Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.

Abstract: A Totem Pole PFC circuit includes at least one fast-switching leg, a slow-switching leg, and a control unit. Each fast-switching leg includes a fast-switching upper switch and a fast-switching lower switch. The slow-switching leg is coupled in parallel to the at least one fast-switching leg, and the slow-switching leg includes a slow-switching upper switch and a slow-switching lower switch. The control unit receives an AC voltage with a phase angle, and the control unit includes a current detection loop, a voltage detection loop, and a control loop. The control loop generates a second control signal assembly to respectively control the slow-switching upper switch and the slow-switching lower switch. The control loop controls the second control signal assembly to follow the phase angle, and dynamically adjusts a duty cycle of the second control signal assembly to turn on or turn off the slow-switching upper switch and the slow-switching lower switch.

Abstract: A semiconductor device includes a gate electrode over a channel region of a semiconductor fin, first spacers over the semiconductor fin, and second spacers over the semiconductor fin. A lower portion of the gate electrode is between the first spacers. An upper portion of the gate electrode is above the first spacers. The second spacers are adjacent the first spacers opposite the gate electrode. The upper portion of the gate electrode is between the second spacers.

Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region and a diffusion region on the substrate extending through the first cell region, the second cell region, the third cell region, and the fourth cell region. Preferably, the diffusion region includes a H-shape according to a top view.

Abstract: An installing module includes a seat bracket, a plurality of lower gaskets, a device bracket and an upper gasket. The seat bracket includes a first locking plate and a second locking plate locked to each other. The first locking plate includes a first concave and the second locking plate includes a second concave corresponding to the first concave. The lower gaskets are respectively disposed on the first concave and the second concave. The lower gaskets face each other and jointly define a lower assembly hole and are disposed on a lower side of a head-support fixer of a car seat. The device bracket is locked to the seat bracket and an electronic device is pivotally coupled to the device bracket. The upper gasket is disposed between the device bracket and the head-support fixer, and the head-support fixer is clamped between the upper gasket and the lower gaskets.

Abstract: A power supply with a separable communication module includes a casing with a port; a main board placed in the casing and having a power conversion circuit; a sub-board electrically connected to the power conversion circuit and provided with at least one first connector; and a communication module. The power conversion circuit has at least one electrical connection terminal. A first interface of the first connector faces the port. The communication module includes a first circuit board and a communication circuit disposed on the first circuit board, the first circuit board has an electrical connection part electrically connected to the communication circuit, the electrical connection part has a first state of connecting with the first interface, and a second state of detaching from the first interface.

Abstract: A display device enabling external objects to be shown therein comprises a main body formed with a space, a backlight module disposed in the space and a display module disposed in the space. The backlight module comprises a light projection surface, the display and backlight modules are separately disposed by a spacing for at least one external object to locate therein. The display module comprises a transparent display structure, a first optical film disposed on one side of the transparent display structure facing the surface, and a second optical film disposed on the other side. The first optical film enables a light projected by the backlight module and a light reflected by the main body to pass through. The second optical film enables a light from the transparent display structure to pass through, and reflects an ambient light outside the main body.

Abstract: A method for manufacturing capacitive touch control panel and a capacitive touch control panel are provided. The method includes forming a sensing circuit on a substrate and then forming a communicating structure on the substrate. The communicating structure is conductive, and is disposed to be near at least two adjacent side walls of the substrate. A gap is formed between the communicating structure and the plurality of the sensing electrodes that are near the communicating structure. The next step is to form a plurality of bridging structures for connecting the plurality of the sensing electrodes and the communicating structure. The last step is to remove a portion of the communicating structure by laser cutting to form a plurality of output cables.

Abstract: A method for manufacturing capacitive touch control panel and a capacitive touch control panel are provided. The method includes forming a sensing circuit on a substrate and then forming a communicating structure on the substrate. The communicating structure is conductive, and is disposed to be near at least two adjacent side walls of the substrate. A gap is formed between the communicating structure and the plurality of the sensing electrodes that are near the communicating structure. The next step is to form a plurality of bridging structures for connecting the plurality of the sensing electrodes and the communicating structure. The last step is to remove a portion of the communicating structure by laser cutting to form a plurality of output cables.

Abstract: A touch display device includes a display module, a touch module and a light-transmitting substrate. The display module has a display surface and a bottom surface opposite to the display surface. The touch module is fixed to the display surface by an adhesive. The adhesive, the touch module and the display surface jointly define an accommodating space between the display module and the touch module. The light-transmitting substrate is disposed in the accommodating space. One side of the light-transmitting substrate is fixed to the display surface by a first optical adhesive, and the other side of the light-transmitting substrate is fixed to the touch module by a second optical adhesive. An adhesive strength of the adhesive is higher than an adhesive strength of the first optical adhesive, and the adhesive strength of the adhesive is higher than an adhesive strength of the second optical adhesive.

Abstract: A computer case including a frame, a motherboard stand and a motherboard extension stand is provided. The frame includes a front plate, a rear plate, a top plate and a bottom plate. The motherboard stand is adjacent to the top plate and the rear plate. The motherboard extension stand is connected to the motherboard stand and has a first position or a second position. When the motherboard extension stand is located at the first position, the motherboard extension stand and the motherboard stand are disposed in parallel, and two sides of the motherboard extension stand are respectively connected to the motherboard stand and the front plate. When the motherboard extension stand is located at the second position, the motherboard extension stand is parallel to the front plate and the rear plate, and located between the front plate and the rear plate.

Abstract: A computer case including a frame, a motherboard stand and a motherboard extension stand is provided. The frame includes a front plate, a rear plate, a top plate and a bottom plate. The motherboard stand is adjacent to the top plate and the rear plate. The motherboard extension stand is connected to the motherboard stand and has a first position or a second position. When the motherboard extension stand is located at the first position, the motherboard extension stand and the motherboard stand are disposed in parallel, and two sides of the motherboard extension stand are respectively connected to the motherboard stand and the front plate. When the motherboard extension stand is located at the second position, the motherboard extension stand is parallel to the front plate and the rear plate, and located between the front plate and the rear plate.

Abstract: A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion d having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers.

Abstract: A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have, a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion d having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers.

Abstract: A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion and having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers.

Abstract: A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion and having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers.