Abstract: A photo resist layer is used to protect a dielectric layer and conductive elements embedded in the dielectric layer when patterning an etch stop layer underlying the dielectric layer. The photo resist layer may further be used to etch another dielectric layer underlying the etch stop layer, where etching the next dielectric layer exposes a contact, such as a gate contact. The bottom layer can be used to protect the conductive elements embedded in the dielectric layer from a wet etchant used to etch the etch stop layer.

Abstract: A knitted component comprising two yarns, forming at least a heel region of an upper for an article of footwear, where one of the yarns comprises a thermoplastic material. The outer surface may include a fused area comprising a first thermoplastic yarn. The inner surface may be at least partially formed with a second yarn and may substantially exclude the thermoplastic material. There may be a transitional area including a reduced amount of thermoplastic material relative to a fused area. The knitted component may include a cushioning material between layers of the knit element.

Abstract: A gate structure includes a substrate divided into an N-type transistor region and a P-type transistor region. An interlayer dielectric covers the substrate. A first trench is embedded in the interlayer dielectric within the N-type transistor region. A first gate electrode having a bullet-shaped profile is disposed in the first trench. A gate dielectric contacts the first trench. An N-type work function layer is disposed between the gate dielectric layer and the first gate electrode. A second trench is embedded in the interlayer dielectric within the P-type transistor region. A second gate electrode having a first mushroom-shaped profile is disposed in the second trench. The gate dielectric layer contacts the second trench. The N-type work function layer is disposed between the gate dielectric layer and the second gate electrode. A first P-type work function layer is disposed between the gate dielectric layer and the N-type work function layer.

Abstract: A supporting assembly configured to fix chassis of electronic device to fixing bracket. Supporting assembly includes plate body, cushion, fastener and spacer. Plate body includes mounting hole and wall surface forming mounting hole, and plate body is configured to be fixed to chassis of electronic device. Cushion is disposed through mounting hole and includes opening. Fastener is disposed through opening of cushion. A side of fastener is configured to be fixed to fixing bracket, and cushion is clamped between another side of fastener and fixing bracket so as to be compressed. Spacer is disposed in mounting hole and located between wall surface of plate body and cushion. Hardness of spacer is greater than hardness of cushion.

Abstract: A bearing assembly configured to be disposed on casing of electronic device and including plate body, first damping component, second damping component, first fastener and second fastener. The plate body includes first mounting hole and second mounting hole. The first damping component is disposed in the first mounting hole. The first damping component includes first hole. The second damping component is disposed in the second mounting hole. The second damping component includes second hole. The first fastener is disposed in the first hole of the first damping component and configured to be fixed to the casing of the electronic device. The second fastener is disposed in the second hole of the second damping component and configured to be fixed to the casing of the electronic device. A hardness of the first damping component is greater than a hardness of the second damping component.

Abstract: A supporting assembly configured to fix chassis of electronic device to fixing bracket. Supporting assembly includes plate body, cushion, fastener and spacer. Plate body includes mounting hole and wall surface forming mounting hole, and plate body is configured to be fixed to chassis of electronic device. Cushion is disposed through mounting hole and includes opening. Fastener is disposed through opening of cushion. A side of fastener is configured to be fixed to fixing bracket, and cushion is clamped between another side of fastener and fixing bracket so as to be compressed. Spacer is disposed in mounting hole and located between wall surface of plate body and cushion. Hardness of spacer is greater than hardness of cushion.

Abstract: A supporting assembly configured to fix a casing of an electronic device to a chassis and including a plate body, a cushioning component and a fastener. The plate body includes a mounting hole. The cushioning component is disposed through the mounting hole. The cushioning component includes a through hole. The fastener is disposed through the through hole of the cushioning component. A side of the fastener is configured to be fixed to the chassis, and the cushioning component is compressed by another side of the fastener and the chassis.

Abstract: The disclosure provides an adjustable fixing assembly. The adjustable fixing assembly includes a base plate and a cover plate. The cover plate includes a plate portion and a protrusion portion protruding from the plate portion. The cover plate includes a first installation position and a second installation position. When the cover plate is in the first installation position, the protrusion portion extends away from the base plate, and the cover plate is spaced apart from the base plate by a first minimum distance. When the cover plate is in the second installation position, the protrusion portion extends towards the base plate, and the cover plate is spaced apart from the base plate by a second minimum distance, where the second minimum distance is smaller than the first minimum distance.

Abstract: A bearing assembly configured to be disposed on casing of electronic device and including plate body, first damping component, second damping component, first fastener and second fastener. The plate body includes first mounting hole and second mounting hole. The first damping component is disposed in the first mounting hole. The first damping component includes first hole. The second damping component is disposed in the second mounting hole. The second damping component includes second hole. The first fastener is disposed in the first hole of the first damping component and configured to be fixed to the casing of the electronic device. The second fastener is disposed in the second hole of the second damping component and configured to be fixed to the casing of the electronic device. A hardness of the first damping component is greater than a hardness of the second damping component.

Abstract: A supporting assembly configured to fix a casing of an electronic device to a chassis and including a plate body, a cushioning component and a fastener. The plate body includes a mounting hole. The cushioning component is disposed through the mounting hole. The cushioning component includes a through hole. The fastener is disposed through the through hole of the cushioning component. A side of the fastener is configured to be fixed to the chassis, and the cushioning component is compressed by another side of the fastener and the chassis.

Abstract: A plate for at least partially covering a first circuit board includes a body portion, at least one first fixing post, at least one second fixing post, and at least one crossing region. The body portion is configured to cover the first circuit board. The first fixing post is connected to a side of the body portion and protrudes from the body portion. The first fixing post is configured to be fixed to the first circuit board. The second fixing post is connected to another side of the body portion and protrudes from the body portion. The second fixing post is configured to be fixed to a second circuit board. The crossing region is disposed on the body portion. The crossing region is configured to allow at least one electronic component on the first circuit board to pass through.

Abstract: The disclosure provides an adjustable fixing assembly. The adjustable fixing assembly includes a base plate and a cover plate. The cover plate includes a plate portion and a protrusion portion protruding from the plate portion. The cover plate includes a first installation position and a second installation position. When the cover plate is in the first installation position, the protrusion portion extends away from the base plate, and the cover plate is spaced apart from the base plate by a first minimum distance. When the cover plate is in the second installation position, the protrusion portion extends towards the base plate, and the cover plate is spaced apart from the base plate by a second minimum distance, where the second minimum distance is smaller than the first minimum distance.

Abstract: A measurement fixture includes a base, a lateral plate, a top plate, a movable measurement plate and a dimensional measurement component. The lateral plate has a piercing hole and a plurality of guiding pillars. The base and the top plate are respectively disposed on opposite sides of the lateral plate. The movable measurement plate utilizes a plurality of guiding holes to movably connect with the plurality of guiding pillars. The movable measurement plate includes an opening portion and an indicating portion adjacent by the opening portion. The dimensional measurement component movably passes through the piercing hole. A first end of the dimensional measurement component protrudes from a surface of the lateral plate facing a blade server to touch the blade server, and a second end of the dimensional measurement component protrudes from the other opposite surface of the lateral plate to partly protrude from the opening portion.

Abstract: An electronic device includes a casing, a first power housing and a second power housing. The casing is equipped with a main board. The first power housing is disposed in the casing. The first power housing has a plurality of engaging portions. The second power housing has a plurality of engaging grooves. Each of the engaging grooves is corresponding to one of the engaging portions. Each of the engaging grooves is L-shaped and has an opening. When the second power housing is disposed on the first power housing and the engaging portion enters the engaging groove through the opening, the second power housing is capable of moving with respect to the first power housing in a horizontal direction, such that the engaging portion is engaged with the engaging groove.

Abstract: An electronic device includes a casing, a first power housing and a second power housing. The casing is equipped with a main board. The first power housing is disposed in the casing. The first power housing has a plurality of engaging portions. The second power housing has a plurality of engaging grooves. Each of the engaging grooves is corresponding to one of the engaging portions. Each of the engaging grooves is L-shaped and has an opening. When the second power housing is disposed on the first power housing and the engaging portion enters the engaging groove through the opening, the second power housing is capable of moving with respect to the first power housing in a horizontal direction, such that the engaging portion is engaged with the engaging groove.

Abstract: A measurement fixture includes a base, a lateral plate, a top plate, a movable measurement plate and a dimensional measurement component. The lateral plate has a piercing hole and a plurality of guiding pillars. The base and the top plate are respectively disposed on opposite sides of the lateral plate. The movable measurement plate utilizes a plurality of guiding holes to movably connect with the plurality of guiding pillars. The movable measurement plate includes an opening portion and an indicating portion adjacent by the opening portion. The dimensional measurement component movably passes through the piercing hole. A first end of the dimensional measurement component protrudes from a surface of the lateral plate facing a blade server to touch the blade server, and a second end of the dimensional measurement component protrudes from the other opposite surface of the lateral plate to partly protrude from the opening portion.

Abstract: A movement-orbit sensing system is provided for collecting movement-orbits of sensing points of an object under detection, which comprises sensors, a host a comparison unit, and a determination unit. The sensors are used for outputting sensed signals and multi-dimensional coordinate value. The host comprises units for generating a multi-dimensional coordinate signal and sensed values, and a movement-obit architecture unit is used for architecting the movement-orbit of each sensing point according to the multi-dimensional coordinate signal and sensed values. The comparison unit is used for comparing the movement-orbit of the object under detection with a standard movement-orbit information, thereby obtaining an offset value. The determination unit is used for determining whether the offset value is greater than a preset value. If the offset value is greater than the preset value, the movement-orbit of at least one of the sensing points is determined to be erroneous.

Abstract: A retaining structure and a server structure having the same are provided herein. The retaining structure is used for retaining a circuit board on a chassis in the server structure. The circuit board includes a first connection portion and a second connection portion for respectively mating with a first connector and a second connector. The retaining structure includes a plurality of side walls commonly defining a channel for accommodating a region of the circuit board, a backstop section located within the channel and abutting against a protrusion of the circuit board for buffering a mating force applied from the second connection portion to the first connection portion, and a damping snapper located on one of said side was for damping the retaining structure to the chassis.

Abstract: A 3D model component comparing system and method thereof are provided. The 3D model component comparing system includes a model-capturing unit, a processing unit, and a message-prompting unit. The model-capturing unit obtains a first model and a second model in a model design interface. The processing unit compares a plurality of components of the first model and a plurality of components of the second model to obtain a plurality of components which have different names, and analyzes them to determine whether the plurality of components which have different names have identical component data correspondingly or not. The message-prompting unit outputs a renaming prompting message if the plurality of components, which have different names, have identical component data correspondingly. Thus the design error rate is reduced.

Abstract: A movement-trace sensing system is disclosed which is applied on an object under detection with a plurality of sensing points. The sensing system comprises a plurality of sensors and a host. The sensors are used to respectively sense the movement of the sensing points to generate a plurality of corresponding multi-dimensional coordinate values. The host comprises a sensing unit, a mensuration database, a selecting unit, a pattern constructing unit, a calculating unit, and a dynamic-pattern database. The calculating unit derives movement traces of the sensing points under at least one of dynamic-movement modes according to a specific second static pattern dedicated to the object under detection and multi-dimensional messages corresponding to the sensing points, and further generates a specific mobile pattern corresponding to the object.