Abstract: A method includes following steps. A first transistor is formed on a substrate. A first dielectric layer is formed over the first transistor. A first trench is formed in the first dielectric layer. An amorphous semiconductor layer is deposited in the first trench and over the first dielectric layer. The amorphous semiconductor layer is crystallized into a crystalline semiconductor layer. A second transistor is formed over the crystalline semiconductor layer.

Abstract: An integrated circuit includes a first transistor and a second transistor. The first transistor includes first semiconductor channel layers, first gate structure, and a first source structure and a first drain structure on opposites sides of the first gate structure. The second transistor includes second semiconductor channel layers, second gate structure, and a second source structure and a second drain structure on opposites sides of the second gate structure. The first source structure of the first transistor is electrically coupled to the second drain structure of the second transistor. A thickness of each of the first semiconductor channel layers is less than a thickness of each of the second semiconductor channel layers, and a bandgap of a material of the first semiconductor channel layers is larger than a bandgap of a material of the second semiconductor channel layers.

Abstract: An integrated circuit includes a first transistor and a second transistor. The first transistor includes first semiconductor channel layers, first gate structure, and a first source structure and a first drain structure on opposites sides of the first gate structure. The second transistor includes second semiconductor channel layers, second gate structure, and a second source structure and a second drain structure on opposites sides of the second gate structure. The first source structure of the first transistor is electrically coupled to the second drain structure of the second transistor. A thickness of each of the first semiconductor channel layers is less than a thickness of each of the second semiconductor channel layers, and a bandgap of a material of the first semiconductor channel layers is larger than a bandgap of a material of the second semiconductor channel layers.

Abstract: A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.

Abstract: An IC structure comprises an MTJ cell, a transistor, a first word line, and a second word line. The transistor is electrically coupled to the MTJ cell. The transistor comprises a first gate terminal and a second gate terminal independent of the first gate terminal. The first word line is electrically coupled to the first gate terminal of the transistor. The second word line is electrically coupled to the second gate terminal of the transistor. A resistance state of the MTJ cell is dependent on a first word line voltage applied to the first word line and a second word line voltage applied to the second word line, and the resistance state of the MTJ cell follows an AND gate logic or an OR gate logic.

Abstract: A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.

Abstract: The present application proposes an over-voltage protection circuit for a USB Type-C connector. The USB Type-C connector has at least one input signal pin. The over-voltage protection circuit includes a control circuit, a voltage level shift circuit, and a system clamping circuit. The control circuit generates a control signal according to a bias voltage. The voltage level shift circuit is electrically connected to the at least one input signal pin and the control circuit, and arranged to receive the control signal and at least one input signal and the control signal from the at least one input signal pin, and regulate a voltage level of the at least one input signal according to the control signal. The system clamping circuit is electrically connected to the level shift circuit, and clamps the voltage level of the regulated input signal down to below a threshold.

Abstract: The present application proposes an over-voltage protection circuit for a USB Type-C connector. The USB Type-C connector has at least one input signal pin. The over-voltage protection circuit includes a control circuit, a voltage level shift circuit, and a system clamping circuit. The control circuit generates a control signal according to a bias voltage. The voltage level shift circuit is electrically connected to the at least one input signal pin and the control circuit, and arranged to receive the control signal and at least one input signal and the control signal from the at least one input signal pin, and regulate a voltage level of the at least one input signal according to the control signal. The system clamping circuit is electrically connected to the level shift circuit, and clamps the voltage level of the regulated input signal down to below a threshold.

Abstract: A package structure includes a redistribution layer, a chip, an encapsulant, an under bump supporting layer, an attachment layer and solder balls. The redistribution layer includes a first surface, a second surface opposite to the first surface and a patterned circuit layer disposed on the first surface, wherein an outer surface of the patterned circuit layer and the first surface are coplanar. The chip is disposed on the second surface and electrically connected to the patterned circuit layer. The encapsulant is disposed on the second surface to encapsulate the chip. The under bump supporting layer is disposed on the first surface and includes openings for exposing the outer surface. The attachment layer covers the inner surface of each opening and the exposed portion of the patterned circuit layer. The solder balls are disposed in the openings respectively and electrically connected to the patterned circuit layer.

Abstract: A package structure includes a redistribution layer, a chip, an encapsulant, a plurality of under ball release layers, and a plurality of solder balls. The redistribution layer includes a first surface, a second surface opposite to the first surface, and a patterned circuit layer, wherein the patterned circuit layer includes a plurality of pads protruding from the first surface. The chip is disposed on the second surface and electrically connected to the patterned circuit layer. The encapsulant is disposed on the second surface and encapsulates the chip. The under ball release layers cover the pads respectively. The solder balls are disposed on the under ball release layers and electrically connected to the pads.

Abstract: A high-voltage capacitor structure comprises a capacitor. The capacitor includes a substrate, a field oxidation layer, an active region, a dielectric layer, a passivation layer and a metal layer. The field oxidation layer is disposed above the substrate. The active region is disposed above the substrate or in the substrate. The dielectric layer is disposed above the active region and the field oxidation layer. The passivation layer is disposed above the dielectric layer. The metal layer is disposed above the passivation layer. The metal layer and the active region serve as a first electrode and a second electrode of the capacitor, respectively, wherein the active region is disposed below the dielectric layer. Some embodiments provide a digital isolation apparatus comprising at least one high-voltage isolator, each of which includes the above high-voltage capacitor structure.

Abstract: A package structure includes a redistribution layer, a chip, an encapsulant, an under bump supporting layer, an attachment layer and solder balls. The redistribution layer includes a first surface, a second surface opposite to the first surface and a patterned circuit layer disposed on the first surface, wherein an outer surface of the patterned circuit layer and the first surface are coplanar. The chip is disposed on the second surface and electrically connected to the patterned circuit layer. The encapsulant is disposed on the second surface to encapsulate the chip. The under bump supporting layer is disposed on the first surface and includes openings for exposing the outer surface. The attachment layer covers the inner surface of each opening and the exposed portion of the patterned circuit layer. The solder balls are disposed in the openings respectively and electrically connected to the patterned circuit layer.

Abstract: A package structure includes a redistribution layer, a chip, an encapsulant, a plurality of under ball release layers, and a plurality of solder balls. The redistribution layer includes a first surface, a second surface opposite to the first surface, and a patterned circuit layer, wherein the patterned circuit layer includes a plurality of pads protruding from the first surface. The chip is disposed on the second surface and electrically connected to the patterned circuit layer. The encapsulant is disposed on the second surface and encapsulates the chip. The under ball release layers cover the pads respectively. The solder balls are disposed on the under ball release layers and electrically connected to the pads.

Abstract: A shockproof locking assembly device includes a locking hole member, a cavity member, a locking element and a vibration-absorbing element. The cavity member has a bottom portion with a through hole with a recess. The locking element includes a head portion, a shaft portion and a link portion. The head portion is disposed inside the cavity member. The shaft portion penetrates the through hole to be locked into the locking hole member, so that the head portion and the shaft portion are respectively positioned on the top side and the down side of the bottom portion. The link portion has a protrusion with a taper level. The vibration-absorbing element penetrates the through hole, encompasses the link portion and clamps the bottom portion. The shaft portion penetrates through the vibration-absorbing element and the protrusion is locked with the recess via part of the vibration-absorbing element.

Abstract: A hard disk drive holding device includes a holder and at least a sliding trench. A hard disk drive is installed into the device quickly and simply through a sliding trench with an opening on a surface of the holder and is constrained tightly due to an inclination of the lateral inner surface in the sliding trench. The sliding trench may also narrow such that the hard disk drive is also constrained in a different direction and is held firmer.

Abstract: A circuit board clamping mechanism and a testing device using the same. The circuit board clamping mechanism is for clamping a main circuit board and an extending circuit board. The extending circuit board is coupled with the main circuit board, and there is a titling angel between the extending circuit board and the main circuit board. The circuit board clamping mechanism includes a substrate board and a clamping element. The main circuit board is disposed on the substrate board. The clamping element includes a clamping part and a fixing part. The clamping part is for clamping the extending circuit board. The fixing part is disposed on the substrate board and is coupled with the clamping part. The clamping part and the fixing part form an L-shaped structure.

Abstract: A clam type mobile phone includes a base, a motherboard, a hinge seat, a display device and a vibrator. The motherboard is configured in the base. The hinge seat is mounted on one side of the base. The display device is mounted on the hinge seat. The hinge seat enables the display device to rotate relative to the base. The vibrator is configured in the hinge seat and electrically connected to the motherboard for providing the clam type mobile phone with a vibration function.

Abstract: A hard disk drive holding device includes a holder and at least a sliding trench. A hard disk drive is installed into the device quickly and simply through a sliding trench with an opening on a surface of the holder and is constrained tightly due to an inclination of the lateral inner surface in the sliding trench. The sliding trench may also narrow such that the hard disk drive is also constrained in a different direction and is held firmer.

Abstract: A shockproof locking assembly device includes a locking hole member, a cavity member, a locking element and a vibration-absorbing element. The cavity member has a bottom portion with a through hole with a recess. The locking element includes a head portion, a shaft portion and a link portion. The head portion is disposed inside the cavity member. The shaft portion penetrates the through hole to be locked into the locking hole member, so that the head portion and the shaft portion are respectively positioned on the top side and the down side of the bottom portion. The link portion has a protrusion with a taper level. The vibration-absorbing element penetrates the through hole, encompasses the link portion and clamps the bottom portion. The shaft portion penetrates through the vibration-absorbing element and the protrusion is locked with the recess via part of the vibration-absorbing element.

Abstract: An apparatus for fixing a workpiece by a magnetic force includes a carrier and a fixing unit. The carrier is made of a magnetic material. The fixing unit is disposed on the workpiece, fixing the workpiece on the carrier. The fixing unit includes a supporting portion, a magnet and a connecting portion. The magnet is disposed in the supporting portion. The connecting portion is connected to the supporting portion and is used for being joined to the workpiece. The fixing unit is fixed on the carrier by a magnetic force, for fixing the workpiece on the carrier.