Patents by Inventor Chun-Yu Ko
Chun-Yu Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240083828Abstract: The present application relates to a system and a method for producing vinyl chloride. The system comprise a preheat unit, a gas-liquid separating unit, a heat-recovery unit, a heating unit and a thermal pyrolysis unit, and therefore heat energy of the thermal pyrolysis product can be efficiently recovered. Energy cost of the system can be efficiently lowered with the heat-recovery unit and the heating unit, and further prolonging operating cycle of the system.Type: ApplicationFiled: June 28, 2023Publication date: March 14, 2024Inventors: Wen-Hsi HUANG, Sheng-Yen KO, Shih-Hong CHEN, Chun-Yu LIN
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Patent number: 11626525Abstract: A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.Type: GrantFiled: September 4, 2020Date of Patent: April 11, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chun Yu Ko, Tsu-Hsiu Wu, Meng-Jen Wang
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Publication number: 20230037713Abstract: The present disclosure provides an electronic package. The electronic package includes a substrate, a first electronic component, an encapsulant, and a shielding layer. The substrate has a first upper surface, a second upper surface, and a first lateral surface extending between the first upper surface and the second upper surface. The first electronic component is disposed on the substrate. The encapsulant coves the first electronic component and the first lateral surface of the substrate. The shielding layer covers the encapsulant. The shielding layer is spaced apart from the first lateral surface of the substrate.Type: ApplicationFiled: August 6, 2021Publication date: February 9, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Tang CHU, Tsu-Hsiu WU, Chun Yu KO
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Patent number: 11569422Abstract: A semiconductor package is provided in the present disclosure. The semiconductor package comprises: a substrate, an electronic device disposed on the substrate, a lid disposed on the substrate and surrounding the electronic device an encapsulant formed over the substrate, encapsulating the electronic device and the lid; and a plurality of fillers in the encapsulant, configured to diffuse light interacting with the electronic device. In this way, through the use of the encapsulant including the fillers distributed therein, additional optical filters and diffusers are not needed. Also, through the use of the lid, undesired stray light can be prevented from being interacting with the electronic device.Type: GrantFiled: September 9, 2020Date of Patent: January 31, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Wei-Tang Chu, Tsu-Hsiu Wu, Chun Yu Ko
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Publication number: 20220077326Abstract: A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.Type: ApplicationFiled: September 4, 2020Publication date: March 10, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chun Yu KO, Tsu-Hsiu WU, Meng-Jen WANG
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Publication number: 20220077364Abstract: A semiconductor package is provided in the present disclosure. The semiconductor package comprises: a substrate, an electronic device disposed on the substrate, a lid disposed on the substrate and surrounding the electronic device an encapsulant formed over the substrate, encapsulating the electronic device and the lid; and a plurality of fillers in the encapsulant, configured to diffuse light interacting with the electronic device. In this way, through the use of the encapsulant including the fillers distributed therein, additional optical filters and diffusers are not needed. Also, through the use of the lid, undesired stray light can be prevented from being interacting with the electronic device.Type: ApplicationFiled: September 9, 2020Publication date: March 10, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Tang CHU, Tsu-Hsiu WU, Chun Yu KO
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Publication number: 20210313476Abstract: An optical sensor package structure and an optical module structure are provided. The optical sensor package structure includes a substrate, a sensor device and a transparent encapsulant. The sensor device is electrically connected to the substrate, and has a sensing area facing the substrate. The transparent encapsulant covers the sensing area of the sensor device.Type: ApplicationFiled: April 2, 2020Publication date: October 7, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chun Yu KO, Tsu-Hsiu WU, Wei-Tang CHU
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Patent number: 8040610Abstract: A light guiding film has a film body and a micro-structured portion. The film body has a first side, a second side and a reference horizontal level vertical to the second side. The micro-structured portion is set on the second side and has a plurality of V-shaped grooves, and each one of the V-shaped grooves has a first sub-face and a second sub-face. The first sub-face has a first included angle between 16° and 22° with respect to said reference horizontal level, and the second sub-face has a second included angle between 8° and 17° with respect to said reference horizontal level. When an incident light beam injects downwardly on said micro-structured portion in a predetermined incident angle range, a predetermined percentage of said incident light beam emit an emissive light beam projected out in an included angle range between 0° and 90° with respect to said reference horizontal level.Type: GrantFiled: August 3, 2010Date of Patent: October 18, 2011Assignee: Chi Lin Technology Co., Ltd.Inventors: Chun-Yu Ko, Chien-Liang Lu
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Publication number: 20110043919Abstract: A light guiding film has a film body and a micro-structured portion. The film body has a first side, a second side and a reference horizontal level vertical to the second side. The micro-structured portion is set on the second side and has a plurality of V-shaped grooves, and each one of the V-shaped grooves has a first sub-face and a second sub-face. The first sub-face has a first included angle between 16° and 22° with respect to said reference horizontal level, and the second sub-face has a second included angle between 8° and 17° with respect to said reference horizontal level. When an incident light beam injects downwardly on said micro-structured portion in a predetermined incident angle range, a predetermined percentage of said incident light beam emit an emissive light beam projected out in an included angle range between 0° and 90° with respect to said reference horizontal level.Type: ApplicationFiled: August 3, 2010Publication date: February 24, 2011Applicant: CHI LIN TECHNOLOGY CO., LTD.Inventors: CHUN-YU KO, CHIEN-LIANG LU