Patents by Inventor Chun-Wei TSENG

Chun-Wei TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240405095
    Abstract: A method for manufacturing an insulated gate bipolar transistor includes (a) providing a substrate comprising a front side and a back side; (b) forming at least one front side element and at least one front side metal layer on the front side of the substrate; (c) performing a thinning process on the back side of the substrate; (d) performing a laser pre-treatment process on the back side of the substrate; (e) performing at least one ion doping process on the back side of the substrate for forming at least one ion doping layer; (f) performing an annealing process on the back side of the substrate; and (g) forming a collector metal layer on the back side of the substrate.
    Type: Application
    Filed: January 29, 2024
    Publication date: December 5, 2024
    Inventors: Ta-Wei Tseng, Yun-Kuei Chiu, Chun-Sheng Chen
  • Publication number: 20240394462
    Abstract: An electromigration (EM) sign-off methodology that utilizes a system for analyzing an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes a memory and a processor configured for calculating adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat dissipating elements located within a defined thermal coupling volume or range of the heat sensitive structures.
    Type: Application
    Filed: July 31, 2024
    Publication date: November 28, 2024
    Inventors: Hsien Yu TSENG, Amit KUNDU, Chun-Wei CHANG, Szu-Lin LIU, Sheng-Feng LIU
  • Patent number: 12153868
    Abstract: An integrated circuit includes a plurality of metal lines extending along a first direction, the plurality of metal lines being separated, in a second direction perpendicular to the first direction, by integral multiples of a nominal minimum pitch. The integrated circuit further includes a plurality of standard cells, at least one of the plurality of standard cells having a cell height along the second direction being a non-integral multiple of the nominal minimum pitch.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: November 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shang-Chih Hsieh, Chun-Fu Chen, Ting-Wei Chiang, Hui-Zhong Zhuang, Hsiang-Jen Tseng
  • Publication number: 20240389081
    Abstract: In an example, a User Equipment (UE) receives a message associated with Physical Downlink Shared Channel (PDSCH) parameter configuration. The message includes a first parameter indicating a first list of entries associated with time resource allocation for multiple PDSCHs, a second parameter indicating reception of multiple repetitions for a single PDSCH, and a third parameter indicating a second list of entries associated with time resource allocation. Each entry in the second list indicates a single time resource allocation. If the UE receives a Downlink Control Information (DCI) indicative of a first entry in the first list, the UE receives a plurality of PDSCHs based on a plurality of time resource allocations indicated by the first entry. A first repetition number for the plurality of PDSCHs is determined to be one.
    Type: Application
    Filed: July 10, 2024
    Publication date: November 21, 2024
    Inventors: Chun-Wei Huang, Li-Chih Tseng
  • Publication number: 20240349515
    Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region and a second cell region and a diffusion region on the substrate extending through the first cell region and the second cell region. Preferably, the diffusion region includes a first H-shape and a second H-shape according to a top view.
    Type: Application
    Filed: June 27, 2024
    Publication date: October 17, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Yen Tseng, Shu-Ru Wang, Yu-Tse Kuo, Chang-Hung Chen, Yi-Ting Wu, Shu-Wei Yeh, Ya-Lan Chiou, Chun-Hsien Huang
  • Patent number: 12099792
    Abstract: An electromigration (EM) sign-off methodology that utilizes a system for analyzing an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes a memory and a processor configured for calculating adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat dissipating elements located within a defined thermal coupling volume or range of the heat sensitive structures.
    Type: Grant
    Filed: June 26, 2023
    Date of Patent: September 24, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsien Yu Tseng, Amit Kundu, Chun-Wei Chang, Szu-Lin Liu, Sheng-Feng Liu
  • Publication number: 20240311542
    Abstract: A rectilinear-block placement method includes disposing a first sub-block of each flexible block on a layout area of a chip canvas according to a reference position, generating an edge-depth map relative to first sub-blocks of flexible blocks on the layout area, predicting positions of second sub-blocks of the flexible blocks with depth values on the edge-depth map by a machine learning model, and positioning the second sub-blocks on the layout area according to the predicted positions of the second sub-blocks of the flexible blocks.
    Type: Application
    Filed: December 27, 2023
    Publication date: September 19, 2024
    Applicant: MEDIATEK INC.
    Inventors: Jen-Wei Lee, Yi-Ying Liao, Te-Wei Chen, Kun-Yu Wang, Sheng-Tai Tseng, Ronald Kuo-Hua Ho, Bo-Jiun Hsu, Wei-Hsien Lin, Chun-Chih Yang, Chih-Wei Ko, Tai-Lai Tung
  • Publication number: 20240303408
    Abstract: The application discloses a method and a system for shaping flexible blocks on a chip canvas in an integrated circuit design. An input is received describing geometric features of flexible blocks. A set of flexible blocks are generated based on the input. Obtained block areas of the set of flexible blocks are computed. Whether the set of flexible blocks are legal is determined based on determining whether area differences between the obtained block areas and a plurality of required areas for the set of flexible blocks meet a requirement. The set of flexible blocks are updated until the set of flexible blocks are all legal.
    Type: Application
    Filed: March 7, 2024
    Publication date: September 12, 2024
    Inventors: Kun-Yu WANG, Sheng-Tai TSENG, Yi-Ying LIAO, Jen-Wei LEE, Ronald Kuo-Hua HO, Bo-Jiun HSU, Te-Wei CHEN, Chun-Chih YANG, Tai-Lai TUNG
  • Patent number: 12078532
    Abstract: An information handling system includes a display panel having an active area that generates visual images and an inactive area disposed outside the active area. The inactive area having an alignment mark that is invisible to a naked eye.
    Type: Grant
    Filed: October 7, 2022
    Date of Patent: September 3, 2024
    Assignee: Dell Products L.P.
    Inventors: Hong-Ji Huang, Yu-Chen Liu, Kuo-Wei Tseng, Chun-Wei Huang, Chi-Fong Lee
  • Patent number: 12069627
    Abstract: In an example, a User Equipment (UE) receives a message associated with Physical Downlink Shared Channel (PDSCH) parameter configuration. The message includes a first parameter indicating a first list of entries associated with time resource allocation for multiple PDSCHs, a second parameter indicating reception of multiple repetitions for a single PDSCH, and a third parameter indicating a second list of entries associated with time resource allocation. Each entry in the second list indicates a single time resource allocation. If the UE receives a Downlink Control Information (DCI) indicative of a first entry in the first list, the UE receives a plurality of PDSCHs based on a plurality of time resource allocations indicated by the first entry. A first repetition number for the plurality of PDSCHs is determined to be one.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: August 20, 2024
    Assignee: ASUSTek Computer Inc.
    Inventors: Chun-Wei Huang, Li-Chih Tseng
  • Patent number: 12063791
    Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region and a second cell region and a diffusion region on the substrate extending through the first cell region and the second cell region. Preferably, the diffusion region includes a first H-shape and a second H-shape according to a top view.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: August 13, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Yen Tseng, Shu-Ru Wang, Yu-Tse Kuo, Chang-Hung Chen, Yi-Ting Wu, Shu-Wei Yeh, Ya-Lan Chiou, Chun-Hsien Huang
  • Patent number: 12062151
    Abstract: An image processing circuit performs super-resolution (SR) operations. The image processing circuit includes memory to store multiple parameter sets of multiple artificial intelligence (AI) models. The image processing circuit further includes an image guidance module, a parameter decision module, and an SR engine. The image guidance module operates to detect a representative feature in an image sequence including a current frame and past frames within a time window. The parameter decision module operates to adjust parameters of one or more AI models based on a measurement of the representative feature. The SR engine operates to process the current frame using the one or more AI models with the adjusted parameters to thereby generate a high-resolution image for display.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: August 13, 2024
    Assignee: MediaTek Inc.
    Inventors: Ming-En Shih, Ping-Yuan Tsai, Yu-Cheng Tseng, Kuo-Chen Huang, Kuo-Chiang Lo, Hsin-Min Peng, Chun Hsien Wu, Pei-Kuei Tsung, Tung-Chien Chen, Yao-Sheng Wang, Cheng Lung Jen, Chih-Wei Chen, Chih-Wen Goo, Yu-Sheng Lin, Tsu Jui Hsu
  • Patent number: 12058705
    Abstract: In an example, a device receives a configuration of a sidelink resource pool for sidelink data transmission and sidelink reference signal transmission. The device determines to perform a sidelink reference signal transmission in a first Transmission Time Interval (TTI) of the sidelink resource pool, wherein the sidelink reference signal transmission is associated with a destination identity (ID) and a source ID, and the sidelink reference signal transmission has a highest priority among one or more pending sidelink reference signals and one or more sidelink logical channels with pending sidelink data. The device generates a first sidelink data packet based on a first sidelink logical channel with first pending sidelink data, wherein the first sidelink data packet is associated with the destination ID and the source ID. The device performs, in the first TTI, the sidelink reference signal transmission and a sidelink data transmission for transmitting the first sidelink data packet.
    Type: Grant
    Filed: December 27, 2023
    Date of Patent: August 6, 2024
    Assignee: ASUS Technology Licensing Inc.
    Inventors: Ming-Che Li, Li-Chih Tseng, Li-Te Pan, Chun-Wei Huang
  • Patent number: 12051388
    Abstract: A transmitter device adapted to be coupled to an image providing device and a receiver device includes first and second conversion units, a wireless module, and a processing unit. The first conversion unit and the second conversion unit are configured to be coupled to the image providing device through an HDMI transmission cable and a Type-C transmission cable, respectively, so as to respectively receive a first video and audio stream and a second video and audio stream provided by the image providing device. The wireless module is connected to the receiver device through wireless communication. The processing unit preferentially selects the first conversion unit to receive a first video and audio signal output by converting the first video and audio stream by the first conversion unit and transmits the first video and audio signal to the receiver device through the wireless module.
