Patents by Inventor Chun-Yao Lin

Chun-Yao Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240135043
    Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.
    Type: Application
    Filed: October 19, 2022
    Publication date: April 25, 2024
    Inventors: Yong-Teng Lin, Bradford Edward Vier, Chun-Kai Tzeng, Chin-Yao Hsu, Yu-Lin Tsai
  • Patent number: 10193041
    Abstract: A light emitting diode comprises a light emitting diode chip and a packaging layer. The light emitting diode chip comprises a N-semiconductor layer, a light active layer, and a P-semiconductor layer arranged from a bottom to a top in that sequence, a first electrode, and a second electrode. The first electrode is formed on the P-semiconductor layer. The second electrode is formed on the N-semiconductor layer. The packaging layer covers the light emitting diode chip, and exposes the N-semiconductor layer, the first electrode, and the second electrode. The packaging layer has a through hole separated from a periphery of the light emitting diode chip. A conductive substrate fills the through hole. A first conductive layer is electrically connected to the first electrode and the conductive substrate. The disclosure also provides a method for manufacturing a light emitting diode.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: January 29, 2019
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC
    Inventors: Shih-Chuan Lin, Tsung-Han Chiang, Chun-Yao Lin, Chao-Ming Huang, Hsiu-Ling Hung, Tzu-Chien Hung