode interference region, and at least two electrodes formed on two sides of the multimode interference region and having carriers induced thereinto, thereby a variation of an optical waveguide in the grating is controlled through controlling the carriers induced into the electrodes so as to further control different propagation of wavelength signals.