Abstract: The disclosure provides a connector assembly which includes a first connector module, a second connector module and a connection assistance module. The first connector module includes a first carrier and two first connectors which are fixed to the first carrier. The second connector module includes a second carrier and two second connectors which are fixed to the second carrier. The second connectors are respectively and detachably connected to the first connectors. The connection assistance module includes a rotatable component and an assembled component respectively disposed on the first carrier and the second carrier. The rotatable component has an inclined surface, and the assembled component has an engaging portion. When the rotatable component is rotated, the engaging portion is guided by the inclined surface so that the first carrier is moved toward or away from the second carrier, allowing the first connectors to be detachably connected to the second connectors.

Abstract: The disclosure provides a connector assembly which includes a first connector module, a second connector module and a connection assistance module. The first connector module includes a first carrier and two first connectors which are fixed to the first carrier. The second connector module includes a second carrier and two second connectors which are fixed to the second carrier. The second connectors are respectively and detachably connected to the first connectors. The connection assistance module includes a rotatable component and an assembled component respectively disposed on the first carrier and the second carrier. The rotatable component has an inclined surface, and the assembled component has an engaging portion. When the rotatable component is rotated, the engaging portion is guided by the inclined surface so that the first carrier is moved toward or away from the second carrier, allowing the first connectors to be detachably connected to the second connectors.

Abstract: An LED package structure includes an insulation substrate, a heat-sink slug, an LED chip assembly, four diodes, and a lead-frame assembly. The heat-sink slug is inserted on the insulation substrate, and includes a loading surface exposed externally, where the LED chip assembly is fixed on the loading surface. The lead-frame assembly includes two externally-extended lead frames and four loading lead frames which are apart from one another, and which are all inserted on the insulation substrate. The four diodes are correspondingly loaded on, and electrically connected with, the four loading lead frames. The LED chip assembly and the four diodes constitute a bridge circuit, wherein the bridge circuit has its positive electrode and negative electrode located at the two externally-extended lead frames, respectively. Therefore, there is no need for the LED package structure to connect externally a rectifier diode module so as to achieve the purpose of convenient use.