Abstract: A high-capacity common-mode inductor processing circuit for network signal is disclosed. Each of high-capacity common-mode inductors is disposed between two adjacent circuit channels to perform signal coupling, and each high-capacity common-mode inductor has parasitic capacitance between primary and secondary sides thereof, each of autotransformers is disposed on a side of corresponding one of the high-capacity common-mode inductors, and center tap lines of the autotransformers are grounded. The high-capacity common-mode inductor includes an iron core post and an iron core cover, the iron core post includes a winding part to be wound by conductive wires, and the conductive wires are wound on the winding part by a preset number of turns, and upwardly stacked and wound on the winding part by a preset layer number. The high-capacity common-mode inductors and the parasitic capacitances can eliminate noise on the circuit channels and perform signal coupling.

Abstract: A method of preparation and application for a glass ceramic sealing thin strip with high sealing performance, differing from using conventional glass ceramic packaging paste applied to the junction of the cell stack assembly and connecting plates. The glass ceramic sealing thin strip of present invention utilizes tape casting to produce a single layer or multi-layer stacking in accordance with the required thickness of the glass-ceramic sealing thin strip, and cutting the glass ceramic sealing thin strips from molds in accordance with the geometry of cell stacks with equal thickness of the glass ceramic sealing thin strip for SOFC cell stack assembly, aiming to overcome the setbacks of the conventional dispensing method with glass ceramic packaging paste that makes the thickness difficult to control, and to effectively improve sealing performance of the cell stack assembly and the power generation efficiency, and achieve commercial application with mass production.

Abstract: A semiconductor device includes: a first conductive structure that comprises a first portion having sidewalls and a bottom surface, wherein the first conductive structure is embedded in a first dielectric layer; and an isolation layer comprising a first portion and a second portion, wherein the first portion of the isolation layer lines the sidewalls of the first portion of the first conductive structure, and the second portion of the isolation layer lines at least a portion of the bottom surface of the first portion of the first conductive structure.

Abstract: A method of preparation and application for a glass ceramic sealing thin strip with high sealing performance, differing from using conventional glass ceramic packaging paste applied to the junction of the cell stack assembly and connecting plates. The glass ceramic sealing thin strip of present invention utilizes tape casting to produce a single layer or multi-layer stacking in accordance with the required thickness of the glass-ceramic sealing thin strip, and cutting the glass ceramic sealing thin strips from molds in accordance with the geometry of cell stacks with equal thickness of the glass ceramic sealing thin strip for SOFC cell stack assembly, aiming to overcome the setbacks of the conventional dispensing method with glass ceramic packaging paste that makes the thickness difficult to control, and to effectively improve sealing performance of the cell stack assembly and the power generation efficiency, and achieve commercial application with mass production.

Abstract: A high-capacity common-mode inductor processing circuit for network signal is disclosed. Each of high-capacity common-mode inductors is disposed between two adjacent circuit channels to perform signal coupling, and each high-capacity common-mode inductor has parasitic capacitance between primary and secondary sides thereof, each of autotransformers is disposed on a side of corresponding one of the high-capacity common-mode inductors, and center tap lines of the autotransformers are grounded. The high-capacity common-mode inductor includes an iron core post and an iron core cover, the iron core post includes a winding part to be wound by conductive wires, and the conductive wires are wound on the winding part by a preset number of turns, and upwardly stacked and wound on the winding part by a preset layer number. The high-capacity common-mode inductors and the parasitic capacitances can eliminate noise on the circuit channels and perform signal coupling.

Abstract: A membrane electrode assembly structure of a fuel cell and a method of making the same are disclosed. The materials to be used include NiO, 8YSZ and 3YSZ that mixed into a slurry, formed into anodes by tape casting, sintered to form an anode substrate, and followed by forming a thin film of electrolyte layer on the surface of the anode substrate, forming a cathode layer on the outer surface of the electrolyte layer to obtain the membrane electrode assembly, which utilizes the 3YSZ having a tetragonal crystal phase to improve the toughness and mechanical strength of the material of NiO-8YSZ through calcination, thus the thickness of the anode substrate can be reduced, and the fuel gas diffusion path and resistance can be appropriately reduced to enhance the conductivity of the anode substrate.

Abstract: A semiconductor device includes: a first conductive structure that comprises a first portion having sidewalls and a bottom surface, wherein the first conductive structure is embedded in a first dielectric layer; and an isolation layer comprising a first portion and a second portion, wherein the first portion of the isolation layer lines the sidewalls of the first portion of the first conductive structure, and the second portion of the isolation layer lines at least a portion of the bottom surface of the first portion of the first conductive structure.

Abstract: A membrane electrode assembly structure of a fuel cell and a method of making the same are disclosed. The materials to be used include NiO, 8YSZ and 3YSZ that mixed into a slurry, formed into anodes by tape casting, sintered to form an anode substrate, and followed by forming a thin film of electrolyte layer on the surface of the anode substrate, forming a cathode layer on the outer surface of the electrolyte layer to obtain the membrane electrode assembly, which utilizes the 3YSZ having a tetragonal crystal phase to improve the toughness and mechanical strength of the material of NiO-8YSZ through calcination, thus the thickness of the anode substrate can be reduced, and the fuel gas diffusion path and resistance can be appropriately reduced to enhance the conductivity of the anode substrate.

