Patents by Inventor Chun-You Lin

Chun-You Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9378374
    Abstract: The present disclosure discloses method and device for prompting program uninstallation and belongs to the field of the Internet. The method comprises: performing a security assessment of an application program installed on a mobile terminal, thereby obtaining a security assessment result; obtaining security identification information corresponding to the security assessment result based on pre-stored correlations between security assessment results and security identification information; establishing a correlation between the obtained security identification information and the application program, and displaying the correlation to a user.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: June 28, 2016
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) CO., LTD
    Inventors: Qing Wang, Hao Ran Guo, Yi Xia Yuan, Xun Chang Zhan, Chun You Lin, Peng Tao Li, Jia Shun Song
  • Publication number: 20140059691
    Abstract: The present disclosure discloses method and device for prompting program uninstallation and belongs to the field of the Internet. The method comprises: performing a security assessment of an application program installed on a mobile terminal, thereby obtaining a security assessment result; obtaining security identification information corresponding to the security assessment result based on pre-stored correlations between security assessment results and security identification information; establishing a correlation between the obtained security identification information and the application program, and displaying the correlation to a user.
    Type: Application
    Filed: October 29, 2013
    Publication date: February 27, 2014
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Qing WANG, Hao Ran GUO, Yi Xia YUAN, Xun Chang ZHAN, Chun You LIN, Peng Tao LI, Jia Shun SONG
  • Publication number: 20140019957
    Abstract: This discloses a software-sharing method among terminals. The method includes: receiving a request transmitted by a second terminal to obtain a second shared software installation package; obtaining, in accordance with the shared software ID, a default software installation package corresponding to the shared software ID; generating the second shared software installation package in accordance with the default software installation package and an sharing party ID; transmitting the second installation package to the second terminal, allowing installation at the second terminal the shared software using the second installation package. Also disclosed is a server including: a software installation package acquisition request obtaining module, a shared software installation package transmitting module, a shared software installation package generating module, and a default software installation package obtaining module.
    Type: Application
    Filed: September 17, 2013
    Publication date: January 16, 2014
    Applicant: Tencent Technology (Shenzhen) Co., Ltd.
    Inventors: Qing WANG, Hao Ran GUO, Quan Hao XIAO, Yi Xia YUAN, Jia Shun SONG, Peng Tao LI, Xun Chang ZHAN, Chun You LIN
  • Patent number: 8072730
    Abstract: The present invention relates to a chip-type protection device having an enclosed micro-gap between electrodes. The invention includes a substrate on which a pair of discharge electrodes extend towards each other by a micro-gap. A wall is disposed in a manner spaced apart from the micro-gaps by a predetermined distance, on which a cover portion is mounted in a straddling manner across the micro-gaps. The wall and the cover portion are integrated under a predetermined gaseous environment to form a hermectic chamber on which an outer protective layer is coated. End electrodes are subsequently formed on the substrate in a manner connected to conductive portions of the discharge electrodes. The invention provides a protection device against over-voltage.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: December 6, 2011
    Assignee: TA-I Technology Co., Ltd.
    Inventors: Ho-Chieh Yu, Chun-You Lin, Hung-Yi Chuang
  • Publication number: 20100020458
    Abstract: The present invention relates to a chip-type protection device having an enclosed micro-gap between electrodes. The invention includes a substrate on which a pair of discharge electrodes extend towards each other by a micro-gap. A wall is disposed in a manner spaced apart from the micro-gaps by a predetermined distance, on which a cover portion is mounted in a straddling manner across the micro-gaps. The wall and the cover portion are integrated under a predetermined gaseous environment to form a hermectic chamber on which an outer protective layer is coated. End electrodes are subsequently formed on the substrate in a manner connected to conductive portions of the discharge electrodes. The invention provides a protection device against over-voltage.
    Type: Application
    Filed: July 22, 2009
    Publication date: January 28, 2010
    Applicant: IA-I TECHNOLOGY CO., LTD
    Inventors: Ho-Chieh Yu, Chun-You Lin, Hung-Yi Chuang