Patents by Inventor Chun-Yang Lee

Chun-Yang Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8629541
    Abstract: A semiconductor structure having a ring. The semiconductor structure includes a substrate, at least one chip, and the ring. The substrate has a first surface. The chip is located on the first surface of the substrate and electrically connected to the substrate. The ring has a first portion and a second portion. In various embodiments, the first and second portions different coefficients of thermal expansion (CTE), and or different cross-sectional widths. In another embodiment, the ring includes a third portion having a CTE different from both the first and second CTEs.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: January 14, 2014
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Min-Shin Ou, Chun-Yang Lee, Jun Zhai
  • Publication number: 20120056336
    Abstract: A semiconductor structure having a ring. The semiconductor structure includes a substrate, at least one chip, and the ring. The substrate has a first surface. The chip is located on the first surface of the substrate and electrically connected to the substrate. The ring has a first portion and a second portion. In various embodiments, the first and second portions different coefficients of thermal expansion (CTE), and or different cross-sectional widths. In another embodiment, the ring includes a third portion having a CTE different from both the first and second CTEs.
    Type: Application
    Filed: April 28, 2011
    Publication date: March 8, 2012
    Inventors: Min-Shin Ou, Chun-Yang Lee, Jun Zhai
  • Publication number: 20070194436
    Abstract: A ball grid array package includes a substrate having a lower surface formed with several ball-mounting regions, a selective pad-mounting block, and an identifying mark for indicating the selective pad-mounting block. A die is disposed on an upper surface of the substrate. A molding resin is encapsulated on the substrate for enclosing the die. A plurality of solder balls is mounted on the lower surface of the substrate and is coupled electrically to the die for establishing electrical communication with an external electronic device.
    Type: Application
    Filed: January 11, 2007
    Publication date: August 23, 2007
    Inventors: Chung-Yao Kao, Chun-Yang Lee, Meng-Jen Wang
  • Patent number: 7055861
    Abstract: Described is a bookmark having a bookmark body, on which a bookmark clip is disposed. The bookmark clip can clam the cover or inner pages of a book to prevent the bookmark body from falling off from the book. The bookmark body is bendable and includes a protection surface of mounting the bookmark clip, a bendable surface and folding sheet capable of being inserted into content pages of a book. The bookmark can be repeatedly used for many times while having the features of being simple in structure, easy to manufacture, and flexible and convenient to use.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: June 6, 2006
    Inventor: Chun-yang Lee
  • Publication number: 20050282311
    Abstract: A flip-chip substrate for bonding with a chip is provided. The chip has an active surface with a plurality of bonding pads and each bonding pad has a bump thereon. The flip-chip substrate has a plurality of contact pads that correspond in positions with the bonding pads on the chip such that the chip pads are aligned to their corresponding contact pads at the melting point of the bump material.
    Type: Application
    Filed: May 9, 2005
    Publication date: December 22, 2005
    Inventors: Yu-Wen Chen, Ming-Lun Ho, Chun-Yang Lee
  • Publication number: 20040119171
    Abstract: A flip-chip substrate for bonding with a chip is provided. The chip has an active surface with a plurality of bonding pads and each bonding pad has a bump thereon. The flip-chip substrate has a plurality of contact pads that correspond in positions with the bonding pads on the chip such that the chip pads are aligned to their corresponding contact pads at the melting point of the bump material.
    Type: Application
    Filed: September 16, 2003
    Publication date: June 24, 2004
    Inventors: Yu-Wen Chen, Ming-Lun Ho, Chun-Yang Lee
  • Patent number: 6357797
    Abstract: A cover apparatus for a book is provided. The cover apparatus includes a body portion that defines a substantially plainer protecting surface which attaches to an inner page of a book. The cover apparatus also includes a folding piece portion extending laterally to the body portion. The folding piece portion is formed with a plurality of laterally extending folding piece strips which are separably disposed one relative to the other in substantially parallel manner. The folding piece portion has formed thereon a plurality of longitudinally extending folding lines such that each folding piece strip may be bent along at least a portion of one folding line.
    Type: Grant
    Filed: January 18, 2001
    Date of Patent: March 19, 2002
    Inventor: Chun-Yang Lee
  • Patent number: 5904374
    Abstract: A cover member of a book includes: at least a foldable bookmark flap integrally formed on a longitudinal edge of a book cover or a dust cover of a book, or a foldable flap integrally secured to an upper edge or a bottom edge of the cover, whereby upon folding of the bookmark flap to be inserted between the pages of the book, a bookmark is provided for conveniently marking a reading place in the book and the flap inserted into the pages of the book will also protect the pages from dust contamination or atmospheric oxidation.
    Type: Grant
    Filed: August 28, 1997
    Date of Patent: May 18, 1999
    Inventor: Chun-Yang Lee