Abstract: Integrated circuit (IC) chips and seal ring structures are provided. An IC chip according to the present disclosure includes a substrate that has a device region and a ring region surrounding the device region, an interconnect structure disposed on the substrate, a first passivation layer disposed over the interconnect structure, a first contact via ring embedded in the first passivation layer, a first contact pad ring disposed on the first contact via ring and the first passivation layer, a second passivation layer disposed over the first contact pad ring, and a polymer layer disposed on a portion of the second passivation layer. The first contact via ring and the first contact pad ring completely surround the device region.

Abstract: A semiconductor structure according to the present disclosure includes a circuit region disposed over a substrate and a seal ring region disposed over the substrate and completely surrounding the circuit region. The circuit region includes first fins, second fins, n-type epitaxial structures over the first fins, and p-type epitaxial structures over the second fins. The seal ring region includes fin rings extending completely around the circuit region, epitaxial rings disposed over and extending parallel to the fin rings. All of the epitaxial rings over all of the fin rings in the seal ring region are p-type epitaxial rings.

Abstract: A method and an apparatus related to sentence generation are provided. In the method, a known token is determined based on a first sentence. A second sentence is determined based on the known token and a first masked token through a language model. The first masked token and the known token are inputted into the language model, to determine a first predicted token corresponding to the first masked token. The language model is trained based on an encoder of a bidirectional transformer. A second masked token is inserted when the determined result of the first predicted token is determined. The second masked token is inputted into the language model, to determine a second predicted token corresponding to the second masked token. The second sentence includes the first predicted token, the second predicted token and the known token. The second sentence is a sentence to respond to the first sentence.

Abstract: A vehicle lighting control circuit box is provided, including a case member, a circuit unit, at least one cover member and a positioning assembly. The case member is a metal member and extends along a longitudinal direction, the case member defines a receiving space, and two ends of the case member on the longitudinal direction respectively have an opening communicating with the receiving space. The circuit unit is received in the receiving space. Each of the at least one cover member covers one of the two openings. The positioning assembly is disposed on the case member to position the circuit unit within the receiving space to make the circuit unit contact with the case member.

Abstract: The present invention relates to solid forms of a substituted benzoxaborole compound, specifically crystalline forms of a compound of formula I, compositions comprising crystalline forms of the compound of formula (I), and methods of their use.

Abstract: A method for providing driving assistance based on a HD map includes acquiring information such as position of a vehicle and timing, and acquiring a speed of the vehicle based on the manner of driving, and acquiring distance an intersection in front of the vehicle and information from a HD map such as traffic light intersection ahead. Deciding such as whether the vehicle can pass through the intersection based on the speed of the vehicle, intersection distance, and the traffic light information and prompting and/or controlling the vehicle if it is determined that passage through is not possible. A vehicle-mounted apparatus applying the method is also disclosed.

Abstract: A semiconductor structure includes a substrate, a circuit region, and a seal ring surrounding the circuit region. The circuit region includes two first source/drains, first semiconductor layers connecting the two first source/drains, and a first gate disposed between the two first source/drains and wrapping around each of the first semiconductor layers. The seal ring includes two epitaxially grown semiconductor structures, second semiconductor layers, third semiconductor layers, and a second gate. The second and the third semiconductor layers are alternately stacked one over another to form a stack of layers. A topmost layer of the stack is one of the third semiconductor layers. The second gate is disposed between the two epitaxially grown semiconductor structures and above the topmost layer of the stack. The first and the third semiconductor layers include a first semiconductor material. The second semiconductor layers include a second semiconductor material different from the first semiconductor material.

Abstract: The present disclosure relates to methods and apparatus for graphics processing. For example, disclosed techniques facilitate improving bindless state processing at a graphics processor. Aspects of the present disclosure can receive, at a graphics processor, a shader program including a preamble section and a main instructions section. Aspects of the present disclosure can also execute, with a scalar processor dedicated to processing preamble sections, instructions of the preamble section to implement a bindless mechanism for loading constant data associated with the shader program. Additionally, aspects of the present disclosure can distribute the main instructions section and the constant data to a streaming processor for executing the shader program.

Abstract: An optoelectronic semiconductor device includes a substrate, a first type semiconductor structure, a second type semiconductor structure, an active structure and a contact structure. The first type semiconductor structure is located on the substrate and has a first protrusion part with a first thickness and a platform part with a second thickness. The second type semiconductor structure is located on the first type semiconductor structure. The active structure is between the first type semiconductor structure and the second type semiconductor structure. The contact structure is disposed between the first type semiconductor structure and the substrate. The second thickness of the platform part is in a range of 0.01 ?m to 1 ?m.