    Type: Grant
    Filed: February 14, 2023
    Date of Patent: July 30, 2024
    Assignee: BenQ Corporation
    Inventors: Chen-Chi Wu, Chin-Fu Chiang, Chun-Han Lin, Chia-Nan Shih, Jung-Kun Tseng, Chuang-Wei Wu
  • Publication number: 20240243124
    Abstract: A method for fabricating a semiconductor device includes the steps of first forming a first gate structure on a substrate and then forming a first epitaxial layer adjacent to the first gate structure. Preferably, a top surface of the first epitaxial layer includes a first curve, a second curve, and a third curve connecting the first curve and the second curve, in which the first curve and the second curve include curves concave downward while the third curve includes a curve concave upward.
    Type: Application
    Filed: February 15, 2023
    Publication date: July 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Wei Yang, Shih-Min Lu, Chi-Sheng Tseng, Yao-Jhan Wang, Chun-Hsien Lin
  • Patent number: 10642666
    Abstract: A gateway, an Internet of Things (IoT) device control system and a method thereof are provided. The method includes: receiving an event message; obtaining a first fact record corresponding to the event message according to the event message; inferring an intention corresponding to a user according to the first fact record; determining a service to be provided to the user according to the intention corresponding to the user; and outputting an output message to a first IoT device according to the determined service such that the first IoT device provides the service according to the output message.
    Type: Grant
    Filed: September 30, 2017
    Date of Patent: May 5, 2020
    Assignees: Tatung Company, TATUNG UNIVERSITY
    Inventors: Fu-Chiung Cheng, Chun-Wei Tseng
  • Publication number: 20190223244
    Abstract: A method for avoiding establishing an inefficient wireless connection for a communications apparatus capable of supporting cellular communications and WLAN communications includes: receiving a beacon frame from a first network device, wherein the first network device is a WLAN network device which provides wireless communications service in a predetermined wireless local area network; identifying the first network device according to an identifier obtained from the beacon frame; determining whether to connect to the first network device according to a connectivity record of the first network device or a usage scenario of the communications apparatus; and not connecting to the first network device if a WLAN connection to be established with the first network device is determined as an inefficient connection.
    Type: Application
    Filed: January 12, 2018
    Publication date: July 18, 2019
    Inventors: Sheng-Hung LAI, Wei-Hsuan LIEN, Chun-Wei TSENG, Ya-Ti HAO
  • Publication number: 20190065288
    Abstract: A gateway, an Internet of Things (IoT) device control system and a method thereof are provided. The method includes: receiving an event message; obtaining a first fact record corresponding to the event message according to the event message; inferring an intention corresponding to a user according to the first fact record; determining a service to be provided to the user according to the intention corresponding to the user; and outputting an output message to a first IoT device according to the determined service such that the first IoT device provides the service according to the output message.
    Type: Application
    Filed: September 30, 2017
    Publication date: February 28, 2019
    Applicants: Tatung Company, TATUNG UNIVERSITY
    Inventors: Fu-Chiung Cheng, Chun-Wei Tseng
  • Patent number: 9577468
    Abstract: A wireless charging receiving device includes a body, a metal housing, a receiving coil, and a power storage device. The metal housing is coupled to the body to form an accommodating space. The metal housing includes an aperture and at least one slit. The slit interconnects the aperture and the edge of the metal housing. The receiving coil is disposed between the metal housing and the body. The receiving coil defines a through hole by a looped configuration, and the through hole overlaps at least part of the aperture of the metal housing. The power storage device is disposed within the accommodating space and electrically connected to the receiving coil. Electromagnetic waves are able to pass through the aperture of the metal housing and are magnetically coupled to the receiving coil, such that the receiving coil transfers the energy of the electromagnetic waves to the power storage device.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: February 21, 2017
    Assignee: HTC Corporation
    Inventors: Chun-Wei Tseng, Chien-Ting Ho, Chien-Chih Chen, Yen-Liang Kuo
  • Publication number: 20160352136
    Abstract: A wireless charging receiving device includes a body, a metal housing, a receiving coil, and a power storage device. The metal housing is coupled to the body to form an accommodating space. The metal housing includes an aperture and at least one slit. The slit interconnects the aperture and the edge of the metal housing. The receiving coil is disposed between the metal housing and the body. The receiving coil defines a through hole by a looped configuration, and the through hole overlaps at least part of the aperture of the metal housing. The power storage device is disposed within the accommodating space and electrically connected to the receiving coil. Electromagnetic waves are able to pass through the aperture of the metal housing and are magnetically coupled to the receiving coil, such that the receiving coil transfers the energy of the electromagnetic waves to the power storage device.
    Type: Application
    Filed: August 11, 2016
    Publication date: December 1, 2016
    Inventors: Chun-Wei TSENG, Chien-Ting HO, Chien-Chih CHEN, Yen-Liang KUO