Patents by Inventor Chun-Yang Lin

Chun-Yang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250049316
    Abstract: An optical biometer includes a light-source module, a light-splitting module, a reference-arm, a sensing-arm and a sensing module. The light-source module emits incident-light. The light-splitting module, disposed corresponding to light-source module, divides the incident-light into reference light and sensing light. The reference-arm, disposed corresponding to light-splitting module, generates a first reflected-light according to the reference light. The sensing-arm, disposed corresponding to the light-splitting module, emits the sensing light to the eye and receives a second reflected-light from the eye. The sensing module generates a sensing result according to the first reflected-light and second reflected-light. In a first mode, the sensing light is emitted to a first position of the eye. In a second mode, the sensing light is emitted to a second position of the eye.
    Type: Application
    Filed: August 2, 2024
    Publication date: February 13, 2025
    Inventors: Yen-Jen CHANG, Tung-Yu LEE, Chun-Nan LIN, Che-Liang TSAI, Sung-Yang WEI, Hsuan-Hao CHAO, William WANG, Ching Hung LIN
  • Publication number: 20250051901
    Abstract: A method for the surface treatment of a corrosion-resistant nickel-based alloy and the resulting surface structure of the treated alloy is disclosed. The method includes immersing a nickel-based alloy in a first neutral or alkaline solution to remove surface contaminants, followed by immersing the cleaned alloy in a second neutral or alkaline solution to form functional groups on its surface. Subsequently, a low-temperature heat treatment is performed to form a passivation layer on the surface of the nickel-based alloy. The passivation layer has a surface roughness of less than 0.04 microns and a thickness ranging from 5 nanometers to 200 nanometers. The resulting corrosion-resistant nickel-based alloy comprises a substrate made of the nickel-based alloy and a passivation layer established on at least one surface of the substrate. The nickel content of the alloy is greater than 50%, and the alloy may also contain additional metallic components such as chromium (Cr) and manganese (Mn).
    Type: Application
    Filed: April 3, 2024
    Publication date: February 13, 2025
    Inventors: Tsung Feng Wu, Chun-Chih Liao, Po-Chia Huang, Guo-Yang Ciou, Chia-Te Lin, Po-Han Chen
  • Publication number: 20220226463
    Abstract: The present invention relates to a recombinant nonstructural protein 1 (NS 1), a recombinant influenza virus and an immunological composition including the same, as well as a method of treating or preventing a disease or condition caused by or associated with an influenza virus in a subject in need thereof. At least one amino acid residue is mutated or deleted in 4 contiguous amino acid residues of TRAF3-interacting motifs (TIMs) within an effector domain of the recombinant NS 1. A recombinant influenza virus including the recombinant NS1 is comparable to the wild-type influenza virus in virus replication ability, and the recombinant influenza virus can elevate interferon activation of a subject for achieving better immune response and better immunological protection, leading in a method of treating or preventing a disease or condition caused by or associated with an influenza virus in a subject in need thereof.
    Type: Application
    Filed: June 4, 2020
    Publication date: July 21, 2022
    Inventors: Pin LING, Kuan-Ru CHEN, Chun-Yang LIN, Meng-Cen SHIH, Hung-Chuan CHANG, Kuan-Jung LIN, Sheng-Kai MA
  • Publication number: 20050082086
    Abstract: A printed circuit board (PCB) includes a plastic substrate, and a layout formed on the plastic substrate. The layout comprises a first layout and a second layout, the second layout is less dense than the first layout. The second layout comprises a pseudo-layout to prevent the PCB from being bent when heated.
    Type: Application
    Filed: October 6, 2004
    Publication date: April 21, 2005
    Inventors: Chun-Yang Lin, Shu-Chih Chen, Wen-Hsinung Shih
  • Patent number: D729184
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: May 12, 2015
    Assignee: Top Victory Investments Ltd.
    Inventors: Jui-Chang Huang, Yung-Hung Chiu, Chun-Yang Lin