Abstract: Integrated circuit (IC) chips and seal ring structures are provided. An IC chip according to the present disclosure includes a device region, an inner ring surrounding the device region, an outer ring surrounding the inner ring, a first corner area between an outer corner of the inner ring and an inner corner of the outer ring, and a second corner area disposed at an outer corner of the outer ring. The first corner area includes a first active region including a channel region and a source/drain region, a first gate structure over the channel region of the first active region, and a first source/drain contact over the source/drain region of the first active region. The first source/drain contact continuously extends from a first edge of the first corner area to a second edge of the first corner area.

Abstract: A semiconductor device includes a semiconductor stack, a third semiconductor structure, a dielectric layer, and a reflective layer under the third semiconductor structure. The semiconductor stack includes a first semiconductor structure, an active structure, a second semiconductor structure. The first semiconductor structure has a first surface which includes a first portion and a second portion, and the first surface has a first area. The third semiconductor structure connects to the first portion, and has a second surface with a second area. The dielectric layer connects to the second portion and includes a plurality of openings, and the plurality of openings have a third area. A ratio of the second area to the first area is between 0.1˜0.7, and a ratio of the third area to the first area is less than 0.2.

Abstract: The invention relates to processes for preparing benzoprostacyclin analogues and intermediates prepared from the process, and the benzoprostacyclin analogues prepared therefrom. The invention also relates to cyclopentenone intermediates in racemic or optically active form.

Abstract: The present invention discloses a bone void filler and a method for manufacturing the same by natural calcium-containing waste, which comprises steps of mixing 5-20 wt % of a calcium-containing waste powder, 5-20 wt % of acetic acid and a remaining weight percentage of water uniformly to obtain a mixing solution; adding 5-20 vol % of a diammonium hydrogen phosphate solution to the mixing solution to obtain a suspension; controlling a pH value of the suspension to obtain an alkaline solution; leaving the alkaline solution at room temperature for precipitation for 0.1 to 72 hours, centrifuging or suction filtrating the alkaline solution to obtain a precipitate, drying and grinding the precipitate to obtain hydroxyapatite; and mixing 30-60 wt % of a pore former and 30-60 wt % of the hydroxyapatite and a remaining weight percentage of a binder uniformly to form a mixture, compression molding the mixture in a mold and sintering the compression-molded mixture.

Abstract: The present disclosure relates to methods and devices for graphics processing including an apparatus, e.g., a GPU. The apparatus may generate a table including a plurality of entries to store data associated with at least one of a constant value or an immediate value. The apparatus may also process, upon generating the table, first data including at least one of a constant value or an immediate value. Further, the apparatus may store, in the generated table, at least one of the constant value or the immediate value of the first data. The apparatus may also transmit, upon storing at least one of the constant value or the immediate value in the table, the table including the stored at least one of the constant value or the immediate value of the first data.

Abstract: A method for manufacturing a bending-tolerant multilayered flexible circuit board (FPC) suitable for use in a disposable biosensor chip includes manufacturing and bending a single-sided FPC. The single-sided FPC includes a base layer, a wiring layer, and through holes. The wiring layer includes first and second wiring areas. A first bending area is formed between each first wiring area and the corresponding second wiring area, the through holes forming an easy bending line. The second wiring area is bent relative to the first wiring area along the bending line to obtain the multilayered FPC.

Abstract: An electronic device with a heat-dissipation structure is provided. The electronic device includes a housing, a heat-dissipation member, and a restriction member. The housing includes a first sidewall and a second sidewall. The first sidewall includes a first sidewall connection portion. The second sidewall includes a second sidewall connection portion. The heat-dissipation member includes a heat-dissipation member connection portion that is detachably connected to the first sidewall connection portion. The first sidewall connection portion restricts the freedom of movement of the heat-dissipation member connection portion in a first direction. The restriction member is disposed on the heat-dissipation member. The restriction member is wedged into the second sidewall connection portion. The second sidewall connection portion restricts the freedom of movement of the restriction member in the first direction.

Abstract: Disclosed is a disassembling tool for a secondary battery. The disassembling tool includes a first rotation member configured to be rotatable and to allow a nut to be coupled thereto; a connection shaft coupled to the first rotation member; a second rotation member coupled to the connection shaft to transmit a rotational force to the connection shaft; and a housing, in which the connection shaft is disposed. The housing is inclined with respect to a virtual horizontal line parallel to a ground surface.

Abstract: A bendable antenna is provided. The bendable antenna is adapted to connect a cable. The bendable antenna includes an antenna body, a connection base, a first pivot base, a second pivot base, a first elastic element and a first restriction structure. The connection base is connected to the antenna body. The first pivot base is connected to the connection base, wherein the first pivot base includes a first recess. The second pivot base pivots on the first pivot base. The first elastic element is disposed in the first recess of the first pivot base, wherein the first elastic element is telescoped on the cable. The first restriction structure is connected to the connection base, wherein the first restriction structure pushes the first elastic element to restrict the first elastic element in the first recess.

Abstract: A luminescent material includes a particle of an irregular shape. The particle of an irregular shape includes a core of an irregular shape and quantum dots. The quantum dots distribute on the core.

Abstract: An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.