Abstract: A water quality detection device including a detection tank, a sensor, the cleaner and a processor is provided. The sensor is disposed on the detection tank and is configured to sense a to-be-detected liquid within the detection tank. The cleaner is configured to clean the sensor. The processor is electrically connected to the sensor and the cleaner and is configured to: execute an initialization procedure, which includes driving the sensor to sense the to-be-detected liquid to obtain a number of initial sensing values and calculating a threshold value according to the initial sensing values; drive the sensor to sense the to-be-detected liquid to obtain a sensing value of the to-be-detected liquid, and determine whether the sensing value of the to-be-detected liquid reaches the threshold value; drive the cleaner to operate when the sensing value of the to-be-detected liquid reaches the threshold value.

Abstract: A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.

Abstract: Various embodiments of the present disclosure are directed towards an imaging device including a first image sensor element and a second image sensor element respectively comprising a pixel unit disposed within a semiconductor substrate. The first image sensor element is adjacent to the second image sensor element. A first micro-lens overlies the first image sensor element and is laterally shifted from a center of the pixel unit of the first image sensor element by a first lens shift amount. A second micro-lens overlies the second image sensor element and is laterally shifted from a center of the pixel unit of the second image sensor element by a second lens shift amount different from the first lens shift amount.

Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. A gate structure is disposed along a front-side of the substrate. A back-side of the substrate includes one or more first angled surfaces defining a central diffuser disposed over the image sensing element. The back-side of the substrate further includes second angled surfaces defining a plurality of peripheral diffusers laterally surrounding the central diffuser. The plurality of peripheral diffusers are a smaller size than the central diffuser.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a first photodetector disposed in a first pixel region of a semiconductor substrate and a second photodetector disposed in a second pixel region of the semiconductor substrate. The second photodetector is laterally separated from the first photodetector. A first diffuser is disposed along a back-side of the semiconductor substrate and over the first photodetector. A second diffuser is disposed along the back-side of the semiconductor substrate and over the second photodetector. A first midline of the first pixel region and a second midline of the second pixel region are both disposed laterally between the first diffuser and the second diffuser.

Abstract: A method for detecting dust mite antigens includes the steps of collecting a dust sample, applying an extraction and cleanup procedure for dust mite antigens from the dust sample in order to obtain a sample solution ready for measurement, and placing the sample solution on a SERS chip without immunological modification and under a Raman spectrometer for SERS detection in order to identify whether any dust mite antigens exist in the sample solution.

Abstract: A method for detecting dust mite antigens includes the steps of collecting a dust sample, applying an extraction and cleanup procedure for dust mite antigens from the dust sample in order to obtain a sample solution ready for measurement, and placing the sample solution on a SERS chip without immunological modification and under a Raman spectrometer for SERS detection in order to identify whether any dust mite antigens exist in the sample solution.

Abstract: According to one exemplary embodiment, a parallel scheduling method for network data transmission is provided. This method generates a corresponding modulus condition set for each weight in a weight set, with each modulus condition of the modulus condition set having a modulus operation, and a divisor and a remainder for the modulus operation, uses a network node to transmit the modulus condition set corresponding to said each weight to a transmitting node corresponding to the weigh. Based on the modulus condition set, the transmitting node transmits a plurality of data chunks, and at least one receiving node receives the plurality of data chunks, wherein each data chunk corresponding to a sequence number, and the sequence number matches a corresponding modulus condition in the modulus condition set.

Abstract: A method of manufacturing an isolation structure suitable for a non-volatile memory is provided. A substrate is provided. A dielectric layer, a conductive layer, and a hard mask layer are sequentially formed on the substrate. The hard mask layer and the conductive layer are patterned to form a first trench which exposes the dielectric layer. A first liner is formed on the substrate. The first liner and the dielectric layer that are exposed by the first trench are removed to expose the substrate. A spacer is formed on sidewalls of the conductive layer and the hard mask layer. The substrate is partly removed to form a second trench with use of the conductive layer and the hard mask layer with the spacer as a mask. An isolation layer is formed in the second trench. The distance between the conductive layers is greater than the width of the second trench.

Abstract: A method of manufacturing an isolation structure suitable for a non-volatile memory is provided. A substrate is provided. A dielectric layer, a conductive layer, and a hard mask layer are sequentially formed on the substrate. The hard mask layer and the conductive layer are patterned to form a first trench which exposes the dielectric layer. A first liner is formed on the substrate. The first liner and the dielectric layer that are exposed by the first trench are removed to expose the substrate. A spacer is formed on sidewalls of the conductive layer and the hard mask layer. The substrate is partly removed to form in a second trench with use of the conductive layer and the hard mask layer with the spacer as a mask. An isolation layer is formed in the second trench. The distance between the conductive layers is greater than the width of the second trench.

Abstract: According to one exemplary embodiment, a parallel scheduling method for network data transmission is provided. This method generates a corresponding modulus condition set for each weight in a weight set, with each modulus condition of the modulus condition set having a modulus operation, and a divisor and a remainder for the modulus operation, uses a network node to transmit the modulus condition set corresponding to said each weight to a transmitting node corresponding to the weigh. Based on the modulus condition set, the transmitting node transmits a plurality of data chunks, and at least one receiving node receives the plurality of data chunks, wherein each data chunk corresponding to a sequence number, and the sequence number matches a corresponding modulus condition in the modulus condition set.