Abstract: A composition and a manufacturing method of a highly flame-retardant and low-smoke extruded polyvinyl chloride pipe are provided. The composition includes a polyvinyl chloride resin material, a flame retardant additive and a carbon forming additive. The polyvinyl chloride resin material is in an amount between 10 PHR (parts per hundred resin) and 90 PHR. The flame retardant additive is in an amount between 0.5 PHR and 2.0 PHR, and is a phosphorus-containing flame retardant modified by a modifier. The carbon forming additive is in an amount between 0.2 PHR and 1.0 PHR. The carbon forming additive is at least one material selected from a group consisting of zinc chloride, zinc stearate, calcium stearate, zinc hydroxystannate, anhydrous zinc stannate, zinc phosphate and zirconium phosphate. A total added amount of the flame retardant additive and the carbon forming additive in the composition is not greater than 3 PHR.

Abstract: A PVC resin composition and a method for manufacturing a pipe having high heat resistance and transparency are provided. The PVC resin composition includes 100 phr of a PVC resin, 0.5 phr to 5 phr of a modifier, and 1 phr to 10 phr of a heat resistance improving agent. A degree of polymerization of the PVC resin is from 800 to 1,350. The modifier is a polymer containing a first monomer and a second monomer. The first monomer is ethylene or a derivative of the ethylene, and the second monomer is a polyester.

Abstract: A chlorinated polyvinyl chloride resin composition, an extruded sheet and a method for manufacturing the same are provided. The chlorinated polyvinyl chloride resin composition includes a chlorinated polyvinyl chloride resin and a plasticizing processing aid. The chlorinated polyvinyl chloride resin has an amount of 80 parts by weight to 120 parts by weight, a degree of polymerization of from 500 to 1,100, and a chlorine content of from 60% to 75%. The plasticizing processing aid includes a vinyl chloride graft copolymer and an acrylic compound. A grafted functional group of the vinyl chloride graft copolymer is at least one of polyol ester and ethylene vinyl acetate.

Abstract: A composition and a manufacturing method of a highly flame-retardant and low-smoke injection-molded polyvinyl chloride pipe are provided. The composition includes a polyvinyl chloride resin material, a chlorinated polyvinyl chloride resin material, a flame retardant additive and a carbon forming additive. A first number-average degree of polymerization (DPn) of the polyvinyl chloride resin material is between 600 and 1,000. A second number-average degree of polymerization of the chlorinated polyvinyl chloride resin material is between 600 and 800. A difference between the first number-average degree of polymerization and the second number-average degree of polymerization is within 400. The flame retardant additive is a phosphorus-containing flame retardant modified by a modifier. A total added amount of the flame retardant additive and the carbon forming additive in the composition is not greater than 3 PHR.

Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.

Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a gate structure disposed on the substrate. The semiconductor device also includes a source region and a drain region disposed within the substrate. The substrate includes a drift region laterally extending between the source region and the drain region. The semiconductor device further includes a first stressor layer disposed over the drift region of the substrate. The first stressor layer is configured to apply a first stress to the drift region of the substrate. In addition, the semiconductor device includes a second stressor layer disposed on the first stressor layer. The second stressor layer is configured to apply a second stress to the drift region of the substrate, and the first stress is opposite to the second stress.

Abstract: Provided herein are a three-directional accelerometer and a method for manufacturing the same. The three-directional accelerometer includes a three-layer frame, a core mass, three sets of spring leaves and three sets of optic fiber Bragg gratings (FBG's). The spring leaves that react to seismic motion of the mass are aligned perpendicular to one another in three dimensions. The spring leaves are significantly smaller in thickness than width, thus creating significant differences in moments of inertia, making the spring leaves sensitive only to mass vibration or acceleration in one direction. One set of FBG is responsible for sensing the corresponding mass vibration in one direction. The natural frequency in any direction can be adjusted by varying the mass/dimensions of the core mass, corresponding frame and stiffness of the spring leaves.

Abstract: Provided herein are a two-directional inclination sensor for sensing an inclination of a structure and a method for manufacturing the same. The two-directional inclination sensor includes a main body of a monolithic piece configured to be installed in the structure for sensing the inclination. The main body includes a first section, a second section, a first resilient device connected between the first section and the second section and susceptible of bending along a first direction, a third section including a single-piece weight, and a second resilient device connected between the second section and the third section and susceptible of bending along a second direction. The main body is formed by a machining process to remove parts of a monolithic blank.

Abstract: A foldable electronic device including a first frame, a second frame, a first connecting rod, and a second connecting rod is provided. The first connecting rod has a first end and a second end, wherein the first end and the second end are respectively pivoted on one side of the first frame and the second frame. The second connecting rod has a third end and a fourth end, wherein the third end and the fourth end are respectively pivoted on the other side of the first frame and the second frame. The first connecting rod is suitable for rotating along a first axle, and the second connecting rod is suitable for rotating along a second axle, wherein the first axle is not coaxial with the second axle.

Abstract: A foldable electronic device including a first frame, a second frame, a first connecting rod, and a second connecting rod is provided. The first connecting rod has a first end and a second end, wherein the first end and the second end are respectively pivoted on one side of the first frame and the second frame. The second connecting rod has a third end and a fourth end, wherein the third end and the fourth end are respectively pivoted on the other side of the first frame and the second frame. The first connecting rod is suitable for rotating along a first axle, and the second connecting rod is suitable for rotating along a second axle, wherein the first axle is not coaxial with the second axle.