Patents by Inventor Chun-Yu Li

Chun-Yu Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11173637
    Abstract: The present disclosure includes a mold base set, a forming mold core, a rubber pad or a rubber bladder, and a lateral pressure mechanism, wherein the mold base set includes a first mold base and a second mold base, and the second mold base has a mounting part; the forming mold core is arranged on the first mold base; the rubber pad is arranged on the mounting part, and the base surface and side wall surface of the sheet are molded during mold assembly of the mold base set; and the lateral pressure mechanism includes a slope fixed block fixed to the first mold base and a slope slide block set arranged on the second mold base.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: November 16, 2021
    Assignee: NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Chun-Chih Kuo, Tse-Chang Li, Dai-You Wu, Cheng-Yu Yang
  • Patent number: 11166292
    Abstract: Methods and apparatuses for handling collision between sidelink feedback and sidelink data in a wireless communication system are disclosed herein. In one method, a User Equipment (UE) is (pre-)configured to perform one or more sidelink transmissions on multiple carriers, wherein the UE is able to transmit a first number of carriers among the multiple carriers at the same time. The UE selects a first resource for transmitting a first sidelink transmission in a first slot on a first carrier. The UE derives a second resource for transmitting a PSFCH delivering a feedback in a second slot on a second carrier, wherein the second slot is at least partly overlapping with the first slot in a time domain. The UE determines whether to prioritize either the PSFCH or the first sidelink transmission based on a rule when the number of carriers which the UE identifies to transmit in the overlapped slot exceeds the first number of carriers.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: November 2, 2021
    Assignee: ASUSTek Computer Inc.
    Inventors: Chun-Wei Huang, Ming-Che Li, Wei-Yu Chen
  • Publication number: 20210304068
    Abstract: A data processing method includes the following steps: generating a machine-learning parameter and obtaining a storage parameter code, wherein the storage parameter code corresponds to a storage space; receiving the machine-learning parameter and the storage parameter code, and storing the machine-learning parameter in the storage space according to the storage parameter code, and generating an event notification when the machine-learning parameter is modified; and generating a loading request according to the event notification, and the loading request is used to request the modified machine-learning parameter, wherein after the loading request is generated, the modified machine-learning parameter is downloaded from the storage space corresponding to the storage parameter code.
    Type: Application
    Filed: August 4, 2020
    Publication date: September 30, 2021
    Inventors: Chia-Chen CHIANG, Meng-Yu LI, Chun-Hung CHEN, Chen-Chung LEE
  • Publication number: 20210263680
    Abstract: A management method for managing a memory storage device compatible with a PCIe (PCI Express) standard is disclosed. The memory storage device has a plurality of pins configured to couple to a host system. The management method includes: transmitting a first command to the memory storage device through at least one first pin among the pins to control the memory storage device to enter a target link status; and when the memory storage device is in the target link status, transmitting a second command to the memory storage device through a second pin among the pins to control the memory storage device to leave the target link status. The second pin is not a pin dedicated to control the memory storage device to enter or leave the target link status.
    Type: Application
    Filed: March 17, 2020
    Publication date: August 26, 2021
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Yi-Feng Li, Chao-Ta Huang, Chun-Yu Ling, Jia-Huei Yeh
  • Patent number: 10804345
    Abstract: An organic light emitting diode display apparatus includes a substrate and a pixel structure disposed on the substrate. The pixel structure includes an active element, a first electrode electrically connected to the active element, a bank layer disposed on the first electrode, a light emitting layer disposed on the first electrode and an opening of the bank layer, and a second electrode disposed on the light emitting layer. The first electrode has a first region and a plurality of protrusions disposed outside the first region. The opening of the bank layer overlaps with the first region and the protrusions of the first electrode.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: October 13, 2020
    Assignee: Au Optronics Corporation
    Inventors: Chun-Yu Li, Ya-Pei Kuo, Tsu-Wei Chen
  • Publication number: 20190393284
    Abstract: An organic light emitting diode display apparatus includes a substrate and a pixel structure disposed on the substrate. The pixel structure includes an active element, a first electrode electrically connected to the active element, a bank layer disposed on the first electrode, a light emitting layer disposed on the first electrode and an opening of the bank layer, and a second electrode disposed on the light emitting layer. The first electrode has a first region and a plurality of protrusions disposed outside the first region. The opening of the bank layer overlaps with the first region and the protrusions of the first electrode.
    Type: Application
    Filed: May 23, 2019
    Publication date: December 26, 2019
    Applicant: Au Optronics Corporation
    Inventors: Chun-Yu Li, Ya-Pei Kuo, Tsu-Wei Chen
  • Patent number: 7618249
    Abstract: A molding system for provided which is configured for molding a substrate comprising a plurality of individual carriers each of which is pre-cut into a shape of a memory card device and connected to a frame of the substrate by narrow tie bars. A molding plate is configured to receive the substrate, and a cavity plate configured to be clamped to the molding plate further comprises a plurality of molding cavities each constructed in the shape of the said carriers. The cavities are operative to create molded packages onto the carrier conforming to a shape of the memory card device without need for further forming of the molded compound after molding. Additionally, a nozzle on the surface of each cavity is operative to introduce molding material into the cavity in a direction that is substantially perpendicular to a plane of the substrate placed on the molding plate.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: November 17, 2009
    Assignee: ASM Technology Singapore Pte Ltd.
    Inventors: Lap Yu Chan, Chun Yu Li, Si Liang Lu, Teng Hock Eric Kuah
  • Publication number: 20080075802
    Abstract: A molding system for provided which is configured for molding a substrate comprising a plurality of individual carriers each of which is pre-cut into a shape of a memory card device and connected to a frame of the substrate by narrow tie bars. A molding plate is configured to receive the substrate, and a cavity plate configured to be clamped to the molding plate further comprises a plurality of molding cavities each constructed in the shape of the said carriers. The cavities are operative to create molded packages onto the carrier conforming to a shape of the memory card device without need for further forming of the molded compound after molding. Additionally, a nozzle on the surface of each cavity is operative to introduce molding material into the cavity in a direction that is substantially perpendicular to a plane of the substrate placed on the molding plate.
    Type: Application
    Filed: September 22, 2006
    Publication date: March 27, 2008
    Inventors: Lap Yu Chan, Chun Yu Li, Si Liang Lu, Teng Hock Eric Kuah
  • Patent number: 6467368
    Abstract: A hand operated bicycle gear transmission device. The device includes a handle bar fixing base, a cover fixing base, a rubber cover, a positioning plate, positioning protuberances, saucer shaped springs, a circular fixing hole for a steel cable head, a steel cable guide groove and a stroke compensating device. The device utilizes cooperative function of positioning recessed slots formed around a rigid positioning plate. The positioning protuberances are provided at the rear of the cover fixing base and the saucer shaped springs are adjacent to the positioning plate to provide mutual engagement force therebetween so as to achieve an excellent positioning effect of gear transmission even under the worst riding environment. As a result, the device can be conveniently operable with a small applied force to perform speed change smoothly, the device having a simplified and easy looking appearance constructed with a small number of components, and being able to easily be assembled and repaired.
    Type: Grant
    Filed: August 3, 1999
    Date of Patent: October 22, 2002
    Assignee: National Science Council of Republic of China
    Inventors: Chan-Hua Feng, Chun-Yu Li