Abstract: A package structure includes a bonding substrate, an integrated circuit, and a heat sink metal. The integrated circuit includes an active region facing the bonding substrate. The heat sink metal is located between the bonding substrate and the active region of the integrated circuit. The heat sink metal is electrically insulated with the integrated circuit.

Abstract: A notebook computer system with an easily separable trackball to give the system flexibility. The system makes use of a separable keyboard to achieve the goal of installing and separating the trackball. To this end the notebook computer comprises a keyboard that is able to be at least partially separated from the system, a socket for installation of the trackball module, with the trackball module being partially captured under the keyboard when installed in the socket. A notebook computer having a socket for accommodating a trackball may alternatively be provided with a plain plate, which allows the notebook computer to work normally without the trackball.