Abstract: A composite material type oxygen transport membrane and its preparation method are disclosed. The composite material that is an ionic-electronic mixed conducting material having high ionic conductivity is stirred into slurry and formed into a thin strip-shaped green tape substrate through tape casting to obtain a predetermined half-finished substrate, and then sintered to form the half-finished substrate into a conductive function type oxygen ion conducting substrate, followed by choosing small particle shaped highly catalyzed ionic-electronic mixed conducting material to be evenly adhered to at least one side surface of the conductive function type oxygen ion conducting substrate to form a reductive function type oxygen ion conducting layer. The reductive function type oxygen ion conducting layer and the conductive function type oxygen ion conducting substrate are then bonded to produce a composite material type oxygen transport membrane element.

Abstract: A fabrication process for production of planar type solid oxide fuel cell with high electrical conductivity and low fuel gas impedance is disclosed. It is a tape casting to produce an anode substrate furnished with a pore array structure on one or plurality of layers of the anode green tape on the utmost outside of the anode. It is to implement the process of solid oxide fuel cell membrane electrode assembly (SOFC-MEA) with precision abrasion to remove nickel depleted layer on the anode surface to complete the production of a unit cell. The fabrication of anode with pore array structure provides a good conduction effect for fuel gas and the solid oxide fuel cell with this treatment has features of high electrical conductivity and low fuel gas impedance to improve the performance of SOFC unit cell.

Abstract: A fabrication process for production of planar type solid oxide fuel cell with high electrical conductivity and low fuel gas impedance is disclosed. It is a tape casting to produce an anode substrate furnished with a pore array structure on one or plurality of layers of the anode green tape on the utmost outside of the anode. It is to implement the process of solid oxide fuel cell membrane electrode assembly (SOFC-MEA) with precision abrasion to remove nickel depleted layer on the anode surface to complete the production of a unit cell. The fabrication of anode with pore array structure provides a good conduction effect for fuel gas and the solid oxide fuel cell with this treatment has features of high electrical conductivity and low fuel gas impedance to improve the performance of SOFC unit cell.

Abstract: A fixing structure with an interface card module comprises a fixing structure and an interface card module. The fixing structure includes a main board, a connector and a fixing frame. The main board has an edge. The connector is disposed on the main board, and the connector has a socket which faces toward the edge. The fixing frame has a connecting end and a fixing end opposite to each other, the fixing frame is disposed on the main board via the connecting end and the fixing end is protruded outside the edge. The interface card module has a first end and a second end opposite to each other, the first end is inserted into the socket, and the second end is protruded outside the edge and is fixed at the fixing end. Therefore, the interface card module is fixed on the main board.

Abstract: Disclosed is a method for making a refractory material from aluminum residues of aluminum recycling. At first, the aluminum residues is mixed with adhesive solution so that the percentage by weight of the adhesive solution is 5 wt % to 10 wt %. The mixture is granulated into grains. The grains are filled in a mold, pressed and then removed from the mold so that the grains are turned into a green body. The green body is heated in a furnace at a range of temperature from 1100° C. to 1400° C. so that the grains are sintered and become a refractory material.

Abstract: A fixing structure with an interface card module comprises a fixing structure and an interface card module. The fixing structure includes a main board, a connector and a fixing frame. The main board has an edge. The connector is disposed on the main board, and the connector has a socket which faces toward the edge. The fixing frame has a connecting end and a fixing end opposite to each other, the fixing frame is disposed on the main board via the connecting end and the fixing end is protruded outside the edge. The interface card module has a first end and a second end opposite to each other, the first end is inserted into the socket, and the second end is protruded outside the edge and is fixed at the fixing end. Therefore, the interface card module is fixed on the main board.

Abstract: The present disclosure uses aluminum residues to fabricate artificial stones. The aluminum residues are obtained from a recycle process of aluminum scrap. The aluminum residues is made into dross and baghouse dust as raw materials for the artificial stones. The artificial stones thus made are improved in characteristics of mechanical strength, hardness, abrasion resistance, flame resistance and anti-oxidation. Hence, the present disclosure reduces impacts to the nature; obtains derived products from recycled aluminum residues; increases commercial income; decreases cost for handling aluminum residues; and saves the use of aluminum oxide, aluminium hydroxide or silicon oxide on making artificial stones. The artificial stones thus made are fit to be used in fields of green material, green construction and green industry.

Abstract: Disclosed is a method for making a refractory material from aluminum residues of aluminum recycling. At first, the aluminum residues is mixed with adhesive solution so that the percentage by weight of the adhesive solution is 5 wt % to 10 wt %. The mixture is granulated into grains. The grains are filled in a mold, pressed and then removed from the mold so that the grains are turned into a green body. The green body is heated in a furnace at a range of temperature from 1100° C. to 1400° C. so that the grains are sintered and become a refractory material.

Abstract: A porous soundproof board is fabricated Recycled waste, like slag, is used for fabrication. Slag and ceramics are mixed to be poured into a network foam carrier. Then, the soundproof board is fabricated through sintering. Thus the board fabricated has great added values and is environmental protected with low cost.

Abstract: A DC uninterruptible power supply (DC UPS) is configured in a computer device that includes a power supply connected to an AC power source and a motherboard. The DC UPS is electrically connected between the power supply and the motherboard. Thus, when the power provided by the power supply is abnormal, the DC UPS can provide a set of DC powers to the motherboard and associated devices in the computer device.

Abstract: A notebook computer comprises a housing including an internal control unit, a recess on a top surface, and wireless receiving means electrically coupled to the control unit; and detachable input means received in the recess and including wireless transmission means which is enabled as the input means is detached from the housing for activating a radio frequency (RF) transmission from the wireless transmission means to the wireless receiving means while entering inputs through the input means.

Abstract: The present invention provides a movable connector board which is mounted with interface connectors for its peripheral devices. The board prevents the user from inconvenience of connecting devices on the back of the computer. The connector board is movable to a usage position where the peripheral devices can be easily connected to or disconnected from the computer without rotating, turning or moving the computer.