Patents by Inventor Chun-Wen Lin
Chun-Wen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11960762Abstract: A method for managing a memory buffer, a memory control circuit unit, and a memory storage apparatus are provided. The method includes the following steps. Multiple consecutive first commands are received from a host system. A command ratio of read command among the first commands is calculated. The memory storage apparatus is being configured in a first mode or a second mode according to the command ratio and a ratio threshold. A first buffer is configured in a buffer memory to temporarily store a logical-to-physical address mapping table in response to the memory storage device being configured in the first mode, in which the first buffer has a first capacity. A second buffer is configured in the buffer memory in response to the memory storage device being configured in the second mode, in which the second buffer has a second capacity, which is greater than the first capacity.Type: GrantFiled: August 12, 2021Date of Patent: April 16, 2024Assignee: PHISON ELECTRONICS CORP.Inventors: Po-Wen Hsiao, Chun Hao Lin
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Patent number: 11946483Abstract: A fan is provided herein, including a housing, a hub, and a plurality of blades. The housing includes a top case and a bottom case. The hub is rotatably disposed between the top case and the bottom case in an axial direction. The blades extend from the hub in a radial direction, located between the top case and the bottom case. Each of the blades has a proximal end and a distal end. The proximal end is connected to the hub. The distal end is opposite from the proximal end, located at the other side of the blade, having at least one recessed portion. Each of the recessed portions form a passage for air.Type: GrantFiled: May 17, 2023Date of Patent: April 2, 2024Assignee: ACER INCORPORATEDInventors: Jau-Han Ke, Tsung-Ting Chen, Chun-Chieh Wang, Yu-Ming Lin, Cheng-Wen Hsieh, Wen-Neng Liao
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Publication number: 20240102154Abstract: A vacuum processing apparatus (110) for deposition of a material on a substrate is provided. The vacuum processing apparatus (110) includes a vacuum chamber comprising a processing area (111); a deposition apparatus (112) within the processing area (111) of the vacuum chamber; a cooling surface (113) inside the vacuum chamber; and one or more movable shields (220) between the cooling surface (113) and the processing area (111).Type: ApplicationFiled: February 24, 2020Publication date: March 28, 2024Inventors: Chun Cheng CHEN, Hung-Wen CHANG, Shin-Hung LIN, Chi-Chang YANG, Christoph MUNDORF, Thomas GEBELE, Jürgen GRILLMAYER
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Patent number: 11938220Abstract: Provided is an anesthetic composition for locally administering a local anesthetic agent to a subject in need thereof. The anesthetic composition has a lipid based complex prepared by hydrating a lipid cake containing a local anesthetic agent and a lipid mixture with an aqueous buffer solution at a pH higher than 5.5. Also provided is a method to prepare an anesthetic composition using a simpler and more robust for large-scale manufacture and for providing a high molar ratio of local anesthetic agent to phospholipid content as compared to the prior art. This anesthetic composition has a prolonged duration of efficacy adapted to drug delivery.Type: GrantFiled: March 30, 2019Date of Patent: March 26, 2024Assignees: Taiwan Liposome Co., Ltd, TLC Biopharmaceuticals, Inc.Inventors: Keelung Hong, Yun-Long Tseng, Chun-Yen Lai, Wan-Ni Yu, Hao-Wen Kao, Yi-Yu Lin
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Publication number: 20240088223Abstract: In a method of manufacturing a semiconductor device, a field effect transistor (FET) having a metal gate structure, a source and a drain over a substrate is formed. A first frontside contact disposed between dummy metal gate structures is formed over an isolation insulating layer. A frontside wiring layer is formed over the first frontside contact. A part of the substrate is removed from a backside of the substrate so that a bottom of the isolation insulating layer is exposed. A first opening is formed in the isolation insulating layer from the bottom of the isolation insulating layer to expose a bottom of the first frontside contact. A first backside contact is formed by filling the first opening with a conductive material to connect the first frontside contact.Type: ApplicationFiled: March 24, 2023Publication date: March 14, 2024Inventors: Shu-Wen SHEN, Yen-Po Lin, Chun-Han Chen
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Publication number: 20240069069Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.Type: ApplicationFiled: November 10, 2023Publication date: February 29, 2024Applicant: Alliance Material Co., Ltd.Inventors: Chun-Fa Chen, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin
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Publication number: 20230043512Abstract: A package structure includes at least one integrated circuit component, an insulating encapsulation, and a redistribution structure. The at least one integrated circuit component includes a semiconductor substrate, an interconnection structure disposed on the semiconductor substrate, and signal terminals and power terminals located on and electrically connecting to the interconnection structure. The interconnection structure is located between the semiconductor substrate and the signal terminals and between the semiconductor substrate and the power terminals, and where a size of the signal terminals is less than a size of the power terminals. The insulating encapsulation encapsulates the at least one integrated circuit component. The redistribution structure is located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.Type: ApplicationFiled: October 26, 2022Publication date: February 9, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Wen Lin, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu
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Patent number: 11488909Abstract: A package structure includes at least one integrated circuit component, an insulating encapsulation, and a redistribution structure. The at least one integrated circuit component includes a semiconductor substrate, an interconnection structure disposed on the semiconductor substrate, and signal terminals and power terminals located on and electrically connecting to the interconnection structure. The interconnection structure is located between the semiconductor substrate and the signal terminals and between the semiconductor substrate and the power terminals, and where a size of the signal terminals is less than a size of the power terminals. The insulating encapsulation encapsulates the at least one integrated circuit component. The redistribution structure is located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.Type: GrantFiled: July 31, 2020Date of Patent: November 1, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Wen Lin, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu
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Patent number: 11121572Abstract: A charging service method includes transmitting information of a communication device to a charging station, transmitting information of the charging station to the communication device, acquiring available service information of the charging station from a charging station server according to the information of the charging station, selecting at least one service option for generating charging service information, transmitting the charging service information to the charging station server, generating charging station certification information to the communication device, relaying the charging station certification information from the communication device to the charging station, and enabling a charging function of the charging station to charge the communication device after the charging station certification information is received by the charging station.Type: GrantFiled: January 10, 2019Date of Patent: September 14, 2021Assignee: ITE Tech. Inc.Inventors: Chun-Wen Lin, Ming-Hsun Sung
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Publication number: 20210280524Abstract: A package structure includes at least one integrated circuit component, an insulating encapsulation, and a redistribution structure. The at least one integrated circuit component includes a semiconductor substrate, an interconnection structure disposed on the semiconductor substrate, and signal terminals and power terminals located on and electrically connecting to the interconnection structure. The interconnection structure is located between the semiconductor substrate and the signal terminals and between the semiconductor substrate and the power terminals, and where a size of the signal terminals is less than a size of the power terminals. The insulating encapsulation encapsulates the at least one integrated circuit component. The redistribution structure is located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.Type: ApplicationFiled: May 23, 2021Publication date: September 9, 2021Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Wen Lin, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu
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Publication number: 20200365517Abstract: A package structure includes at least one integrated circuit component, an insulating encapsulation, and a redistribution structure. The at least one integrated circuit component includes a semiconductor substrate, an interconnection structure disposed on the semiconductor substrate, and signal terminals and power terminals located on and electrically connecting to the interconnection structure. The interconnection structure is located between the semiconductor substrate and the signal terminals and between the semiconductor substrate and the power terminals, and where a size of the signal terminals is less than a size of the power terminals. The insulating encapsulation encapsulates the at least one integrated circuit component. The redistribution structure is located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.Type: ApplicationFiled: July 31, 2020Publication date: November 19, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Wen Lin, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu
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Patent number: 10734323Abstract: A package structure includes at least one integrated circuit component, an insulating encapsulation, and a redistribution structure. The at least one integrated circuit component includes a semiconductor substrate, an interconnection structure disposed on the semiconductor substrate, and signal terminals and power terminals located on and electrically connecting to the interconnection structure. The interconnection structure is located between the semiconductor substrate and the signal terminals and between the semiconductor substrate and the power terminals, and where a size of the signal terminals is less than a size of the power terminals. The insulating encapsulation encapsulates the at least one integrated circuit component. The redistribution structure is located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.Type: GrantFiled: February 21, 2018Date of Patent: August 4, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Wen Lin, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu
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Publication number: 20200083734Abstract: A charging service method includes transmitting information of a communication device to a charging station, transmitting information of the charging station to the communication device, acquiring available service information of the charging station from a charging station server according to the information of the charging station, selecting at least one service option for generating charging service information, transmitting the charging service information to the charging station server, generating charging station certification information to the communication device, relaying the charging station certification information from the communication device to the charging station, and enabling a charging function of the charging station to charge the communication device after the charging station certification information is received by the charging station.Type: ApplicationFiled: January 10, 2019Publication date: March 12, 2020Inventors: Chun-Wen Lin, Ming-Hsun Sung
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Publication number: 20190157208Abstract: A package structure includes at least one integrated circuit component, an insulating encapsulation, and a redistribution structure. The at least one integrated circuit component includes a semiconductor substrate, an interconnection structure disposed on the semiconductor substrate, and signal terminals and power terminals located on and electrically connecting to the interconnection structure. The interconnection structure is located between the semiconductor substrate and the signal terminals and between the semiconductor substrate and the power terminals, and where a size of the signal terminals is less than a size of the power terminals. The insulating encapsulation encapsulates the at least one integrated circuit component. The redistribution structure is located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.Type: ApplicationFiled: February 21, 2018Publication date: May 23, 2019Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Wen Lin, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu