Abstract: A flip chip ball grid array package includes a package substrate and a flip chip device mounted on a top surface of the package substrate. The flip chip device includes a semiconductor integrated circuit die; an epoxy molding compound encapsulating vertical sidewalls of the semiconductor integrated circuit die; a re-distribution layer structure disposed on an active surface of the semiconductor integrated circuit die and on a lower surface of the epoxy molding compound; a sintered nanosilver layer disposed on a passive rear surface of the semiconductor integrated circuit die and on an upper surface of the epoxy molding compound; and a stiffener ring mounted around the flip chip device on the package substrate.

Abstract: A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate, coves the electronic component and has a recess. The liquid metal is formed between the recess and the electronic component.

Abstract: A semiconductor package structure includes a first redistribution layer, a first semiconductor die, a second semiconductor die, a thermal spreader, a molding material, and a second redistribution layer. The first semiconductor die and the second semiconductor die are disposed side-by-side over the first redistribution layer. The thermal spreader vertically overlaps with the first semiconductor die and/or the second semiconductor die. The molding material surrounds the thermal spreader, the first semiconductor die and the second semiconductor die. The second redistribution layer is disposed over the molding material.

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface. A semiconductor device is mounted on the top surface of the substrate. The semiconductor device has an active front surface directly facing the substrate, and an opposite rear surface. A vapor chamber lid is in thermal contact with the rear surface of the semiconductor device. The vapor chamber lid includes an internal vacuum-sealed cavity that stores a working fluid, and wick structures for recirculating the working fluid within the internal vacuum-sealed cavity.

Abstract: A semiconductor device includes a substrate, an electronic component, a cover, a heat conduction component and a dam. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The heat conduction component is disposed between the electronic component and the cover. The dam is disposed between the electronic component and the cover and surrounds the heat conduction component.

Abstract: A rotary cutting device for a processing machine has a rotary cutter holder provided with an angle-adjusting device and a height-adjusting device. The angle-adjusting device is able to adjust the position of the rotary cutter of the rotary cutter base at any angle, and the height-adjusting device able to adjust the height of the rotary cutter base for matching with the shape and the position of a work piece A power unit is installed on the rotary cutter base for supplying the rotary cutter with power. A clamping device for a processing machine is provided with a clamping unit base having a clamping unit provided with an upper and a lower clamping member. The clamping unit base is provided with a power unit for adjusting the clamping distance between the two clamping members.

Abstract: A method for previewing an image in a camera prior to output. The method includes steps of gathering image data, storing the image data, calculating display parameters using the stored image data, storing the display parameters in a look-up table; and applying the display parameters in the look-up table to at least a portion of the image data to produce preview image data. The display parameters can be quickly calculated using a digital signal processor to achieve real-time image previewing. The parameters used in an embodiment camera are vertical down sampling (51) white balance and gain control (52), horizontal up/down sampling (53), and color space conversion and gamma correction (55). The resulting preview processed image may be stored in memory via an interface (56) and viewed via a preview display.