Abstract: Systems and methods are disclosed for processing image data to provide adjusted pixel information that achieves smoothed output discontinuities. In one exemplary embodiment, there is provided a method of processing image data including analyzing first display information including pixel data indicative of pixel display on a graphical user interface, detecting one or more ramp steps in the pixel data, and assigning, in association with random number generation and/or threshold setting functionality, a carry possibility for a pixel adjacent the one or more ramp steps. Other exemplary implementations may include generating second display information included adjusted pixel data for pixels adjacent the ramp steps. Consistent with certain implementations, the second display information may include pixel values adjusted according to the carry possibility in one or both of the temporal domain and/or spatial domain.

Abstract: A stocking to be worn on a foot of a person, includes a flattenable hollow tube of stretch material having a first portion with a first open end, a second portion extending from the first portion and having a second open end, and a folded portion folded backward from the second open end of the second portion to surround the second portion and having a circumferentially extending connecting part secured to the second portion along a circumferentially extending securing line, and a circumferentially extending open part movable between a folded position, where the circumferentially extending open part of the folded portion is folded back to surround a corresponding area of the second portion, and an unfolded position, where the circumferentially extending open part of the folded portion is extended forward from the second open end of the second portion away from the second portion.

Abstract: A light source device includes a circuit board, a solid state lighting element, and a hollow cylindrical metal reflector. The circuit board has a circuit layer formed thereon. The solid state lighting element is placed on the circuit board and electrically connected to the circuit layer. The hollow cylindrical metal reflector is placed on the circuit board and insulated from the circuit layer. An inner surface of the reflector surrounds the solid state lighting element to reflect and direct light from the solid state lighting element towards an opposite side of the reflector to the solid state lighting element.

Abstract: A power-off circuit includes a power unit (10), a power management unit (20), an integrated circuit chip (IC chip, 40), a switching apparatus (30), and a clamp circuit (70). The switching apparatus produces and transmits a power-off instruction to the power management unit. The power management unit produces and transmits a power-off notice to the IC chip in accordance with the power-off instruction. And the IC chip feeds back a power-off affirmation in accordance with the power-off notice to the clamp circuit. The clamp circuit receives the power-off affirmation and produces and transmits interrupted power-off signals to the power management unit, till the power management unit completely cuts off power supplied from the power unit to the IC chip.

Abstract: A hybrid step motor comprises a stator, a rotor assembly, a magnet and a mandrel. The rotor assembly and the magnet are mounted on the mandrel and are disposed in the stator. The proportion of a stator outer diameter to a stator inner diameter is 1:0.475 to 1:0.6. The proportion of the stator outer diameter to a rotor outer diameter is 1:0.5125 to 1:0.5875. The proportion of a first rotor thickness to a magnet thickness to a second rotor thickness is 0.236:0.09:0.236 optimally. The proportion of the rotor outer diameter to a magnet outer diameter is 0.54:0.45. By such arrangements, the optimal proportion is formed and the output efficiency is improved.

Abstract: The invention relates to a method for fabricating a package structure of stacked chips, comprising the following steps: firstly, providing a substrate; attaching a first chip and a second chip on the upper surface of the substrate, in which the second chip is stacked on the upper side of the first chip; then connecting a first bonding wire between a second solder pad of the second chip and a first region of a first solder pad of the first chip; and connecting a second bonding wire between a second region of the first solder pad of the first chip and the metal contact of the substrate, whereby the invention is capable of tremendously reducing the volume as a whole, effectively solving the problem of having much bonding wire circuit, and reducing the volume and quantity occupied by the solder pads on the substrate, thereby reducing complexity of the circuit layout on the substrate.

Abstract: A power adapter and conversion method for converting an alternating voltage to a direct voltage supplied to a load are provided. The power conversion method includes the following steps. The alternating voltage is received and filtered to generate a filter voltage. The filter voltage is received and rectified to generate a rectified voltage. A bulk capacitor is provided for receiving the rectified voltage to generate an output voltage. A transformer having a primary side and a secondary side is provided. The primary side is coupled to a bulk capacitor to receive the output voltage. The secondary side generates the direct voltage and is coupled to the load. The alternating voltage is detected. When the alternating voltage is greater than a predetermined value, a circuit between the bulk capacitor and the alternating voltage is broken.

Abstract: A file display system is provided. The file display system includes a MCU (10), a display control unit (20) and a display unit (30). The MCU receives power-on commands and power-off commands from a control unit (50). According to the preferred embodiment, upon receiving a power-off command, the MCU reads a next page data content of a currently displayed page from a storage apparatus (40) and stores the next page data content in the display control unit; and upon receiving a following power-on command, the MCU enables the display control unit, and the display control unit controls the next page data content stored therein to be displayed on the display unit, the next page data content therefore becomes a currently displayed page. A related method is also provided.

Abstract: A light emitting diode illuminating apparatus for emitting colorful light includes a substrate, a first lighting element, a second lighting element, a third lighting element. The first, second and third lighting elements are juxtaposed at the substrate. The first lighting element includes a first LED chip, and a first filling layer encapsulating it. The first filling layer includes red phosphor generally evenly doped therein. The second lighting element includes a second LED chip and a second filling layer encapsulating it. The third lighting element includes a third LED chip and a third filling layer encapsulating it. All of the first, the second and the third LED chips are the same kind of LED chip selected from the group consisting of GaN LED chips, AlGaN LED chips and InGaN LED chips. Light emitting from the filling layers are capable of mixing to produce light of a uniform color.

