Patents by Inventor Chun-Yu Hou

Chun-Yu Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147639
    Abstract: An electronic device includes a substrate, a side wiring, a protective film, and a first filler. The substrate has a first surface, a second surface, and a side surface connected between the first surface and the second surface. The side wiring is disposed on the substrate and extends from the first surface to the second surface through the side surface. The protective film is disposed on the side wiring. The side wiring is sandwiched between the substrate and the protective film. An edge of the protective film extends beyond a side wall of the side wiring, and the protective film, the side wall of the side wiring, and the substrate define a gap. The first filler is disposed on the protective film and in the gap, wherein the first filler includes a first material and a plurality of particles mixed within the first material.
    Type: Application
    Filed: October 4, 2023
    Publication date: May 2, 2024
    Applicant: AUO Corporation
    Inventors: Chih-Wen Lu, Fan-Yu Chen, Chun-Yueh Hou, Hsi-Hung Chen
  • Patent number: 11963300
    Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: April 16, 2024
    Assignee: Au Optronics Corporation
    Inventors: Chun-Yueh Hou, Hao-An Chuang, Fan-Yu Chen, Hsi-Hung Chen, Yun Cheng, Wen-Chang Hsieh, Chih-Wen Lu
  • Patent number: 8013709
    Abstract: The present invention provides a conductive module used for assembling a magnetic element and an electronic component. The conductive module includes a conductive base, an electronic component and a plurality of conductive units. The electronic component is electrically connected to the conductive base and disposed on one side of the conductive base. The conductive units have respective hollow portions. The conductive units are spaced from each other and fixed on the conductive base such that the hollow portions of the conductive units are aligned with each other to define a channel.
    Type: Grant
    Filed: February 27, 2010
    Date of Patent: September 6, 2011
    Assignee: Delta Electronics, Inc.
    Inventors: Sheng-Nan Tsai, Yi-Fan Wu, Yung-Sheng Yeh, Jia-Li Tsai, Chia-Cheng Yang, Yung-Yu Chang, Tsung-Sheng Yeh, Hua-Sheng Lin, Chun-Yu Hou, Tsung-Hsiao Wu
  • Publication number: 20100188830
    Abstract: The present invention provides a conductive module used for assembling a magnetic element and an electronic component. The conductive module includes a conductive base, an electronic component and a plurality of conductive units. The electronic component is electrically connected to the conductive base and disposed on one side of the conductive base. The conductive units have respective hollow portions. The conductive units are spaced from each other and fixed on the conductive base such that the hollow portions of the conductive units are aligned with each other to define a channel.
    Type: Application
    Filed: February 27, 2010
    Publication date: July 29, 2010
    Inventors: Sheng-Nan Tsai, Yi-Fan Wu, Yung-Sheng Yeh, Jia-Li Tsai, Chia-Cheng Yang, Yung-Yu Chang, Tsung-Sheng Yeh, Hua-Sheng Lin, Chun-Yu Hou, Tsung-Hsiao Wu
  • Patent number: 7456718
    Abstract: A wire-arranging pin is mounted on a winding frame for facilitating fixing an outlet part of a winding coil. The winding coil is wound around the winding frame. The wire-arranging pin includes a first connecting part, a main fixing part and a second connecting part. The first connecting part has a first end and a second end, wherein the first end is coupled to the winding frame. The main fixing part is coupled to the second end of the first connecting part and has a first notch. The outlet part of the winding coil penetrates through the first notch to be held by the main fixing part. The second connecting part has a first end coupled to the main fixing part.
    Type: Grant
    Filed: January 4, 2008
    Date of Patent: November 25, 2008
    Assignee: Delta Electronics, Inc.
    Inventors: Ching-Hsien Teng, Hsin-Wei Tsai, Chun-Yu Hou, Tzu-Yang Liu, Zhi-Liang Zhang, Tsung-Sheng Yeh