Patents by Inventor Chun-Yeh Chu

Chun-Yeh Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230203251
    Abstract: A slurry composition and a preparation method therefor. The slurry composition comprises a filler, a slurry carrier, and a dispersing agent. The slurry carrier comprises a solvent or resin. The dispersing agent is a small molecule multifunctional cross-linking dispersing agent having at least two functional groups of crosslinkable double bonds, has a higher boiling point, thermal stability, and low polarity, and has good dispersion characteristics for fillers.
    Type: Application
    Filed: January 13, 2021
    Publication date: June 29, 2023
    Applicant: Prior Company Limited
    Inventors: Ying-Chen Chen, Cheng-Hsin Tsai, Chun-Yeh Chu
  • Patent number: 11326052
    Abstract: A biodegradable plastic composition is used to manufacture a biodegradable plastic. The biodegradable plastic composition includes a biodegradable polyester, a polysaccharide, and a modifier. The modifier is used to compound the polysaccharide and the biodegradable polyester to obtain a biodegradable plastic. The biodegradable plastic has a tensile strength greater than 3 MPa and an elongation greater than 81%.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: May 10, 2022
    Assignees: Tatung Company, TATUNG UNIVERSITY
    Inventors: C. Will Chen, Chun-Yeh Chu, Ping-Hsun Tsai, Ching-Huang Wang, Chiung-Cheng Huang, Tai-Wei Tseng
  • Publication number: 20200283621
    Abstract: A biodegradable plastic composition is used to manufacture a biodegradable plastic. The biodegradable plastic composition includes a biodegradable polyester, a polysaccharide, and a modifier. The modifier is used to compound the polysaccharide and the biodegradable polyester to obtain a biodegradable plastic. The biodegradable plastic has a tensile strength greater than 3 MPa and an elongation greater than 81%.
    Type: Application
    Filed: January 9, 2020
    Publication date: September 10, 2020
    Applicants: Tatung Company, TATUNG UNIVERSITY
    Inventors: C. Will Chen, Chun-Yeh Chu, Ping-Hsun Tsai, Ching-Huang Wang, Chiung-Cheng Huang, Tai-Wei Tseng