Abstract: An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.

Abstract: A contact arrangement, including multiple contacts, is provided. The contacts are staggered. Some of the contacts form at least one contact group. The at least one contact group includes a pair of first contacts and eight second contacts. The pair of first contacts is a pair of differential signal contacts. The second contacts are arranged around the pair of first contacts. Two of the second contacts are arranged along a straight line perpendicular to a connecting line of the pair of first contacts. The position distribution and electrical properties of the other six of the second contacts are symmetrical to each other relative to the straight line.

Abstract: A contact arrangement, including multiple contacts, is provided. The contacts are staggered. Some of the contacts form at least one contact group. The at least one contact group includes a first contact and six second contacts. The second contacts are arranged around the first contact. When the first contact is a power contact or a ground contact, the second contacts are signal contacts. When the first contact is a signal contact, three of the second contacts are power contacts or ground contacts and are not adjacent to each other.

Abstract: A contact arrangement, including multiple contacts, is provided. The contacts are staggered. Some of the contacts form at least one contact group. The at least one contact group includes a pair of first contacts and eight second contacts. The pair of first contacts is a pair of differential signal contacts. The second contacts are arranged around the pair of first contacts. Two of the second contacts are arranged along a straight line perpendicular to a connecting line of the pair of first contacts. The position distribution and electrical properties of the other six of the second contacts are symmetrical to each other relative to the straight line.

Abstract: A contact arrangement, including multiple contacts, is provided. The contacts are staggered. Some of the contacts form at least one contact group. The at least one contact group includes a first contact and six second contacts. The second contacts are arranged around the first contact. When the first contact is a power contact or a ground contact, the second contacts are signal contacts. When the first contact is a signal contact, three of the second contacts are power contacts or ground contacts and are not adjacent to each other.

Abstract: Processes for removing a photoresist from a substrate after, for instance, ion implantation are provided. In one example implementation, a process can include placing a substrate having a bulk photoresist and a crust formed on the bulk photoresist in a processing chamber. The process can include initiating a first strip process in the processing chamber. The process can include accessing an optical emission signal associated with a plasma during the first strip process. The process can include identifying an endpoint for the first strip process based at least in part on the optical emission signal. The process can include terminating the first strip process based at least in part on the endpoint. The process can include initiating a second strip process to remove the photoresist from the substrate.

Abstract: Processes for removing a photoresist from a substrate after, for instance, ion implantation are provided. In one example implementation, a process can include placing a substrate having a bulk photoresist and a crust formed on the bulk photoresist in a processing chamber. The process can include initiating a first strip process in the processing chamber. The process can include accessing an optical emission signal associated with a plasma during the first strip process. The process can include identifying an endpoint for the first strip process based at least in part on the optical emission signal. The process can include terminating the first strip process based at least in part on the endpoint. The process can include initiating a second strip process to remove the photoresist from the substrate.

Abstract: A circuit board including a first patterned conductive layer and a second patterned conductive layer isolated from the first patterned conductive layer is provided. The first patterned conductive layer has first signal traces and first ground traces. The second patterned conductive layer has second signal traces and second ground traces. An orthogonal projection of the second ground trace on the first patterned conductive layer partially overlaps at least one of the first signal traces. An orthogonal projection of the first ground trace on the second patterned conductive layer partially overlaps at least one of the second signal traces. An electronic assembly including the afore-described circuit board and a chip package connected thereto is also provided.

Abstract: A circuit board including a first patterned conductive layer and a second patterned conductive layer isolated from the first patterned conductive layer is provided. The first patterned conductive layer has first signal traces and first ground traces. The second patterned conductive layer has second signal traces and second ground traces. An orthogonal projection of the second ground trace on the first patterned conductive layer partially overlaps at least one of the first signal traces. An orthogonal projection of the first ground trace on the second patterned conductive layer partially overlaps at least one of the second signal traces. An electronic assembly including the afore-described circuit board and a chip package connected thereto is also provided.