Patents by Inventor Chun Yee Tan

Chun Yee Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8116284
    Abstract: Temporarily selecting a TDMA timeslot by a radio communication device to thereby allow the radio communication device to communicate, through at least one repeater station, with a talkgroup of other radio communication devices is disclosed. The radio communication device has an assigned default timeslot for communicating with the talkgroup. The radio communication device determines if the default timeslot is available for the radio communication device to communicate with the talkgroup and searches for an available timeslot, when the default timeslot is unavailable. The radio communication device temporarily selects the available timeslot as a temporary selected group timeslot for the talkgroup.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: February 14, 2012
    Assignee: Motorola Solutions, Inc.
    Inventors: Kin Wei Wong, Hooi Hoon Ch'ng, Lip Hoon Lim, Chun Yee Tan
  • Publication number: 20100157958
    Abstract: Temporarily selecting a TDMA timeslot by a radio communication device to thereby allow the radio communication device to communicate, through at least one repeater station, with a talkgroup of other radio communication devices is disclosed. The radio communication device has an assigned default timeslot for communicating with the talkgroup. The radio communication device determines if the default timeslot is available for the radio communication device to communicate with the talkgroup and searches for an available timeslot, when the default timeslot is unavailable. The radio communication device temporarily selects the available timeslot as a temporary selected group timeslot for the talkgroup.
    Type: Application
    Filed: December 18, 2008
    Publication date: June 24, 2010
    Applicant: MOTOROLA, INC.
    Inventors: Kin Wei Wong, Hooi Hoon Ch'ng, Lip Hong Lim, Chun Yee Tan
  • Publication number: 20050189656
    Abstract: Micro-vias may be formed, for example, using laser drilling, through a dielectric layer, down to and partially through an underlying capture pad. As a result, when the micro-via is filled with a conductor, stress cracking may be reduced in some embodiments. The stress cracking may be reduced by the increased interface area between the capture pad and the micro-via in some embodiments. Stress cracking may also be reduced due to the more complex shape of the interface between the via and the capture pad.
    Type: Application
    Filed: February 26, 2004
    Publication date: September 1, 2005
    Inventor: Chun Yee Tan