Abstract: A light emitting device driving circuit, includes: a switch device, a comparator, a driving module, a time counting circuit and a compensation module. The switch device is turned on or off according to a control signal for controlling a driving current flowing through the light emitting device. The comparator generates a comparison result according to a reference voltage and a feedback voltage corresponding to the driving current. The driving module generates the control signal according to the comparison result. The time counting circuit controls the driving module to turn on the switch device after the switch device turns off for a predetermined time. The compensation module detects a turn on time for the switch device and a delay time between the feedback voltage reaching the reference voltage value and the control signal varying correspondingly, and adjusts the reference voltage according to the turn on time and the delay time.

Abstract: A motor bearing preload mechanism is a modulized object composed of a screw, a resilient pad and a connecting pad to be fixed in a motor housing of a motor so as to apply a pre-pressure to a motor shaft of the motor.

Abstract: An examining device adapted to examining a transmittance of a display panel is provided. The examining device includes a light source, a first polarizer, a photodetector, a second polarizer, at least one first reflector and at least one second reflector. The light source and the photodetector are respectively disposed on both sides of the display panel. The second polarizer is disposed between the display panel and the photodetector. The first reflector is disposed between the display panel and the second polarizer. The second reflector is disposed between the display panel and the first polarizer. Light emitting from the light source successively passes via the first polarizer, the display panel, the first reflector, the display panel, the second reflector, the display panel, the second polarizer and then emits into the photodetector.

Abstract: An MIM capacitor structure having a metal structure formed thereover is provided. A dielectric layer is disposed over the metal structure and a top layer is disposed over the dielectric layer. A capacitance trench is formed through the top layer and into the dielectric layer. Respective bottom electrodes are formed over the opposing side walls of the capacitance trench. A capacitance dielectric layer is disposed over the respective bottom electrodes, the bottom of the capacitance trench and the remaining top layer. Respective opposing initial via openings are formed adjacent the capacitance trench. Respective trench openings are formed above, continuous and contiguous with the lower portions of the respective opposing initial via openings and exposing portions of the underlying metal structure to form respective opposing dual damascene openings. Planarized metal portions disposed within the dual damascene openings and the capacitance trench form a top electrode.

Abstract: The present invention relates to methods for fabricating a cathode emitter and a zinc oxide anode for a field emission device to improve the adhesion between emitters and a substrate and enhance the luminous efficiency of a zinc oxide thin film so that the disclosed methods can be applied in displays and lamps. In comparison to a conventional method for fabricating a field emission device, the method according to the present invention can reduce the cost and time for manufacture and is suitable for fabricating big-sized products. In addition, the present invention further discloses a field emission device comprising a zinc oxide/nano carbon material cathode, a zinc oxide anode and a spacer.

Abstract: Disclosed are a method and an apparatus for constructing an accurate three-dimensional model. The apparatus includes a plurality of light sources, an image-capturing element and an image-processing unit. The present invention is used to integrate the two-dimensional images from different views of an object into a high accurate three-dimensional model. Compared with conventional apparatuses, the apparatus of the present invention is useful without safety problems, relatively easily manipulated, and capable of quick image reconstruction.

Abstract: Indole compounds of the formula: wherein L1, L2, R1, R2, Ra, Rb, Rc, Rd, and Re are defined herein. Also disclosed are methods of using of the indole compounds in inhibiting tubulin polymerization and treating cancer and other angiogenesis-related disorders.

Abstract: A laminate includes a base layer being made from one of woven fabrics, knitted fabrics, and non-woven fabrics, and having two surfaces, and a thin film layer made of a polyvinyl butyral-based composition and covering one of the two surfaces of the base layer. An article for daily use, at least one part of which is made of the laminate, is also disclosed.

Abstract: A fuel cell unit of a proton exchange membrane fuel cell system includes a pair of flow field plates and a membrane electrode assembly. The membrane electrode assembly is interposed between the pair of flow field plates to define respective reactant flow channels with the pair of flow field plates. The membrane electrode assembly includes an anode catalyst layer, a cathode catalyst layer, a proton exchange membrane and a pair of gas diffusion layers. The gas diffusion layers are respectively disposed adjacent to the anode catalyst layer and the cathode catalyst layer and face to the flow field plates. At least one of the gas diffusion layers has a fluid permeability distribution profile increasing first and then decreasing from an inlet to an outlet of the reactant flow channel. The gas diffusion layer has the maximum fluid permeability at the site with the highest rate of reaction.

Abstract: An exemplary charging holder for a portable electronic device, includes a main body and a base housing. The main body defines a holding groove therein and includes a bottom portion formed in the holding groove. The base housing is connected to the bottom portion of the main body. The base housing includes a circuit board, two charging contacts, and two resilient charging contacts positioned therein. The charging contacts are electrically connected to the circuit board. The resilient charging contacts are positioned adjacent to the circuit board. Each of the resilient charging contacts includes an end portion extending out of the bottom portion of the main body. The resilient charging contacts are separated from the charging contacts and are capable of contacting with the charging contacts when the end portions of the resilient charging contacts are pressed.

Abstract: A cutting method for wafer-level packaging capable of protecting the contact pad, in which several cavities and precutting lines are formed at the front surface of a cap wafer, and the depth of each precutting line is lesser than the thickness of the cap wafer, followed by the bonding of the cap wafer to the device wafer, which has several devices and several bonding pads disposed on the surface of the device wafer, followed by performing a wafer dicing process, along the precutting lines cutting through the cap wafer, and after removing a portion of the cap wafer that is not bonded to the device wafer, for exposing the bonding pads at the surface of the device wafer, and finally performing a dicing process for forming many packaged dies.